1. Different adhesive approaches for the bonding of a new universal resin cement to a disilicate glass‐ceramic.
- Author
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Detogni, Anna Caroliny, Araújo‐Neto, Vitaliano Gomes, Lima, Renally Bezerra Wanderley, and Sinhoreti, Mário Alexandre Coelho
- Subjects
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DENTAL bonding , *MEDICAL protocols , *DATA analysis , *RESEARCH funding , *SYNTHETIC gums & resins , *DENTAL cements , *HYDROFLUORIC acid , *DESCRIPTIVE statistics , *DENTAL metallurgy , *DENTAL acid etching , *ANALYSIS of variance , *STATISTICS , *DENTAL glass ionomer cements - Abstract
This study aimed to evaluate the shear bond strength (SBS) when bonding a universal resin cement to a disilicate glass‐ceramic using different adhesive protocols. Sixty specimens were etched with 10% hydrofluoric acid (HF) for 20 s and assigned to one of four treatment protocols (n = 15): The Positive control protocol comprised use of a universal adhesive system + adhesive resin cement; the Test1 protocol comprised use of a new universal adhesive system + universal resin cement; the Test2 protocol comprised use of a silane coupling agent + universal resin cement; and the use of a universal resin cement without adhesive and silane served as the Negative control. One of the two resin cement cylinders built on each specimen in each group was used to test for 24‐h SBS, while the other was thermocycled and then tested for SBS. Data were submitted to two‐way ANOVA, Tukey's test, and Weibull analysis. The negative control (24 h) showed the lowest SBS mean value. The Test2 protocol resulted in the highest SBS mean value after thermocycling. Adhesive and mixed failures were prevalent in all groups. No statistical difference in m values was observed among the groups at 24 h. After thermocycling, the two Test protocols showed the highest m values. The m values were significantly lower after thermocycling than at 24 h for all groups. After thermal aging, The Test2 protocol resulted in a statistically significantly higher SBS mean value after thermal aging than seen for the other groups. [ABSTRACT FROM AUTHOR]
- Published
- 2024
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