40 results on '"Schlottig, Gerd"'
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2. Industrial approach to the chip and package reliability of SiC MOSFETs (Invited)
3. A novel method of energy efficient hotspot-targeted embedded liquid cooling for electronics: An experimental study
4. Energy efficient hotspot-targeted embedded liquid cooling of electronics
5. On the Thermal Management of 3D ‐ ICs : From Backside to Volumetric Heat Removal
6. Microfluidic Interposer for High Performance Fluidic Chip Cooling
7. Dual-Side Heat Removal by Silicon Cold Plate and Interposer With Embedded Fluid Channels
8. Thermally Conductive Composite Material With Percolating Microparticles Applied as Underfill
9. Thermal performance of a silicon-interposer with embedded fluid channels enabling dual-side heat removal
10. Direct investigation of microparticle self-assembly to improve the robustness of neck formation in thermal underfills
11. Erratum: “Review on Percolating and Neck-Based Underfills for Three-Dimensional Chip Stacks” [ASME J. Electron. Packag., 2016, 138(4), p. 041009; DOI: 10.1115/1.4034927]
12. Review on Percolating and Neck-Based Underfills for Three-Dimensional Chip Stacks
13. Dual-side heat removal by micro-channel cold plate and silicon-interposer with embedded fluid channels
14. All-Copper Flip Chip Interconnects by Pressureless and Low Temperature Nanoparticle Sintering
15. Re-building the Underfill: Performance of percolating fillers at package scale
16. Master curve synthesis by effective viscoelastic plastic material modeling
17. Benchmarking Study on the Thermal Management Landscape for Three-Dimensional Integrated Circuits: From Back-Side to Volumetric Heat Removal
18. Lid-Integral Cold-Plate Topology: Integration, Performance, and Reliability
19. Benchmarking Study on the Thermal Management Landscape for 3D ICs: From Back-Side to Volumetric Heat Removal
20. Lid-Integral Cold Plate Topology Integration, Performance, and Reliability
21. Nanoparticle assembly and sintering towards all-copper flip chip interconnects
22. Review of percolating and neck-based underfills with thermal conductivities up to 3 W/m-K.
23. Enhanced Electrical and Thermal Interconnects by the Self-Assembly of Nanoparticle Necks Utilizing Capillary Bridging
24. Thermal power plane enabling dual-side electrical interconnects for high-performance chip stacks: Implementation
25. Thermal characterization of percolating thermal underfills: Bulk and cavity
26. Thermal power plane enabling dual-side electrical interconnects for high-performance chip stacks: Concept
27. Study of the compound of properties of percolating and neck-based thermal underfills
28. Thermo-mechanical properties of underfills at partial and full filler percolation - sub-layering the underfill
29. Sequentially formed underfills: Thermo-mechanical properties of underfills at full filler percolation
30. Integration of intra chip stack fluidic cooling using thin-layer solder bonding
31. Hybrid porous media and fluid domain modeling strategy to optimize a novel staggered fin heat sink design
32. Enhanced Electrical and Thermal Interconnects by the Self-Assembly of Nanoparticle Necks Utilizing Capillary Bridging
33. Investigation of novel solder patterns for power delivery and heat removal support
34. Formulation of Percolating Thermal Underfills Using Hierarchical Self-Assembly of Microparticles and Nanoparticles by Centrifugal Forces and Capillary Bridging
35. Directed self-assembly of nanoparticles for novel electrical interconnects
36. A multivariate parameter analysis of copper pillars eases the design of denser interconnects
37. Interfacial strength of Silicon-to-Molding Compound changes with thermal residual stress
38. How to fabricate specimens for silicon-to-molding compound interface adhesion measurements
39. Induced delamination of silicon-molding compound interfaces
40. (Invited) Wafer-Level Integration of Embedded Cooling Approaches
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