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We report generation of ultra-broadband longitudinal acoustic coherent phonon wavepackets in SrTiO3 (STO) with frequency components extending throughout the first Brillouin zone. The wavepackets are efficiently generated in STO using femtosecond infrared laser excitation of an atomically flat 1.6 nm-thick epitaxial SrRuO3 film. We use femtosecond x-ray diffraction at the European X-Ray Free Electron Laser Facility to study the dispersion and damping of phonon wavepackets. The experimentally determined damping constants for multi-THz frequency phonons compare favorably to the extrapolation of a simple ultrasound damping model over several orders of magnitude. [ABSTRACT FROM AUTHOR]

A simple, yet physically intuitive macrolevel model is presented to identify the dominant substrate coupling mechanism at the early stages of the design process, while simultaneously considering multiple parameters. Furthermore, the sensitivity of substrate noise to these parameters is evaluated, demonstrating the nonmonotonic dependence of noise on rise time. The design implications of the proposed analysis are discussed, identifying the preferred noise reduction technique for a specific set of operating points. [ABSTRACT FROM AUTHOR]

A methodology is proposed to efficiently analyze substrate noise coupled to a sensitive block due to an aggressor digital block in large-scale mixed-signal circuits. The methodology is based on identifying voltage domains on the substrate by exploiting the small spatial voltage differences on the ground distribution network of the aggressor circuit. Specifically, similarly biased regions on the substrate short-circuited by the ground network are determined, and each of these regions is represented by a single equivalent input port to the substrate. The remaining ports within that domain are ignored to reduce the computational complexity of the extraction process. An algorithm with linear time complexity is proposed to merge those substrate contacts exhibiting a voltage difference smaller than a specified value, identifying a voltage domain. An equivalent contact is placed at the geometric mean of the merged contacts, ignoring all of the remaining ports such as the source/drain junctions of the devices. The ground network impedance is updated for each merged contact based on the proposed algorithm to maintain sufficient accuracy of the noise voltage. The substrate with reduced input ports is extracted using an existing extraction tool to analyze the noise at the sense node. As compared to the full extraction of an aggressor circuit, the methodology achieves a reduction of more than four orders of magnitude in the number of extracted substrate resistors with a peak-to-peak error of 24%. [ABSTRACT FROM AUTHOR]

A distributed on-chip decoupling capacitor network is proposed in this paper. A system of distributed on-chip decoupling capacitors is shown to provide an efficient solution for providing the required on-chip decoupling capacitance under existing technology constraints. In a system of distributed on-chip decoupling capacitors, each capacitor is sized based on the parasitic impedance of the power distribution grid. Various tradeoffs in a system of distributed on-chip decoupling capacitors are also discussed. Related simulation results for typical values of on-chip parasitic resistance are also presented. The worst case error is 0.003% as compared to SPICE. [ABSTRACT FROM AUTHOR]

This paper describes theoretical and experimental data characterizing the sensitivity of nMOS and CMOS digital circuits to substrate coupling in mixed-signal, smart-power systems. The work presented here focuses on the noise effects created by high-power analog circuits and affecting sensitive digital circuits on the same integrated circuit. The sources and mechanism of the noise behavior of such digital circuits are identified and analyzed. The results are obtained primarily from a set of dedicated test circuits specifically designed, fabricated, and evaluated for this work. The conclusions drawn from the theoretical and experimental analyses are used to develop physical and circuit design techniques to mitigate the substrate noise problems. These results provide insight into the noise immunity of digital circuits with respect to substrate coupling. Index Terms—Noise; smart-power; substrate coupling. [ABSTRACT FROM AUTHOR]

We report generation of ultra-broadband longitudinal acoustic coherent phonon wavepackets in SrTiO3 (STO) with frequency components extending throughout the first Brillouin zone. The wavepackets are efficiently generated in STO using femtosecond infrared laser excitation of an atomically flat 1.6 nm-thick epitaxial SrRuO3 film. We use femtosecond x-ray diffraction at the European X-Ray Free Electron Laser Facility to study the dispersion and damping of phonon wavepackets. The experimentally determined damping constants for multi-THz frequency phonons compare favorably to the extrapolation of a simple ultrasound damping model over several orders of magnitude. [ABSTRACT FROM AUTHOR]