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Abstract Engineering in vacuum or under a protective atmosphere permits the production of materials, wherever the absence of oxygen is an essential demand for a successful processing. However, very few studies have provided quantitative evidence of the effect of oxidized surfaces to tribological properties. In the current study on 99.99% pure copper, it is revealed that tribo-oxidation and the resulting increased abrasive wear can be suppressed by processing in an extreme high vacuum (XHV) adequate environment. The XHV adequate atmosphere was realized by using a silane-doped shielding gas (1.5 vol% SiH4 in argon). To analyse the influence of the ambient atmosphere on the tribological and mechanical properties, a ball—disk tribometer and a nanoindenter were used in air, argon, and silane-doped argon atmosphere for temperatures up to 800 °C. Resistance measurements of the resulting coatings were carried out. To characterize the microstructures and the chemical compositions of the samples, the scanning electron microscopy (SEM), energy-dispersive X-ray spectroscopy (EDS), and X-ray diffraction (XRD) were used. The investigations have revealed a formation of η-Cu3Si in silane-doped atmosphere at 300 °C, as well as various intermediate stages of copper silicides. At temperatures above 300 °C, the formation of γ-Cu5Si were detected. The formation was linked to an increase in hardness from 1.95 to 5.44 GPa, while the Young’s modulus increased by 46% to 178 GPa, with the significant reduction of the wear volume by a factor of 4.5 and the suppression of further oxidation and susceptibility of chemical wear. In addition, the relevant diffusion processes were identified using molecular dynamics (MD) simulations.

Downsized and complex micro-machining structures have to meet quality requirements concerning geometry and convince through increasing functionality. The development and use of cutting tools in the sub-millimeter range can meet these demands and contribute to the production of intelligent components in biomedical technology, optics or electronics. This article addresses the development of double-edged micro-cutters, which consist of a two-part system of cutter head and shaft. The cutting diameters are between 50 and 200 μm. The silicon carbide cutting heads are manufactured from the solid material using microsystem technology. The substrate used can be structured uniformly via photolithography, which means that 5200 homogeneous micro-milling heads can be produced simultaneously. This novel batch approach represents a contrast to conventionally manufactured micro-milling cutters. The imprint is taken by means of reactive ion etching using a mask made of electroplated nickel. Within this dry etching process, characteristic values such as the etch rate and flank angle of the structures are critical and will be compared in a parameter analysis. At optimal parameters, an anisotropy factor of 0.8 and an etching rate of 0.34 µm/min of the silicon carbide are generated. Finally, the milling heads are diced and joined. In the final machining tests, the functionality is investigated and any signs of wear are evaluated. A tool life of 1500 mm in various materials could be achieved. This and the milling quality achieved are in the range of conventional micro-milling cutters, which gives a positive outlook for further development.