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2 results on '"Shao-Ning Pu"'

1. Crosstalk prediction of single- and double-walled carbon-nanotube (SWCNT/DWCNT) bundle interconnects

Author

Shao-Ning Pu, Wen-Yan Yin, Jun-Fa Mao, and Qing H. Liu

Subjects
Copper -- Electric properties, Copper -- Mechanical properties, Voltage -- Evaluation, Nanotubes -- Structure, Nanotubes -- Electric properties, Business, Electronics, Electronics and electrical industries
Abstract

The crosstalk effects in single- and double-walled carbon-nanotube (SWCNT and DWCNT) bundle-interconnect architectures are examined. The studies have shown that, compared with the SWCNT bundle, the DWCNT bundle interconnect has led to a reduction of crosstalk-induced time delay, while the peak voltage of the crosstalk-induced glitch in SWCNT and DWCNT bundle interconnects is in the same order as that of Cu wires.

Published
2009

2. Crosstalk Prediction of Single- and Double-Walled Carbon-Nanotube (SWCNT/DWCNT) Bundle Interconnects

Author

Jun-Fa Mao, Qing Huo Liu, Wen-Yan Yin, and Shao-Ning Pu

Subjects
Capacitive coupling, Interconnection, Materials science, business.industry, Capacitive sensing, Nanotechnology, Carbon nanotube, Integrated circuit, Capacitance, Electronic, Optical and Magnetic Materials, law.invention, law, Bundle, Optoelectronics, Equivalent circuit, Electrical and Electronic Engineering, business
Abstract

The crosstalk effects in single- and double-walled carbon-nanotube (SWCNT and DWCNT) bundle-interconnect architectures are investigated in this paper. Some modified equivalent-circuit models are proposed for both SWCNT and DWCNT bundles, where capacitive couplings between adjacent bundles are incorporated. These circuit models are further used to predict the performance of SWCNT and DWCNT bundle interconnects in comparison with the Cu wire counterpart at all interconnect levels for advanced future technology generations. It is found that, compared with the SWCNT bundle, the DWCNT bundle interconnect can lead to a reduction of crosstalk-induced time delay, which will be more significant with increasing bundle length, while the peak voltage of the crosstalk-induced glitch in SWCNT and DWCNT bundle interconnects is in the same order as that of Cu wires. Due to the improvement in time delay, it is numerically confirmed that the DWCNT bundle interconnect will be more suitable for the next generation of interconnect technology as compared with the SWCNT bundle counterpart.

Published
2009

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