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Many of the challenges in improving operational processes in wafer fabrication, such as throughput and on-time delivery, can be impacted by scheduling. While individual area predictive scheduling can provide significant benefit, especially for bottleneck tool sets, coordinated multiple area scheduling on top of individual area scheduling can address all of the challenges from a fab-wide optimized perspective. Thus we must leverage the technology of a predictive area scheduler into a fab-wide coordinated WIP optimization solution. In this coordinated solution the area predictive schedulers draw from the same set of scheduling services to achieve area objectives. These objectives are governed by a higher layer fab-level WIP management plan that determines how individual areas should be optimized to support overall fab scheduling objectives. In considering the implementation plan for predictive scheduling, the bottleneck process, which is oftentimes lithography, has been targeted first. As we expand the scheduling solution, we must focus on other potential bottleneck processes, and also look at processes that interact with the bottleneck process. The predictive multi-area scheduling and WIP optimization approach presented provides a framework for addressing individual area predictive scheduling as part of a coordinated effort to optimize scheduling to achieve fab-wide objectives.

International audience; This paper presents a brief overview of semiconductor manufacturing followed by the results of a panel session held at the Fourth International Conference on Modeling and Analysis of Semiconductor Manufacturing (MASM) in Miami, December 10, 2008 on the role of modelling and analysis in semiconductor manufacturing in a shrinking world. Three participants are from Asia, two from Europe, and two from the USA in addition to the two panel organisers (Fowler and Mönch). At least one panellist from each continent is from industry and one from academia. The statements of the panellists from industry relate to modelling and analysis problems found in their own companies. Those of the academic panellists describe the role that modelling and analysis has played and is expected to play in their semiconductor manufacturing research. Their views on the challenges and successes of modelling and analysis in a globalised world are also included. Finally, we identify some future research challenges for semiconductor manufacturing.

International audience