1. Microstructural evolution during high-temperature tensile creep at 1,500°C of a MoSiBTiC alloy
- Author
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Kyosuke Yoshimi, Sadahiro Tsurekawa, Shiho Yamamoto Kamata, and Sojiro Uemura
- Subjects
Technology ,Microstructural evolution ,Materials science ,microstructure ,Alloy ,Chemicals: Manufacture, use, etc ,chemistry.chemical_element ,TP1-1185 ,02 engineering and technology ,engineering.material ,01 natural sciences ,dynamic recrystallization ,molybdenum ,0103 physical sciences ,Ultimate tensile strength ,General Materials Science ,Physical and Theoretical Chemistry ,010302 applied physics ,Materials processing ,dynamic recovery ,Chemical technology ,Metallurgy ,TP200-248 ,021001 nanoscience & nanotechnology ,Condensed Matter Physics ,Microstructure ,chemistry ,Creep ,Mechanics of Materials ,Molybdenum ,Dynamic recrystallization ,engineering ,high-temperature deformation ,0210 nano-technology - Abstract
Microstructural evolution in the TiC-reinforced Mo–Si–B-based alloy during tensile creep deformation at 1,500°C and 137 MPa was investigated via scanning electron microscope-backscattered electron diffraction (SEM-EBSD) observations. The creep curve of this alloy displayed no clear steady state but was dominated by the tertiary creep regime. The grain size of the Moss phase increased in the primary creep regime. However, the grain size of the Moss phase was found to remarkably decrease to ss phase occurred by continuous dynamic recrystallization including the transformation of low-angle grain boundaries to high-angle grain boundaries. Accordingly, the deformation of this alloy is most likely to be governed by the grain boundary sliding and the rearrangement of Moss grains such as superplasticity in the tertiary creep regime. In addition, the refinement of the Moss grains surrounding large plate-like T2 grains caused the rotation of their surfaces parallel to the loading axis and consequently the cavitation preferentially occurred at the interphases between the end of the rotated T2 grains and the Moss grains.
- Published
- 2020
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