158 results on '"Shima, Akio"'
Search Results
2. Non-destructive detection of sub-micrometer-sized micropipes in silicon carbide using mirror electron microscope.
3. Expansion of beam width in exposure and crystal structure beamline (BL09) of SAGA-LS and applications using expanded beams
4. Comparative study of mechanical stress-induced flat-band voltage change in MOS capacitor and threshold voltage change in MOSFET fabricated on 4H-SiC (0001)
5. First Demonstration of Trench-shaped 6.5-kV n-channel SiC IGBT with Trench-etched Double-diffused MOS (TED-MOS) Structure
6. Modeling and Evaluation of Stacking Fault Expansion Velocity in Body Diodes of 3.3 kV SiC MOSFET
7. Power Loss Reduction of N-Channel 10-kV SiC IGBTs With Box Cell Layout
8. Three-dimensional micro-X-ray topography using focused sheet-shaped X-ray beam
9. In-operando x-ray topography analysis of SiC metal–oxide–semiconductor field-effect transistors to visualize stacking fault expansion motions dynamically during operations.
10. Development of Wide-JFET Trench-Etched Double-Diffused MOS (TED-MOS) for High-Voltage Applications
11. Mechanism of Maximum-Current Limitation for 10-kV SiC-IGBT Module by Analyzing Surge Current Test Result
12. Thin-drift-layer n-channel 4H-SiC IGBT with low switching loss and switching ringing reduction
13. Impact of Cell Layout on On-state and Dynamic Characteristics of N-channel SiC IGBTs
14. Nucleation sites of expanded stacking faults detected by in operando x-ray topography analysis to design epitaxial layers for bipolar-degradation-free SiC MOSFETs
15. Advanced X-ray imaging at beamline 07 of the SAGA Light Source
16. Device design to achieve low loss and high short-circuit capability for SiC Trench MOSFET
17. Enhancement of drain current in planar MOSFETs by dopant profile engineering using nonmelt laser spike annealing
18. Ultrashallow junction formation by self-limiting LTP and its application to sub-65-nm node MOSFETs
19. A model for the segregation and pileup of boron at the Si02/Si interface during the formation of ultrashallow p+ junctions
20. Dependence of humidity-stress impact on passivation film for edge termination area in 4H-SiC diodes
21. Design of a DC-DC Converter using SiC Trench MOSFETs for EV Fast Chargers
22. Analysis of channel properties at extremely high temperature in 3.3-kV SiC trench-etched double diffused MOS (TED-MOS®) using temperaturesensitive electrical parameters (TSEPs)
23. Investigation of interface state density near conduction band edge of 4H-SiC MOSFET based on inversion capacitance and drain-current characteristics
24. 1.2 kV silicon carbide Schottky barrier diode embedded MOSFETs with extension structure and titanium-based single contact
25. 4H-SiC CMOS Transimpedance Amplifier of Gamma-Irradiation Resistance Over 1 MGy
26. Comparison of Extremely High-Temperature Characteristics of Planar and Three- Dimensional SiC MOSFETs
27. D it control during heating and cooling steps of dry oxidation for reliable gate insulator in SiC MOSFETs
28. Device Design Consideration for Robust SiC VDMOSFET With Self-Aligned Channels Formed by Tilted Implantation
29. Fabrication and Characterization of 3.3-kV SiC DMOSFET with Self-Aligned Channels Formed by Tilted Ion Implantation
30. Impact of Interface Trap Density of SiC-MOSFET in High-Temperature Environment
31. 1.2-kV SiC Trench-Etched Double-Diffused MOS (TED-MOS)
32. Improved Offset Voltage Stability of 4H-SiC CMOS Operational Amplifier by Increasing Gamma Irradiation Resistance
33. Improvement of Switching Characteristics in 6.5-kV SiC IGBT with Novel Drift Layer Structure
34. Analysis of Degradation Phenomena in Bipolar Degradation Screening Process for SiC-MOSFETs
35. The Performance of Operational Amplifiers Consisting of 4H-SiC CMOS After Gamma Irradiation
36. Inducing defects in 3.3 kV SiC MOSFETs by annealing after ion implantation and evaluating their effect on bipolar degradation of the MOSFETs
37. Failure of Switching Operation of SiC-MOSFETs and Effects of Stacking Faults on Safe Operation Area
38. Two Mechanisms of Charge Accumulation in Edge Termination of 4H-SiC Diodes Caused by High-Temperature Bias Stress and High-Temperature and High-Humidity Bias Stress
39. Impact of Cell Layout and Device Structure on On-Voltage Reduction of 6.5-kV n-Channel SiC IGBTs
40. Switching Reliability of SiC-MOSFETs Containing Expanded Stacking Faults
41. Investigation of Forward Voltage Degradation due to Process-Induced Defects in 4H-SiC MOSFET
42. Electrical Characterization of the Operational Amplifier Consisting of 4H-SiC MOSFETs after Gamma Irradiation
43. Oxygen Pressure Controlled Oxidation for Gate Insulator Process of SiC MOSFETs
44. Evaluation of gate oxide reliability in 3.3 kV 4H-SiC DMOSFET with J-Ramp TDDB methods
45. Robustness improvement of short-circuit capability by SiC trench-etched double-diffused MOS (TED MOS)
46. Analysis of short-circuit break-down point in 3.3 kV SiC-MOSFETs
47. Fabrication of 4H-SiC PiN diodes without bipolar degradation by improved device processes
48. Analysis of high reverse currents of 4H-SiC Schottky-barrier diodes
49. Effect of trench structure on reverse characteristics of 4H-SiC junction barrier Schottky diodes
50. A model for the segregation and pileup of boron at the SiO[sub 2]/Si interface during the formation of ultrashallow p[sup +] junctions.
Catalog
Books, media, physical & digital resources
Discovery Service for Jio Institute Digital Library
For full access to our library's resources, please sign in.