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2. Non-destructive detection of sub-micrometer-sized micropipes in silicon carbide using mirror electron microscope.

9. In-operando x-ray topography analysis of SiC metal–oxide–semiconductor field-effect transistors to visualize stacking fault expansion motions dynamically during operations.

10. Development of Wide-JFET Trench-Etched Double-Diffused MOS (TED-MOS) for High-Voltage Applications

11. Mechanism of Maximum-Current Limitation for 10-kV SiC-IGBT Module by Analyzing Surge Current Test Result

15. Advanced X-ray imaging at beamline 07 of the SAGA Light Source

17. Enhancement of drain current in planar MOSFETs by dopant profile engineering using nonmelt laser spike annealing

18. Ultrashallow junction formation by self-limiting LTP and its application to sub-65-nm node MOSFETs

50. A model for the segregation and pileup of boron at the SiO[sub 2]/Si interface during the formation of ultrashallow p[sup +] junctions.

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