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85 results on '"Silva, Lucas F. M. da"'

2. Cohesive Properties of Bimaterial Interfaces in Semiconductors: Experimental Study and Numerical Simulation Using an Inverse Cohesive Contact Approach.

Author

Adler, Caio, Morais, Pedro, Akhavan-Safar, Alireza, Carbas, Ricardo J. C., Marques, Eduardo A. S., Karunamurthy, Bala, and Silva, Lucas F. M. da

Subjects
SEMICONDUCTOR junctions, COHESIVE strength (Mechanics), SEMICONDUCTOR design, COMPUTER simulation, INTERFACIAL stresses, SILICON oxide
Abstract

Examining crack propagation at the interface of bimaterial components under various conditions is essential for improving the reliability of semiconductor designs. However, the fracture behavior of bimaterial interfaces has been relatively underexplored in the literature, particularly in terms of numerical predictions. Numerical simulations offer vital insights into the evolution of interfacial damage and stress distribution in wafers, showcasing their dependence on material properties. The lack of knowledge about specific interfaces poses a significant obstacle to the development of new products and necessitates active remediation for further progress. The objective of this paper is twofold: firstly, to experimentally investigate the behavior of bimaterial interfaces commonly found in semiconductors under quasi-static loading conditions, and secondly, to determine their respective interfacial cohesive properties using an inverse cohesive zone modeling approach. For this purpose, double cantilever beam specimens were manufactured that allow Mode I static fracture analysis of the interfaces. A compliance-based method was used to obtain the crack size during the tests and the Mode I energy release rate ( G I c ). Experimental results were utilized to simulate the behavior of different interfaces under specific test conditions in Abaqus. The simulation aimed to extract the interfacial cohesive contact properties of the studied bimaterial interfaces. These properties enable designers to predict the strength of the interfaces, particularly under Mode I loading conditions. To this extent, the cohesive zone modeling (CZM) assisted in defining the behavior of the damage propagation through the bimaterial interfaces. As a result, for the silicon–epoxy molding compound (EMC) interface, the results for maximum strength and G I c are, respectively, 26 MPa and 0.05 N/mm. The second interface tested consisted of polyimide and silicon oxide between the silicon and EMC layers, and the results obtained are 21.5 MPa for the maximum tensile strength and 0.02 N/mm for G I c . This study's findings aid in predicting and mitigating failure modes in the studied chip packaging. The insights offer directions for future research, focusing on enhancing material properties and exploring the impact of manufacturing parameters and temperature conditions on delamination in multilayer semiconductors. [ABSTRACT FROM AUTHOR]

Published
2024
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6. Taper angle optimization of scarf repairs in carbon-epoxy laminates

Author

Campilho, Raul, Pinto, A. M. G., Moura, M. F. S. F. de, Mendes, Isabel R., Banea, Mariana D., Silva, Lucas F. M. da, and Repositório Científico do Instituto Politécnico do Porto

Subjects
Carbon-epoxy, Finite element analysis, Cohesive zone models, Composite, Repair
Abstract

The increasing use of Carbon-Fibre Reinforced Plastic (CFRP) laminates in high responsibility applications introduces an issue regarding their handling after damage. The availability of efficient repair methods is essential to restore the strength of the structure. The availability of accurate predictive tools for the repairs behaviour is also essential for the reduction of costs and time associated to extensive tests. This work reports on a numerical study of the tensile behaviour of three-dimensional (3D) adhesively-bonded scarf repairs in CFRP structures, using a ductile adhesive. The Finite Element (FE) analysis was performed in ABAQUS® and Cohesive Zone Models (CZM’s) was used for the simulation of damage in the adhesive layer. A parametric study was performed on two geometric parameters. The use of overlaminating plies covering the repaired region at the outer or both repair surfaces was also tested as an attempt to increase the repairs efficiency. The results allowed the proposal of design principles for repairing CFRP structures.

Published
2008

7. Analysis of Temperature Effect on Deformation Behaviour and Bond Strength of Adhesive Joints with Steel and Composite Substrates

Author

Nečasová, B., Liška, P., Šlanhof, J., Chaari, Fakher, Series Editor, Haddar, Mohamed, Series Editor, Kwon, Young W., Series Editor, Gherardini, Francesco, Series Editor, Ivanov, Vitalii, Series Editor, Cavas-Martínez, Francisco, Series Editor, Trojanowska, Justyna, Series Editor, Silva, Lucas F. M. da, editor, Adams, Robert D., editor, Sato, Chiaki, editor, and Dilger, Klaus, editor

Published
2021
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8. Use of UV-Curing Adhesive Systems on Non-transparent Joining Parts by Using Sidelight Activated Polymer Optical Fibres

Author

Seewald, R., Kallweit, J., Weiland, J., Schiebahn, A., Gries, T., Reisgen, U., Chaari, Fakher, Series Editor, Haddar, Mohamed, Series Editor, Kwon, Young W., Series Editor, Gherardini, Francesco, Series Editor, Ivanov, Vitalii, Series Editor, Cavas-Martínez, Francisco, Series Editor, Trojanowska, Justyna, Series Editor, Silva, Lucas F. M. da, editor, Adams, Robert D., editor, Sato, Chiaki, editor, and Dilger, Klaus, editor

Published
2021
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9. Techniques for the Mechanical Characterization and Numerical Modelling of Bonded Automotive Structures Under Impact Loads

Author

Marques, E. A. S., Nunes, P. D. P., Akhavan-Safar, A., Borges, C. S. P., Carbas, R. J. C., Machado, J. J. M., Parente, M. P. L., da Silva, L. F. M., Chaari, Fakher, Series Editor, Haddar, Mohamed, Series Editor, Kwon, Young W., Series Editor, Gherardini, Francesco, Series Editor, Ivanov, Vitalii, Series Editor, Cavas-Martínez, Francisco, Series Editor, Trojanowska, Justyna, Series Editor, Silva, Lucas F. M. da, editor, Adams, Robert D., editor, Sato, Chiaki, editor, and Dilger, Klaus, editor

Published
2021
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10. Development of an Elasto-plastic Meshless Technique to Analyse Bonded Structures

Author

Sánchez-Arce, I. J., Ramalho, L. D. C., Campilho, R. D. S. G., Belinha, J., Chaari, Fakher, Series Editor, Haddar, Mohamed, Series Editor, Kwon, Young W., Series Editor, Gherardini, Francesco, Series Editor, Ivanov, Vitalii, Series Editor, Cavas-Martínez, Francisco, Series Editor, Trojanowska, Justyna, Series Editor, Silva, Lucas F. M. da, editor, Adams, Robert D., editor, Sato, Chiaki, editor, and Dilger, Klaus, editor

Published
2021
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11. Ageing Condition Determination of Bonded Joints by Terahertz Spectroscopy

Author

Taiber, Jochen, Kahlmeyer, Martin, Winkel, Andreas, Stübling, Eva-Maria, Taleb, Fatima, Mikerov, Mikhail, Sommer, Stefan, Böhm, Stefan, Koch, Martin, Chaari, Fakher, Series Editor, Haddar, Mohamed, Series Editor, Kwon, Young W., Series Editor, Gherardini, Francesco, Series Editor, Ivanov, Vitalii, Series Editor, Cavas-Martínez, Francisco, Series Editor, Trojanowska, Justyna, Series Editor, Silva, Lucas F. M. da, editor, Adams, Robert D., editor, Sato, Chiaki, editor, and Dilger, Klaus, editor

Published
2021
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12. Novel Torsion Machine to Test Adhesive Joints

Author

Dantas, M. A., Carbas, R. J. C., Lopes, A. M., da Silva, C. M., Marques, E. A. S., da Silva, L. F. M., Chaari, Fakher, Series Editor, Haddar, Mohamed, Series Editor, Kwon, Young W., Series Editor, Gherardini, Francesco, Series Editor, Ivanov, Vitalii, Series Editor, Cavas-Martínez, Francisco, Series Editor, Trojanowska, Justyna, Series Editor, Silva, Lucas F. M. da, editor, Adams, Robert D., editor, Sato, Chiaki, editor, and Dilger, Klaus, editor

Published
2021
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13. Some Industrial Examples of Accelerated Curing Using Curie Particles

Author

Elmahdy, Ahmed, Van de Weyenberg, Isabel, Cosemans, Patrick, Adam, Michael, Voß, Morten, Heinrichs, Sascha, Vallée, Till, Chaari, Fakher, Series Editor, Haddar, Mohamed, Series Editor, Kwon, Young W., Series Editor, Gherardini, Francesco, Series Editor, Ivanov, Vitalii, Series Editor, Cavas-Martínez, Francisco, Series Editor, Trojanowska, Justyna, Series Editor, Silva, Lucas F. M. da, editor, Adams, Robert D., editor, Sato, Chiaki, editor, and Dilger, Klaus, editor

Published
2021
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