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We demonstrate graded AlGaN/GaN heterojunction bipolar transistors (HBTs) with selective injection of minority carriers across a p-GaN base and patterned regrown base contacts. The selective injection design regulates minority carrier transport under emitter-base forward bias through a thin base region, while thick and highly doped p$^+$ GaN regrown layers patterned alongside the thin base regions are utilized to lower the base contact resistance. With SiO$_2$ employed as a spacer between the emitter and the p$^+$ regrown layers, the device with an interdigitated emitter/base-contact stripe design displayed a maximum collector current density (I$_C$) of 101 kA/cm$^2$, a maximum current gain ($\beta$) of 70 at I$_C$ $\sim$ 1 kA/cm$^2$ and $\sim$ 11 for I$_C$ $>$ 50 kA/cm$^2$. The reported results demonstrate the potential of the selective injection approach to break the long-existing HBT design tradeoff between base resistance and current gain for next-generation radio frequency and mm-Wave applications.

${\beta}$-Ga${_2}$O${_3}$ based semiconductor devices are expected to have significantly improved high-power and high-temperature performance due to its ultra-wide bandgap of close to 5 eV. However, the high-temperature operation of these ultra-wide-bandgap devices is usually limited by the relatively low 1-2 eV built-in potential at the Schottky barrier with most high-work-function metals. Here, we report heterojunction p-NiO/n-${\beta}$-Ga${_2}$O${_3}$ diodes fabrication and optimization for high-temperature device applications, demonstrating a current rectification ratio of more than 10${^6}$ at 410{\deg}C. The NiO heterojunction diode can achieve higher turn-on voltage and lower reverse leakage current compared to the Ni-based Schottky diode fabricated on the same single crystal ${\beta}$-Ga${_2}$O${_3}$ substrate, despite charge transport dominated by interfacial recombination. Electrical characterization and device modeling show that these advantages are due to a higher built-in potential and additional band offset. These results suggest that heterojunction p-n diodes based on ${\beta}$-Ga${_2}$O${_3}$ can significantly improve high-temperature electronic device and sensor performance., Comment: 15 pages, 8 figures

We introduce a deep-recessed gate architecture in $\beta$-Ga$_2$O$_3$ delta-doped field effect transistors for improvement in DC-RF dispersion and breakdown properties. The device design incorporates an unintentionally doped $\beta$-Ga$_2$O$_3$ layer as the passivation dielectric. To fabricate the device, the deep-recess geometry was developed using BCl$_3$ plasma based etching at ~5 W RIE to ensure minimal plasma damage. Etch damage incurred with plasma etching was mitigated by annealing in vacuum at temperatures above 600 $\deg$C. A gate-connected field-plate edge termination was implemented for efficient field management. Negligible surface dispersion with lower knee-walkout at high V$_\mathrm{DS}$, and better breakdown characteristics compared to their unpassivated counterparts were achieved. A three terminal off-state breakdown voltage of 315 V, corresponding to an average breakdown field of 2.3 MV/cm was measured. The device breakdown was limited by the field-plate/passivation edge and presents scope for further improvement. This demonstration of epitaxially passivated field effect transistors is a significant step for $\beta$-Ga$_2$O$_3$ technology since the structure simultaneously provides control of surface-related dispersion and excellent field management.

In this paper, we report enhanced breakdown characteristics of Pt/BaTiO3/Al0.58Ga0.42N lateral heterojunction diodes compared to Pt/Al0.58Ga0.42N Schottky diodes. BaTiO3, an extreme dielectric constant material, has been used, in this study, as dielectric material under the anode to significantly reduce the peak electric field at the anode edge of the heterojunction diode such that the observed average breakdown field was higher than 8 MV/cm, achieved for devices with anode to cathode spacing less than 0.2 microns. Control Schottky anode devices (Pt/Al0.58Ga0.42N) fabricated on the same sample displayed an average breakdown field around 4 MV/cm for devices with similar dimensions. While both breakdown fields are significantly higher than those exhibited by incumbent technologies such as GaN-based devices, BaTiO3 can enable more effective utilization of the higher breakdown fields available in ultra-wide bandgap materials by proper electric field management. This demonstration thus lays the groundwork needed to realize ultra-scaled lateral devices with significantly improved breakdown characteristics.