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1. Fabrication of magnetic tunnel junctions connected through a continuous free layer to enable spin logic devices

5. Study of novel EUVL mask absorber candidates

6. All-Electrical Control of Scaled Spin Logic Devices Based on Domain Wall Motion

7. Fabrication and room temperature characterization of trilayer junctions for the development of superconducting qubits on 300 mm wafers

8. Mask absorber for next generation EUV lithography

9. Fabrication and Room Temperature Characterization of Trilayer Junctions for the Development of 300 mm Compatible Superconducting Qubits

13. Key Issues for the Development of a Ge CMOS Device in an Advanced IC Circuit

16. Mask absorber development to enable next-generation EUVL

17. Patterning challenges for beyond 3nm logic devices: example of an interconnected magnetic tunnel junction

20. Plasma Etch of IGZO Thin Film and IGZO/SiO2 Interface Diffusion in Inductively Coupled CH4/Ar Plasmas.

21. Fabrication of magnetic tunnel junctions connected through a continuous free layer to enable spin logic devices

22. Interconnected magnetic tunnel junctions for spin-logic applications

24. Reducing extreme ultraviolet mask three-dimensional effects by alternative metal absorbers

25. Enabling CD SEM metrology for 5nm technology node and beyond

26. Reducing EUV mask 3D effects by alternative metal absorbers

28. Experimental Observation of Back-Hopping With Reference Layer Flipping by High-Voltage Pulse in Perpendicular Magnetic Tunnel Junctions

29. Influence of the Reference Layer Composition on the Back-End-of-Line Compatibility of Co/Ni-Based Perpendicular Magnetic Tunnel Junction Stacks

32. Interconnects scaling challenge for sub-20nm spin torque transfer magnetic random access memory technology

34. Key contributors for improvement of line width roughness, line edge roughness, and critical dimension uniformity: 15 nm half-pitch patterning with extreme ultraviolet and self-aligned double patterning

39. Is there an impact of threading dislocations on the characteristics of devices fabricated in strained‐Ge substrates?

42. Germanium: The Past and Possibly a Future Material for Microelectronics

45. A k-space method for large-scale models of wave propagation in tissue

49. Mask absorber for next generation EUV lithography.

50. Process development using negative tone development for the dark field critical layers in a 28nm node process

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