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Industry worldwide is facing new challenges, particularly the implementation of new technologies, climate change and currently the pandemic of the disease caused by the new coronavirus COVID-19. For the industry to be competitive, it must make technological changes. These changes are based on the concept of Industry 4.0. The changes brought about by implementing the Industry 4.0 concept and the related digitization of the economy have implications for the functioning of markets, industries, and other sectors. Significant impacts can be expected on the labor market when the demand for specific professions changes and new competencies will be required for employees. The fundamental question is how specifically these requirements can be implemented in current education conditions, specifically in the university environment. As part of practical training, it is unrealistic to demonstrate new ways of operation management on an extensive product line. It is very effective to use various forms of small-scale models. These models behave practically the same as in actual operation, and students can try out different production states, problem-solving and subsequent optimization. This article describes how we solve this problem in our university.

This paper deals with the reliability under the flowing mixed gases corrosion test of interconnection techniques for the mounting surface mounted device (SMD) component. In the experiment, three types of substrates (conductive stretchable textile ribbon, knitted fabric, and flexible kapton substrate) and three contacting techniques (low-temperature soldering, isotropic electrically conductive adhesive bonding, and non-conductive adhesive bonding) were used. The experiment provided proof that soldered or non-conductive adhesive bonded samples are applicable even in a contaminated or industrial corrosive atmosphere, and the electrical resistance of joints on these samples remains acceptable. It follows e-textiles with soldered or non- =conductive adhesive bonded components can also be used in a contaminated or industrial atmosphere.

This article presents research focused on the intermetallic compound growing under different conditions. The quality of solder joints depends on many factors, one of which is the thickness of the intermetallic layer and its composition. Combination of multiple reflow processes which is common during the production process and thermal aging you can simulate long-term use of the product, which makes it possible to determine the condition of solder joints in the future. The growth of intermetallic layers using thermal aging is known, but the demand for lead-free solder causes new alloys with unknown properties. Each element in the solder alloy has a different impact on the resulting solder properties. The formation of intermetallic layers also depends on the surface finishes of the pads, so the object of the experiment is to compare the effect of known and used SAC305 solder with solder doped by Ge or Co at the various finishes of pads. This article presents research focused on the intermetallic compound growing under different conditions. The quality of solder joints depends on many factors, one of which is the thickness of the intermetallic layer and its composition. Combination of multiple reflow processes which is common during the production process and thermal aging you can simulate long-term use of the product, which makes it possible to determine the condition of solder joints in the future. The growth of intermetallic layers using thermal aging is known, but the demand for lead-free solder causes new alloys with unknown properties. Each element in the solder alloy has a different impact on the resulting solder properties. The formation of intermetallic layers also depends on the surface finishes of the pads, so the object of the experiment is to compare the effect of known and used SAC305 solder with solder doped by Ge or Co at the various finishes of pads.

This paper deals with the introduction and application of the software platform ZOTY, which is a new innovative software platform to accelerate the implementation of management and operation systems. In the first part, the research of available solutions for risk management on the market with the comparison of their pros and cons is described. This study shows that complex software with all intended functions was not available at a comparable price level which is acceptable for SMEs. In the next part, the functionalities of created software platform ZOTY are described. Also, one example of many methodologies used in the software platform is described in detail. At the end of the paper, the main benefits of the new software platform are described.

This paper researches the influence of the placement during the 3D printing process on the quality of the final product. The tensile tests were carried out on standard dog-bone specimens, which were printed both horizontally or vertically with three orientation angles 0°, 45°, 90° to the main direction of the plate. The main goal of the measurements was to determine the influence of the printing orientation and placement of the specimens on the mechanical properties. Obtained data were evaluated and used for the determination of the best printing orientation.

The company's ability to adapt to rapid market changes will be among the key factors for Industry's competitiveness within Industry 4.0. The basic of flexibility is quick respond to customer requirements and well-set and controlled production processes. Processes of Industry 4.0 will be different from existing processes, not only in terms of using new technologies such as digitization or augmented reality, but also in terms of management and support processes. The main aim of the article is possible changes determination of process management within Industry 4.0. For that, the current production process will be compared with the process in Industry 4.0. The described changes within Industry 4.0 will also have an impact on the organization architecture of company. The changes will be also in the production environment and in the supply chain. The described changes in the process management will also have an impact on the company risks. The main risks of changes within Industry 4.0 will be summarized in the article.

This article will present results of activity testing of rosin fluxes. A good solderability of a component output and a soldering pad of PCB are important for the creation of a quality joint. Since it supports a melted solder wetting on a soldered surface, a flux has a definitive influence on the creation of a quality joint. Further, it removes oxides and other impurities from soldering alloys and prevents from a creation of a new oxide layer during soldering. According the technology of a solder joint creation, a flux is added into the soldering process in different ways. The aim of the test was to select a rosin flux having with the solder tube the best results during soldering of the copper surface on PCB's. Fluxes were compared by the help of two different tests. The first trial was carried out by the area of spread method, since this test is suitable for solderability testing of materials and comparison of a flux activity. The wetting balance test was chosen as the second trial. This method enables to measure the wetting force affecting the tested sample. Curves of wetting forces are the test result serving for comparison of single fluxes.

This article deals with automatic testing of multimedia units. The aim of the work was to design and implement an automatic test system for a functional parameter measurement of multimedia units. The system was built up with the help of individual measuring devices and the designed multiplexer. The multiplexer functions are described in detail. The entire system is controlled by the control computer. For the control computer it was necessary to create software to control with devices and multimedia unit and communicate with them. For creating utility programs, the Labview programming language and Teststand software tool from National Instruments were chosen.

The article presents the results of solderability testing of printed circuit boards. The aim of this paper is to compare different atmospheres for solderability testing with different finishes of printed circuit boards (PCB’s). The article contains method descriptions that were used for solderability testing of printed circuit boards. The method of wetting balance test was chosen for this experiment. The PCB can be made with several kinds of surface finishing. Copper is the most commonly used material in the manufacture of printed circuit boards. The negative copper property is its low chemical stability. When a contact is in an atmosphere that contains oxygen, the surface is covered with a layer of copper oxides. This layer deteriorates copper solderability. Another way how to prevent oxidation of copper soldering pads of printed circuit boards is an inert atmosphere. As an inert atmosphere does not contain oxygen and prevents oxidation of the material used on PCB’s. The increasingly frequent introduction of inert atmospheres into soldering processes encourages the introduction of a inert atmosphere also in solderability testing processes.

Řízení rizik je nedílnou součástí každé moderní výrobní společnosti, protože provozování podniku je vždy spojeno s nejrůznějšími druhy rizik. Proto je nezbytné vyvíjet a zlepšovat způsoby implementace systému řízení rizik do podnikových procesů. Rizika by měla být kontrolována napříč všemi úrovněmi ve smyslu finančním, environmentálním a pracovní bezpečnosti. Tento článek se zabývá implementací vhodných metod řízení rizik do etapy vývoje výrobního či technologického procesu. Risk management is an integral part of every state-of-art production enterprise because running enterprises always go with various kinds of risks. Therefore, it is necessary to develop and improve ways of implementation of a risk control system into enterprise processes. Risks are supposed to be controlled across all levels of organization and considered in terms of finance, environment and occupational safety. This paper deals with the issue of implementation of proper risk analysis methods in the production or technological process development

This article deals with intermetallic layers which occure at the interface between solder and soldered material. To eliminate hazardous materials, only lead-free alloys, excluding special exemptions, are used today, not only in the Europe Union. Therefore, observing of creation of intermetallic compound between various lead-free soldering alloys and basic material is subject of wide interest. Many factors affect creating of intermetallic compounds, for example soldering temperature, constitution of solder, or setting of technological process of soldering. It depends, for example, on whether the solder joint is soldering by reflow oven, manually, by vapour phase soldering, or by dipping. Research of intermetallic compound growth in context of different soldering process setting, constitution of solder and artificial aging by raising thermal stress are presented in this article. The samples were divided into several groups to make comparison possible. One of these groups was leaved in room atmosphere and that didn’t put though any external influence. Tested samples of another groups were thermal stressed in hot-air oven at 150 °C. Another group of samples are presented to make identification of time dependence of intermetallic compound growth possible. Today, electron microscopy is mainly used for analysis of solder joints structure and determination of intermetallic compound layer size. Using this analysis, constitution of individual compounds can be exactly determined. Electron microscopy is not the only way to analyze structure of solder joints. For comparison, analysis of solder joints structure by confocal microscope Olympus LEXT 3000 are presented in this article as well.

The article deals with results of solderability testing of printed circuit boards. The wetting balance test was used for solderability testing. This test makes wetting force measurement possible as a function of time. Measured values are recorded automatically. Surface roughness is one of parameters, which influence surface wetting. The article will present the results and comparison of tested printed circuit boards with different surface roughness. Differences were in levels of roughness and orientation of scratches. This comparison will be made for testing samples of printed circuit boards with surface pure copper (Cu). The test samples were purposely roughened by different abrasive paper before solderability testing. Roughness made on surface finishes was oriented vertically and horizontally. These orientations are relative to attachment tested sample in tester.

Většina výrobců elektronických zařízení dnes řeší přechod na bezolovnatou technologii pájení. Jedním z důvodů je například směrnice RoHS 2002/95/EC omezující od 1.7. 2006 používání určitých nebezpečných materiálů včetně olova v elektrických a elektronických zařízeních. Odstranění olova z výrobního procesu však neznamená pouze záměnu SnPb pájky za bezolovnatou. Souvisí s tím také další změny. Olovo je totiž zastoupeno i na deskách plošných spojů nebo na vývodech součástek. V příspěvku proto budou popsány změny jak ve výrobní procesu tak i v použitých materiálech, které přímo souvisí s odstraněním olova z elektronických zařízení během jejich výroby.

Trendem dnešní doby je výroba stále menších elektronických zařízení. Dosahovat menších rozměrů umožňuje jednak vyšší integrace elektronických součástek a dále také speciální substráty. Tyto substráty jednak umožňují propojit zmiňované součástky a také lépe využívají místo na desce plošného spoje. Nazývají se microvia substráty. Technologických postupů výroby těchto substrátů je několik. Jedna z možností je výroba microvia za pomoci laseru. Vzhledem k tomu, že existuje několik typů laserů, existují i různé postupy výroby microvia využitím laseru. V příspěvku bude podán přehled možností laseru při výrobě microvia spolu s výhodami a nevýhodami.

Příspěvek prezentuje současné možnosti modelování a optimalizace diagnostických procesů v kontextu základních poznatků z oblasti procesního řízení aplikovaných do oblasti diagnostiky elektrotechnických systémů a prvků. Základním nástrojem použitým pro modelování diagnostických procesů je metodika ARIS (Architektura integrovaných informačních systémů), která umožňuje softwarovou podporu pro modelování, optimalizaci a průběžné zlepšování procesů a byly uvedeny výhody podpory této metodiky.

Článek pojednává o pájitelnosti a o jejím testování. Pájitelnost je vysvětlena coby důležitá vlastnost povrchů, které mají být spojeny strojním pájením. Příspěvek je zaměřen na testování pájitelnosti měřením časového průběhu smáčecí síly, nebo-li test metodou smáčecích vah. Dále jsou popsány normalizované zkoušky pájitelnosti a některá standardizovaná kritéria posuzování pájitelnosti. V závěru práce je popsán tester pájitelnosti MUST SYSTEM II Plus a možnosti testování pájitelnosti pomocí tohoto přístroje.

This paper demonstrates the concept of node consumption reduction for IoT applications. The main emphasis is placed on the autonomy of the whole device, which must be independent of external power supply. That is why energy harvesting based on temperature principle is used for power supply. One of the parameters monitored is the service uptime. The concept of intelligent control of the individual parts of the equipment leads to significant energy savings. This control requires the use of low power components, but only their appropriate connection and mutual monitoring of their operating modes leads to the desired savings. This algorithm can be adapted to the needs of IoT nodes focused on real-time performance applications or the process tracking slow low power applications. This concept will ultimately be adapted to a wireless node for monitoring position and temperature for use in medical applications to monitor the patient's position on the bed or position while moving.

Vývoj IoT zařízení bude vždy silně ovlivněn možnostmi napájení systému. Značný počet uzlů IoT (node) vytváří nebezpečí dodatečných nákladů při výměně baterii. Z tohoto důvodu se vývoj napájení uzlů zaměřuje na zařízení, která mohou pracovat bez baterie a energii získávají z jiných zdrojů. Tento článek se zaměřuje na alternativní získání elektrické energie z odpadního tepla vznikajícího při provozu LED svítidel obsahující velkoplošné LED čipy. Pro konverzi odpadní tepelné energie na elektrickou energii je využit Peltiérův článek zapojený ve funkci termogenerátoru do teplotního řetězce. The development of IoT instrumentation will always be strongly influenced by the properties of the power supply system. A large number of IoT nodes creates a danger of extra expenditures when changing the battery. For this reason, the development of supply nodes tends to prefer systems capable of battery-less operation, obtaining energy from other sources. This article deals with an alternative method of electrical energy acquisition form the excessive heat appearing in LED lighting fixtures utilizing large-area LED chips. A Peltier cell was used for the conversion of heat energy to electrical energy, connected as thermo-electric generator into the thermal chain.

Článek představuje obvodovou strukturu, která může být využita pro sběr energie z okolí (harvester). Je určena především pro spojení se solárními články nebo jinými zdroji energie, které poskytují dostatečně velké napětí, avšak mohou dodat pouze malý proud. Obvod je schopen akumulovat energii do kondenzátoru až do okamžiku, kdy je dosaženo příslušného napětí. Poté je kondenzátor připojen k zátěži. Obvod vykazuje podobnou funkčnost jako komerčně dostupný harvester EH300. Článek porovnává jejich elektrické vlastnosti, velikost a cenu. Obvod byl otestován s IoT (Internet of Things) uzlem, který periodicky odesílá změřená data do základnové stanice pouze s využitím napájení pomocí solárního článku. Horší elektrické vlastnosti navrženého obvodu jsou vyváženy jeho velmi nízkou cenou, která umožňuje nasazení tohoto obvodu v masovějším měřítku IoT sítí. The paper presents a circuit structure that can be used as an energy harvester. It is intended for photovoltaic panels (PV) or other sources of energy that can provide enough voltage level but that can source only low currents. The circuit is able to accumulate the energy until certain level and then to pass it to the load. The presented circuit exhibits similar functionality as a commercially available energy harvester EH300. The paper compares their technical properties, form factors and costs. The circuit was tested with IoT (Internet of Things) node that can periodically transmit measured data to the base station using just the powering from the PV panel. Worse electrical properties of the circuit are repaid by its low cost that allows mass applicability in the IoT.

Studie se zaobírá možným využitím technologie kontaktování v oblasti žárové anemometrie. Obecně se anemometrie věnuje měření rychlosti a směru proudění. V případě žárové (termické) anemometrie je senzorem žhavený drát. V této práci jsou uvedeny informace o návrhu, realizaci konstrukce experimentálního senzoru a ověření jeho základních vlastností při měření v prostředí až do 300 °C. Základem konstrukčního řešení je použití tepelně odolných a stabilních materiálů. The study deals with the possibility of using wire-bonding technology in hot-wire anemometry. In general, anemometry deals with measuring the velocity and the direction of flow. In the case of hot-wire anemometry, the sensors with hot wire. In this work are inscribed information about design, construction realization of the experimental sensor and verification of its basic properties. The measurement was performed to the temperature up to 300 °C. The basis of the construction solution is using of the heatproof and stable materials.