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The wafer shall be tested by probe after the integrated circuit (IC) feature manufacture and packaging, the purpose is to filter electrically dysfunctional chips. The probe card extracts the electrical signal of chip and sends it to the prober to screen defectives. The completed probe card shall be tested by the probe card tester to guarantee normal function. However, in the high frequency test environment, the probe card is tested by probe card tester, the transmission line effect sometimes causes signal distortion, or the overlong transmission path causes signal attenuation, so that the probe card is misrecognized as a defective. This study uses the theory of inventive problem solving (TRIZ) and function analysis (FA) to judge the functional relationship among various components in the probe card tester engineering system, so as to recognize the functional disadvantage. The "network analyzer", "anisotropic conductive film (ACF)” and "capacitance touch technology” solutions are proposed. These proposals improve the signal distortion caused by transmission line effect and solve the signal attenuation caused by overlong transmission path, so as to implement innovative research and development and to solve the existing problems.