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Image restoration via alternating direction method of multipliers (ADMM) has gained large interest within the last decade. Solving standard problems of Gaussian and Poisson noise, the set of "Total Variation" (TV)-based regularizers proved to be efficient and versatile. In the last few years, the "Total Generalized Variation" (TGV) approach combined TV regularizers of different orders adaptively to better suit local regions in the image. This improved the technique significantly. The approach solved the staircase problem inherent of the first-order TV while keeping the beneficial edge preservation. The iterative minimization for the augmented Lagrangian of TGV problems requires four important parameters: two penalty parameters ρ and η and two regularization parameters λ 0 and λ 1 . The choice of penalty parameters decides on the convergence speed, and the regularization parameters decide on the impact of the respective regularizer and are determined by the noise level in the image. For scientific applications of such algorithms, an automated and thus objective method to determine these parameters is essential to receive unbiased results independent of the user. Obviously, both sets of parameters are to be well chosen to achieve optimal results, too. In this paper, a method is proposed to adaptively choose optimal ρ and η values for the iteration to converge faster, based on the primal and dual residuals arising from the optimality conditions of the augmented Lagrangian. Further, we show how to choose λ 0 and λ 1 based on the inherent noise in the image. [ABSTRACT FROM AUTHOR]

Glass is one of the most essential materials in various industrial fields. A representative application is as interposers in the semiconductor and display industries and microfluidic devices in the bio‐industry. Due to technological advancements, electric devices and various products are becoming lighter and smaller. Consequently, precision processing of the substrate is becoming increasingly important. One significant leading technology among these is through glass via (TGV) technology, which is attracting attention as a future alternative to through silicon via. In particular, TGV should be capable of microfabrication with a large aspect ratio and a consistent small hole size. TGV is typically fabricated using a wet etching process, so wet etching technology is a prominent focus in microfabrication. However, glass has isotropic properties, making achieving a high aspect ratio difficult. Traditionally, research on the wet etching method using hydrofluoric acid (HF) has been conducted. Nevertheless, HF etching has several disadvantages, including air pollution and human harm. Additional studies have been performed to address these issues. This review paper will cover the conventional HF‐based wet etching method and alternative HF etching processes (eco‐friendly materials). This technology would significantly help overcome the traditional problems associated with HF etching and fabricating precision‐processed glass in the semiconductor, display, and bio‐device industries. [ABSTRACT FROM AUTHOR]

Purpose: In this work, the use of joint Total Generalized Variation (TGV) regularization to improve Multipool‐Lorentzian fitting of chemical exchange saturation transfer (CEST) Spectra in terms of stability and parameter signal‐to‐noise ratio (SNR) was investigated. Theory and Methods: The joint TGV term was integrated into the nonlinear parameter fitting problem. To increase convergence and weight the gradients, preconditioning using a voxel‐wise singular value decomposition was applied to the problem, which was then solved using the iteratively regularized Gauss–Newton method combined with a Primal‐Dual splitting algorithm. The TGV method was evaluated on simulated numerical phantoms, 3T phantom data and 7T in vivo data with respect to systematic errors and robustness. Three reference methods were also implemented: The standard nonlinear fitting, a method using a nonlocal‐means filter for denoising and the pyramid scheme, which uses downsampled images to acquire accurate start values. Results: The proposed regularized fitting method showed significantly improved robustness (compared to the reference methods). In testing, over a range of SNR values the TGV fit outperformed the other methods and showed accurate results even for large amounts of added noise. Parameter values found were closer or comparable to the ground truth. For in vivo datasets, the added regularization increased the parameter map SNR and prevented instabilities. Conclusion: The proposed fitting method using TGV regularization leads to improved results over a range of different data‐sets and noise levels. Furthermore, it can be applied to all Z‐spectrum data, with different amounts of pools, where the improved SNR and stability can increase diagnostic confidence. [ABSTRACT FROM AUTHOR]

Glass is a good candidate for substrate material of integrated passive device, due to its high resistivity and low dielectric loss. 3D through glass via (TGV) inductors can be formed with high radio‐frequency performance. This paper analyzes failure mechanisms of TGV inductors and proposes the method of process optimization. [ABSTRACT FROM AUTHOR]

In this study, we used femtosecond laser-assisted etching (FLAE) to drill through glass vias (TGVs) in 0.3 mm thick non-alkali glass substrates. In FLAE, the focus of the femtosecond laser pulses is scanned to modify the material along a preprogrammed pattern, and the modified region is preferentially removed by chemical etching. We found that the scanning strategy affected the etching rate along the laser-modified lines. Among four types of scanning strategies tested, the strategy 〈du〉—that is, scanning in a downward direction followed by an upward direction—obtained the highest etching rate. In this case, the etching rate along the laser-modified line was approximately 10 times larger than that of the unmodified region. [ABSTRACT FROM AUTHOR]

The paper reports the fabrication and characterization of a capacitive Microelectro Mechanical Systems pressure sensor based on through glass vias (TGV), which had a large dynamic range by operating in touch mode. The substrate with TGV offers the advantage of elimination of parasitic capacitances owing to the superior insulation property of glass. The fabrication process was introduced. In particular, anodic bonding was applied in high vacuum to realize the hermetic package to obtain large operating range and high sensitivity. The performance of the sensor with a sensitive diaphragm of 700 μm × 1400 μm was characterized in the pressure range from −80 to 180 kPa. The sensitivity was determined as 0.072 pF/kPa over the range of 160 kPa with a good linearity of 97%. [ABSTRACT FROM AUTHOR]

The advent of railways and especially highspeed railways marks great strides in human transportation history. To guarantee exclusive right-of-way, highspeed railways are often built on equal simply supported beams resting on piers. In this paper, a historical review will be given of the resonance and cancellation phenomena observed for simply supported beams traveled by a set of moving loads, as they are typical of highspeed railways. The phenomenon of resonance was observed by early investigators including Timoshenko, Bolotin, Frýba, Matsuura, etc. However, the phenomenon of cancellation was noted lately in 1997 by Yang et al. By letting the conditions of resonance and cancellation coincident, they proposed the optimal span length for suppressing the resonance of simple beams, which is equal to 1.5 times the car length. This 1.5 times rule has been verified and adopted in the design of some highspeed railways. In this article, the theoretical solution for the problem will be revisited for unveiling the key parameters such as the resonance speed (in temporal domain) and resonance wavelength (in spatial domain). Then a rather in-depth review will be given of existing works on the resonance and cancellation of railway bridges from the waves perspective. Some new developments along these lines will also be identified. [ABSTRACT FROM AUTHOR]

The multi-chiplet technique is expected to be a promising solution to achieve high-density system integration with low power consumption and high usage ratio. This technique can be integrated with a glass interposer to accomplish a competitive low fabrication cost compared with the silicon-based interposer architecture. In this study, process-oriented stress simulation is performed by the element activation and deactivation technique in finite element analysis architecture. The submodeling technique is also utilized to mostly conquer the scale mismatch and difficulty in mesh gridding design. It is also used to analyze the thermomechanical responses of glass interposers with chiplet arrangements and capped epoxy molding compounds (EMC) during curing. A three-factor, three-level full factorial design is applied using the analysis of variance method to explore the significance of various structural design parameters for stress generation. Analytic results reveal that the maximum first principal stresses of 130.75 and 17.18 MPa are introduced on the sidewall of Cu-filled via and the bottom of the glass interposer, respectively. Moreover, the EMC thickness and through glass via pitch are the dominant factors in the adopted vehicle. They significantly influence the stress magnitude during heating and cooling. [ABSTRACT FROM AUTHOR]

With the increasing demand for high-density integration, low power consumption and high bandwidth, creating more sophisticated interconnection technologies is becoming increasingly crucial. Three-dimensional (3D) integration technology is known as the fourth-generation packaging technology beyond Moore's Law because of its advantages of low energy consumption, lightweight and high performance. Through-silicon via (TSV) is considered to be at the core of 3D integration because of its excellent electrical performance, lower power consumption, wider bandwidth, higher density, smaller overall size and lighter weight. Therefore, the particular emphasis of this review is the process flow of TSV technology. Among them, the research status of TSV hole etching, deep hole electroplating filling and chemical mechanical planarization (CMP) in TSV preparation process are introduced in detail. There are a multitude of inevitable defects in the process of TSV processing; thus, the stress problems and electrical characteristics that affect the reliability of TSV are summarized in this review. In addition, the process flow and process optimization status of through ceramic via (TCV) and through glass via (TGV) are discussed. [ABSTRACT FROM AUTHOR]

Due to high insulation, low dielectric loss and low cost, glass is considered as a promising substrate material for advanced package. Through glass via technology plays a key role in the 2.5D and 3D packaging. This paper analyzes failure mechanisms of TGV and discuss the optimum design and process. [ABSTRACT FROM AUTHOR]

Gibbs ringing is a feature of MR images caused by the finite sampling of the acquisition space (k-space). It manifests itself with ringing patterns around sharp edges which become increasingly significant for low-resolution acquisitions. In this paper, we model the Gibbs artefact removal as a constrained variational problem where the data discrepancy, represented in denoising and convolutive form, is balanced to sparsity-promoting regularization functions such as Total Variation, Total Generalized Variation and L 1 norm of the Wavelet transform. The efficacy of such models is evaluated by running a set of numerical experiments both on synthetic data and real acquisitions of brain images. The Total Generalized Variation penalty coupled with the convolutive data discrepancy term yields, in general, the best results both on synthetic and real data. [ABSTRACT FROM AUTHOR]

This work presents a novel sensor packaging and a novel transition concept for radar applications above 150 GHz based on glass material. By using laser induced deep etching (LIDE) technology, glass vias and cavities are fabricated without degrading the mechanical stability of glass, as micro-cracks are completely avoided. Especially at high millimeter wave (mm-wave) frequencies, precise structuring on low dielectric loss materials and a high integration density are essential for low loss transitions. In this paper, an ultra compact FMCW radar monolithic microwave integrated circuit (MMIC) at 160 GHz is used to demonstrate this packaging technology. In addition, the high frequency signal is guided by a low loss transition to a deposed antenna via a dielectric waveguide (DWG) providing the antenna front end with mechanical flexibility. Thus, using plated through glass vias (TGVs) and a circulating solder ring, the package is hermetically sealed. The optical transparent glass package has a size of only ${5.8}\,\rm {mm}\times {4.4}\,\rm {mm}\times {0.9}\,\rm {mm}$. A minimum measured insertion loss of 2.85 dB at 162 GHz from chip to DWG is achieved. The complete radar system with a range resolution of 12 mm is demonstrated via radar measurement.

In glass interposer architecture and its assembly process, the mechanical responses of interposer structure under thermocompression process-induced thermal loading and generated shrinkage of molding material are regarded as a major reliability issue. Thousands of metal-filled via are involved in glass interposers and are regarded as a potential risk that can lead to cracking and the failure of an entire vehicle. In this study, a finite element-based submodeling approach is demonstrated to overcome the complexity of modeling and the relevant convergence issue of interposer architecture. Convergence analysis results revealed that at least four via pitch-wide regions of a local simulation model were needed to obtain the stable results enabled by the submodeling simulation approach. The stress-generation mechanism during thermocompression, the coefficient of thermal expansion mismatch, and the curing process-induced shrinkage were separately investigated. The critical stress location was explored as the outer corner of the chip, and the maximum first principal stress during the thermocompression process generated on the chip and glass interposer were 34 and 120 MPa, respectively. [ABSTRACT FROM AUTHOR]

In this paper, a new total generalized variational (TGV) model for restoring images with Cauchy noise is proposed, which contains a non-convex fidelity term and a TGV regularization term. In order to obtain a strictly convex model, we add an appropriate proximal term to the non-convex fidelity term. We prove that the solution of the proposed model exists and is unique. Due to the convexity of the proposed model and in order to get a convergent algorithm, we employ an alternating minimization algorithm to solve the proposed model. Finally, we demonstrate the performance of our scheme by numerical examples. Numerical results demonstrate that the proposed algorithm significantly outperforms some previous methods for Cauchy noise removal.

With the increasing demand for high-density integration, low power consumption and high bandwidth, creating more sophisticated interconnection technologies is becoming increasingly crucial. Three-dimensional (3D) integration technology is known as the fourth-generation packaging technology beyond Moore’s Law because of its advantages of low energy consumption, lightweight and high performance. Through-silicon via (TSV) is considered to be at the core of 3D integration because of its excellent electrical performance, lower power consumption, wider bandwidth, higher density, smaller overall size and lighter weight. Therefore, the particular emphasis of this review is the process flow of TSV technology. Among them, the research status of TSV hole etching, deep hole electroplating filling and chemical mechanical planarization (CMP) in TSV preparation process are introduced in detail. There are a multitude of inevitable defects in the process of TSV processing; thus, the stress problems and electrical characteristics that affect the reliability of TSV are summarized in this review. In addition, the process flow and process optimization status of through ceramic via (TCV) and through glass via (TGV) are discussed.

The multi-chiplet technique is expected to be a promising solution to achieve high-density system integration with low power consumption and high usage ratio. This technique can be integrated with a glass interposer to accomplish a competitive low fabrication cost compared with the silicon-based interposer architecture. In this study, process-oriented stress simulation is performed by the element activation and deactivation technique in finite element analysis architecture. The submodeling technique is also utilized to mostly conquer the scale mismatch and difficulty in mesh gridding design. It is also used to analyze the thermomechanical responses of glass interposers with chiplet arrangements and capped epoxy molding compounds (EMC) during curing. A three-factor, three-level full factorial design is applied using the analysis of variance method to explore the significance of various structural design parameters for stress generation. Analytic results reveal that the maximum first principal stresses of 130.75 and 17.18 MPa are introduced on the sidewall of Cu-filled via and the bottom of the glass interposer, respectively. Moreover, the EMC thickness and through glass via pitch are the dominant factors in the adopted vehicle. They significantly influence the stress magnitude during heating and cooling.

Based on laser-induced deep etching technology and through-hole filling techniques, TGV interposers were successfully fabricated. The residual stress in the Cu overburden film directly affects the yield improvement after subsequent grinding of the interposer. Therefore, we studied the evolution of residual stress, microstructural changes, and micro-nano mechanical properties within the Cu overburden film after heat treatment at different temperatures. Residual stress analysis using the sin2Ψ method with an X-ray diffractometer (XRD) indicates that during the process of increasing temperature from 100°C to 200°C, the internal residual stress in the Cu overburden film changes from compressive stress to tensile stress. Furthermore, the maximum absolute value of the residual stress, 70.09 MPa, appears at room temperature, and the minimum absolute value of the residual stress, 15.59 MPa, occurs after the heat treatment process at 200°C. Electron backscatter diffraction (EBSD) microstructural analysis shows that the application of heat treatment can effectively accelerate static recrystallization (SRX), promote a higher proportion of high-angle grain boundaries (HAGB), and refine grain size. Additionally, a (001) preferred orientation at high residual stress states and a (111) preferred orientation at low residual stress states are observed. Nanoindentation test results indicate that the Cu overburden film treated at 100°C has the most potential for removal during the grinding process. • The effects of different temperatures on the microstructure of the Cu overburden film were discussed deeply. • The residual stress within the copper clad laminate under heat treatment has been calculated and analyzed. • After heat treatment, the changes in the tribological mechanism of the Cu overburden film were analyzed. [ABSTRACT FROM AUTHOR]

High-performance MEMS accelerometers usually use a pendulum structure with a larger mass. Although the performance of the device is guaranteed, the manufacturing cost is high. This paper proposes a method of fabricating high-performance MEMS accelerometers with a TGV process, which can reduce the manufacturing cost and ensure the low-noise characteristics of the device. The TGV processing relies on laser drilling, the metal filling in the hole is based on the casting mold and CMP, and the packaging adopts the three-layer anodic bonding process. Moreover, for the first time, the casting mold process is introduced to the preparation of MEMS devices. In terms of structural design, the stopper uses distributed comb electrodes for overload displacement suppression, and the gas released by the packaging method provides excellent mechanical damping characteristics. The prepared accelerometer has an anti-overload capability of 10,000 g, the noise density is less than 0.001°/√Hz, and it has ultra-high performance in tilt measurement. [ABSTRACT FROM AUTHOR]

This letter proposes a high bandwidth compact linear polarization antenna for the automotive radar millimeter-wave band of 77 GHz using five stacked glass layers scheme with high precision metal layers and through glass vias (TGVs). The radiation part of antenna is composed of four microstrip patches, wherein a single patch is only $0.55\times0.55$ mm2, and the overall size of the package is 10 $\times 9\times $ 1 mm3. 6-inch glass wafers with the thickness of $230~\mu $ m or $100~\mu $ m are employed to achieve high-density interconnects and precise manufacture. The interconnects formed by the TGVs and redistribution layer (RDL) realize direct transmission and signal coupling between layers to improve transmission efficiency. The gain is more than 7 dB at frequency of 77 GHz. This proposed glass Antenna shows the superior advantages of process accuracy to realize miniaturization and System in Package (SiP) compared with that of Low-Temperature Co-fired Ceramics (LTCC) and Printed Circuit Board (PCB). [ABSTRACT FROM AUTHOR]

A 27″ tiling display by using LTPS TFT active matrix structure is demonstrated. With a novel pixel design and tiling technology, the seamless feature is realized by 4 pieces 13.5″ panels with 625um pixel pitch. In this article, we will discuss the challenges and solutions of different seamless tiling technologies from process point of view. [ABSTRACT FROM AUTHOR]

Image deraining is essential in both image processing and computer vision. However it is still challenging to remove rain streaks, due to the fact that they are complex and usually have multiple directions. In this paper, we propose a novel infimal convolution type functional based model to remove multi-directional rain streaks. Specifically, we employ total generalized variation (TGV) to represent the rain-free background and m -fold infimal convolution of oscillation TGV ( ICTGV m osci ) to capture the rain streaks with m different directions. The existence of solutions to the proposed model is proved. We also design an algorithm using the classical first-order Primal–Dual method for solving the proposed model. Numerical experiments on both synthetic and real images demonstrate that the proposed model outperforms the state-of-the-art methods quantitatively and qualitatively. [ABSTRACT FROM AUTHOR]

Seismic exploration is a remote-sensing tool applied in a great many projects for engineering and resource-exploration purposes. Random noise suppression is one of the key steps in seismic-signal processing, especially those with important details and features. The threshold-shrinkage method based on Shearlet transform has been effectively applied in seismic-signal denoising. However, the method usually introduces the boundary effect, which influences the imaging quality. The denoising method of total generalized variation (TGV) is easy to produce `oil painting' effect, but it can effectively suppress the boundary effect. This paper proposes a denoising method based on Shearlet threshold-shrinkage and TGV for making full use of their characteristics, which can recover both edges and fine details much better than the existing regularization methods. First, we use the Shearlet threshold-shrinkage result as the input of TGV to obtain the primary denoising result and the residual profile. Second, we use the interactive iteration of Shearlet threshold-shrinkage and TGV to extract the signals efficiently from the residual profile and perform the effective signals stack continuously. During the processing, the adaptive-weight factor is combined for estimating the optimal denoising result. Last, the final estimated denoising result is obtained when the stopping criterion is met or the maximum number of iterations is reached. The synthetic and field results show that the proposed method can effectively suppress random noise. In addition, it can also remove the boundary effect and `oil painting' effect, which further improves the signal-to-noise ratio (SNR).

High-performance MEMS accelerometers usually use a pendulum structure with a larger mass. Although the performance of the device is guaranteed, the manufacturing cost is high. This paper proposes a method of fabricating high-performance MEMS accelerometers with a TGV process, which can reduce the manufacturing cost and ensure the low-noise characteristics of the device. The TGV processing relies on laser drilling, the metal filling in the hole is based on the casting mold and CMP, and the packaging adopts the three-layer anodic bonding process. Moreover, for the first time, the casting mold process is introduced to the preparation of MEMS devices. In terms of structural design, the stopper uses distributed comb electrodes for overload displacement suppression, and the gas released by the packaging method provides excellent mechanical damping characteristics. The prepared accelerometer has an anti-overload capability of 10,000 g, the noise density is less than 0.001°/√Hz, and it has ultra-high performance in tilt measurement.

There is increasing interest in minimizing display bezels or creating truly borderless displays for liquid crystal, organic light emitting diode, and emerging microLED technologies. The current approach is integration of side‐bonded electrodes or wrap‐around electrodes to enable flex connector attachment on the backplane edge face or backs surface. These approaches utilize the backplane perimeter to achieve the required electrical interconnection. In contrast, metallized through glass via interconnects can be distributed across the backplane surface. This provides a more localized connection for backplane signal and power. This paper summarizes successful integration of metallized via interconnects with thin film transistors. [ABSTRACT FROM AUTHOR]

Motivated by the ideas from two step model and its deformation, we propose a coupling model for MR image reconstruction, based on the advantages of TGV and shearlet regularization terms. By using variable splitting technique, splitting Bregman iteration scheme and alternating minimization method, the proposed model can be decomposed into several subproblems to avoid solving high-order PDEs. The u subproblem can be solved by Cramer's rule and the diagonalization technique of the Fourier transform. The other subproblems can be solved simply by some shrinkage formulas. We also use the Barzilai-Borwein step selection scheme to accelerate these subproblem's solutions. Finally, an ADMM algorithm is proposed to solve the coupling model. The numerical results show that the proposed coupling model and algorithm are feasible and effective. [ABSTRACT FROM AUTHOR]

Purpose: Propose a novel decomposition‐based model employing the total generalized variation (TGV) and the nuclear norm, which can be used in compressed sensing‐based dynamic MR reconstructions. Theory and Methods: We employ the nuclear norm to represent the time‐coherent background and the spatiotemporal TGV functional for the sparse dynamic component above. We first design an algorithm using the classical first‐order primal‐dual method for solving the proposed model and then give the norm estimation for the convergence condition. The proposed model is compared with the state‐of‐the‐art methods on different data sets under different sampling schemes and acceleration factors. Results: The proposed model achieves higher SERs and SSIMs than kt‐SLR, kt‐RPCA, L+S, and ICTGV on cardiac perfusion and breast DCE‐MRI data sets under both the pseudoradial and the Cartesian sampling schemes. In addition, the proposed model better suppresses the spatial artifacts and preserves the edges. Conclusions: The proposed model outperforms the state‐of‐the‐art methods and generates high‐quality reconstructions under different sampling schemes and different acceleration factors. [ABSTRACT FROM AUTHOR]

In this paper, we propose a new variational model for removing haze from a single input image. The proposed model combines two total generalized variation (TGV) regularizations, which are related to the image intensity and the transmission map, respectively, to build an optimization problem. Actually, TGV functionals are more appropriate for describing a natural color image and its transmission map with slanted plane. By minimizing the energy functional with double-TGV regularizations, we obtain the final haze-free image and the refined transmission map simultaneously instead of the general two-step framework. The existence and uniqueness of solutions to the proposed variational model are further obtained. Moreover, the variational model can be solved in a unified way by realizing a primal–dual method for associated saddle-point problems. A number of experimental results on natural hazy images are presented to demonstrate our superior performance, in comparison with some state-of-the-art methods in terms of the subjective and objective visual quality assessments. Compared with the total variation-based models, the proposed model can generate a haze-free image with less staircasing artifacts in the slanted plane and more details in the remote scene of an input image. [ABSTRACT FROM AUTHOR]

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Abstract In this paper, a new total generalized variational(TGV) model for restoring images with multiplicative noise is proposed, which contains a nonconvex fidelity term and a TGV term. We use a difference of convex functions algorithm (DCA) to deal with the proposed model. For multiplicative noise removal, there exist many models and algorithms, most of which focus on convex approximation so that numerical algorithms with guaranteed convergence can be designed. Unlike these algorithms, we use the DCA algorithm to remove multiplicative noise. By numerical experiments, it is shown that the proposed approach leads to a better solution compared with the gradient projection algorithm for solving the classic multiplicative noise removal models. We prove that the sequence generated by the DCA algorithm converges to a stationary point, which satisfies the first order optimality condition. Finally, we demonstrate the performance of our whole scheme by numerical examples. A comparison with other methods is provided as well. Numerical results demonstrate that the proposed algorithm significantly outperforms some previous methods for multiplicative Gamma noise removal. [ABSTRACT FROM AUTHOR]

Abstract We propose a novel infimal convolution type functional based on total generalized variation (TGV) and shearlet transform, which can be easily incorporated into image restoration problems. We employ the TGV functional to represent the piecewise smooth cartoon part of an image and the L 1 norm of shearlet transform for the edge-like texture part. The proposed model recovers both fine details and edge features of images satisfactorily. The existence of solutions to our proposed model is proved. We also design a general algorithm using the classical first-order Primal–Dual method for solving our imaging problems. Numerical experiments are carried out to illustrate the ability of the new regularizer in preserving edge-like textures better than some existing variational and sparsity-based methods. Highlights • The new infimal convolution model separates an image to cartoon and texture parts. • The new regularizer can deal with images with edge-like textures. • We illustrate the existence of solutions of our general model. • We design a practical algorithm and also estimate the convergence condition. [ABSTRACT FROM AUTHOR]

Abstract Purpose Multiplication of FLAIR and T2-weighted MRI scans results in images (called FLAIR2) with an improved contrast-to-noise ratio (CNR) for multiple sclerosis (MS) lesions but with a reduced signal-to-noise ratio (SNR). Denoising of these images may therefore further improve FLAIR2 image quality. The purpose of this work is to present a systematic investigation of FLAIR2 image denoising methods using Gaussian, Wiener and Total Generalized Variation (TGV) filtering approaches. Materials and methods T2-weighted and FLAIR data of four MS patients were used. For CNR and SNR measurements, each scan was performed up to three times. TGV, Gaussian and Wiener filtering was applied to T2, FLAIR and the FLAIR2 data. FLAIR2 images were afterwards additionally created using all combinations of input data (native, filtered T2 and filtered FLAIR). SNR and CNR measurements were performed using the subtraction method for all FLAIR2 approaches (native and filtered input data) and for twenty MS lesions. Additionally, quantitative analysis of filtering based image blurring was performed on all data sets. Results FLAIR2 images denoised with TGV showed the highest SNR and CNR, while SNR values were similar for Gaussian and Wiener filtered images. The average CNR over 20 MS lesions within the native FLAIR2 (32.99) achieved an improvement to 91.17, 82.33 and 56.07 corresponding to TGV, Wiener and Gaussian filtering. FLAIR multiplied with T2.denoised showed no improvement, while FLAIR.denoised multiplied with T2 showed an increase by a factor of two to the native, not filtered FLAIR2. Blurring was most pronounced in Gaussian filtered images and similar in TGV and Wiener filtered images. Conclusion FLAIR images filtered with Wiener or TGV multiplied with the unfiltered T2 results in FLAIR2 images with increased SNR and CNR and with minimal edge blurring. [ABSTRACT FROM AUTHOR]

Increased advantages of railway transportation systems over other types of transportation systems in the past sixty years have been a result of an intensive development of the new generations of high-speed trains. Not only do these types of trains comply with the need for increased speed of transportation and make the duration of the journey shorter, but they also meet the demands for increased reliability, safety and direct application of energy efficiency to the transportation system itself. Along with increased train speed, the motion resistance is increased as well, whereby at speeds over 200 km/h the proportion of air resistance becomes the most dominant member. One of the most efficient measures for reducing air resistance, as well as other negative consequences of high-speed motion, is the development of the aerodynamic shape of the train. This paper presents some construction solutions that affect the aerodynamic properties of high-speed trains, first and foremost, the nose shape, as well as the similarities and differences of individual subsystems necessary for the functioning of modern high-speed rail systems. We analysed two approaches to solving the problem of the aerodynamic shape of the train and the appropriate infrastructure using the examples of Japan and France. Two models of high-speed trains, Shinkansen (Japan) and TGV, i.e. AGV (France), have been discussed.

In Part 1, we developed a new technique based on Lipschitz pushforwards for proving the jump set containment property H m − 1 ( J u ∖ J f ) = 0 of solutions u to total variation denoising. We demonstrated that the technique also applies to Huber-regularised TV. Now, in this Part 2, we extend the technique to higher-order regularisers. We are not quite able to prove the property for total generalised variation (TGV) based on the symmetrised gradient for the second-order term. We show that the property holds under three conditions: First, the solution u is locally bounded. Second, the second-order variable is of locally bounded variation, w ∈ BV loc ( Ω ; R m ) , instead of just bounded deformation, w ∈ BD ( Ω ) . Third, w does not jump on J u parallel to it. The second condition can be achieved for non-symmetric TGV. Both the second and third condition can be achieved if we change the Radon (or L 1 ) norm of the symmetrised gradient Ew into an L π norm, p > 1 , in which case Korn's inequality holds. On the positive side, we verify the jump set containment property for second-order infimal convolution TV (ICTV) in dimension m = 2 . We also study the limiting behaviour of the singular part of Du , as the second parameter of TGV 2 goes to zero. Unsurprisingly, it vanishes, but in numerical discretisations the situation looks quite different. Finally, our work additionally includes a result on TGV-strict approximation in BV ( Ω ) . [ABSTRACT FROM AUTHOR]

As electronic display product becomes thinner and wider with an increasing number of function, the demand for high density and high integration becomes stronger. On the other hand, glass has many properties that make it an ideal substrate for electronic substrates such as; ultra high resistivity, adjustable thermal expansion (CTE) and manufacturability with large panel size. Furthermore, glass via formation capabilities has dramatically improved over the past several years. Fully populated wafers with >100,000 through holes (50 μm diameter) are fabricated today with 300 μm thick glass. This paper presents the demonstration of glass panel substrate with fine pitch metalized through via for Display Electronics. The application of glass panel substrate requires ultra-fine line and space 2/2um. A semi-additive process consisting of copper seed layer deposition, photo-lithography, and electrolytic copper pattern plating used for RDL. High frequency transmission characteristics were measured with TGV co planer wave guide. Glass panel substrate with plated via demonstrated on 300x400mm panel format. Twin types of Cu plating method with through via, full filling plating and conformal plating are compared with process capability using X ray observation. Electrical characteristics are measured with daisy chain test elementary vehicle. Excellent through via reliability was demonstrated at 200um pitch passed 1000cycle from -40 cereuses deg. to 80 cereuses deg. [ABSTRACT FROM AUTHOR]

In this paper, we present an analysis of signal transfer performance of the through glass via (TGV) deposited with metal electrodes. Because of the parasitical effects, signal will be weakened and phase delayed after transferring through the TGV substrate. Amplitude attenuation and phase delay of the signal ranging from 10 Hz to 10 7 Hz are extracted in the experiment part, showing that little negative effects will generate when the signal frequency is not very high. Then, frequency response of the resonator is tested, showing the feasibility of exciting the resonator by transferring the signal through the TGV substrate when the signal frequency is about 5 kHz. The characterization of signal transfer performance is expected to be helpful in guiding the application and structure design of the TGV substrate. [ABSTRACT FROM AUTHOR]

Invariances are one of the key concepts to render computer vision algorithms robust against severe illumination changes. However, there is no free lunch: With any invariance comes an unavoidable loss of information. The goal of our paper is to introduce two novel descriptors which minimise this loss: the complete rank transform and the complete census transform. They are invariant under monotonically increasing intensity rescalings, while containing a maximum possible amount of information. To analyse our descriptors, we embed them as constancy assumptions into a variational framework for optic flow computation. As a suitable regularisation term, we choose total generalised variation that favours piecewise affine solutions. Our experiments focus on the KITTI benchmark where robustness w.r.t. illumination changes is one of the main issues. The results demonstrate that our descriptors yield state-of-the-art accuracy. [ABSTRACT FROM AUTHOR]