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2. Low noise, low switch loss 0.25 mum e/d pHEMT technology

4. Pt/PbZr(sub x)Ti(sub 1-x)O3 interfacial reaction and Schottky barrier formation studied by x-ray photoelectron spectroscopy: effect of H2 and O2 annealing

5. Generation mechanism of gate leakage current due to reverse-voltage stress in i-AlGaAs/n-GaAs HIGFET's

6. GaN technologies for applications from L- to Ka-band

7. Pt/PBZr...Ti...O... interfacial and Schottky barrier formation studied by x-ray photoelectron...

9. Temperature dependence of gate forward turn-on voltage (Vf) of i-A10.3Ga0. 7As/n-GaAs HIGFET's

13. Low noise, low switch loss 0.25µm E/D pHEMT technology.

31. Pure-play GaN foundry technology for RF applications.

32. Electronic properties of Se-treated SiO[sub 2]/GaAs interfaces.

33. Electrical properties of thermally stable LaB6/GaAs Schottky diodes.

37. ArF-Excimer-Laser-Assisted Highly Selective Etching of InGaAs/InAlAs Using HBr and F2Gas Mixture

38. GaAs MESFET's with a Thermally Stable LaB6Self-Aligned Gate

39. Evidence of Ga2Se3-Related Compounds on Se-Stabilized GaAs Surfaces

40. Effect of H2Annealing on a Pt/PbZrxTi1-xO3Interface Studied by X-Ray Photoelectron Spectroscopy

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