1. Effect of Epoxy Conductive Adhesive on Film Deformation During the Thermoforming Process for In‐Mold Electronic Devices.
- Author
-
Arias‐García, Francisco Ituriel, Lozano‐Hernandez, Nekane, Ruldua, Maria Lluisa Maspoch, and Baig, Enric Fontdecaba
- Abstract
In‐Mold Electronics (IME) is an innovative technology that allows the creation of 3D‐shaped electronic surfaces by combining printed electronics and In‐Mold Decoration (IMD). During the manufacturing process, the materials that integrate these devices, such as adhesive, must endure the transformation conditions of thermoforming. However, the adhesive rigidity may influence the deformation of the film during this process. In this study, both printed and hybridized samples are compared regarding their stretching and thickness reduction during the thermoforming process. The results indicate that the deformation of the hybridized samples differs from the printed ones, resulting in less stretching in areas near the adhesive, with stretching increasing as it steps away from where it is deposited. Thickness values are also affected, being greater around the adhesive and decreasing farther away. Therefore, the presence of the adhesive significantly impacts the behavior of the film during processing, a factor that must be considered in the design of IME devices to maximize the number of functional devices. [ABSTRACT FROM AUTHOR]
- Published
- 2024
- Full Text
- View/download PDF