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Copper alloys used in the automotive and white goods industry are preferred as terminals due to their high conductivity For low contact resistance and high mechanical strength of copper alloys, appropriate design selection becomes important. As a result of the coating of copper alloy, current transition level of the conductive terminal and the formation of a film that protects against corrosion on the surface are improved. The aim is to optimize the PCB terminals to be made of CuNiSiP material according to the contact forces and to produce them as gold-plated. Production is done for the CuNiSiP copper alloy supplied within the developing dimensions. With the FEA, contact forces were calculated according to different contact diameter and oral cavity parameters. The surface roughness was measured from the product contact point after the final design. The surface roughness data in the cutting zone were compared again after the prototype production, depending on the number of cycle period. During prototype production, sensitive area of terminal tip was characterized by Electron Microscopy. After the characterization, coating thickness of gold-plated regions was measured as minumum 0.8 µm by X-ray Analyses. It is experimentally proven that contact forces of PCB terminal meet the requirements. [ABSTRACT FROM AUTHOR]