17 results on '"Tsai, Yi-Pei"'
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2. Productivity enhancement study: yield, cost, and turn-around-time modeling for EUV and high NA EUV
3. Test Pattern Design for Plasma Induced Damage on Inter-Metal Dielectric in FinFET Cu BEOL Processes
4. Charge Splitting In Situ Recorder (CSIR) for Real-Time Examination of Plasma Charging Effect in FinFET BEOL Processes
5. A yield prediction model and cost of ownership for productivity enhancement beyond imec 5nm technology node
6. Productivity enhancement study: yield, cost, and turn-around-time modeling for EUV and high NA EUV
7. On-Wafer FinFET-Based EUV/eBeam Detector Arrays for Advanced Lithography Processes
8. Plasma Charge Accumulative Model in Quantitative FinFET Plasma Damage
9. 7nm FinFET Plasma Charge Recording Device
10. Plasma Charging Effect on the Reliability of Copper BEOL Structures in Advanced FinFET Technologies
11. Correction to: Charge Splitting In Situ Recorder (CSIR) for Real-Time Examination of Plasma Charging Effect in FinFET BEOL Processes
12. Charge splitting in-situ recorder (CSIR) for monitoring plasma damage in FinFET BEOL processes
13. Productivity enhancement study: yield, cost, and turn-around-time modeling for EUV and high NA EUV.
14. Wafer-Level Mapping of Plasma-Induced Charging Effect by On-Chip In Situ Recorders in FinFET Technologies
15. Mapping of wafer-level plasma induced charge contour by novel on-chip in-situ recorders in advance FinFET technologies
16. A yield prediction model and cost of ownership for productivity enhancement beyond imec 5nm technology node.
17. A yield prediction model and cost of ownership for productivity enhancement beyond imec 5nm technology node
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