49 results on '"Ueshima, Minoru"'
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2. Improved thermal shock reliability of Ag paste sintered joint by adjusted coefficient of thermal expansion with Ag-Si atomized particles addition
3. Development of Ag@Si composite sinter joining with ultra-high resistance to thermal shock test for SiC power device: Experiment validation and numerical simulation
4. Effects of high temperature and high humidity on the reliability of copper/epoxy bond
5. Influence of interfacial interaction on the reliability of the bond between encapsulation epoxy and copper substrate
6. Development of high thermal conductivity of Ag/diamond composite sintering paste and its thermal shock reliability evaluation in SiC power modules
7. Failure mechanisms of the bonded interface between mold epoxy and metal substrate exposed to high temperature
8. Chemical bonding of copper and epoxy through a thiol-based layer for post 5G/6G semiconductors
9. Development of crack-less and deformation-resistant electroplated Ni/electroless Ni/Pt/Ag metallization layers for Ag-sintered joint during a harsh thermal shock
10. Copper diffusion into epoxy under high temperature
11. Influence of Interfacial Interaction Between Various Metal Substrates and Epoxies on Bonding Reliability Under High Temperture
12. Development of micron-sized Ag-Si composite paste die attach material for highly stable microstructure during high temperate aging
13. Enhanced Reliability for Power Modules via a New Ag/Si Sinter Joining Strategy
14. Self-assembled layer as an effective way to block copper diffusion into epoxy
15. Improve the high-temperature reliability of epoxy encapsulation with copper substrates through a copper thiolate complex layer
16. High reliability design Ag sinter joining on softened Ni-P /Pt/Ag metallization substrate during harsh thermal cycling
17. Effect of Aging and Thermal Shock on the Reliability of Silver Sintered Die Attach for SiC Power Devices
18. Novel Al /AlN bonding by micro-sized Ag particles sinter joining in low temperature low pressure air conditions
19. Influence of interfacial interaction on the reliability of the bond between encapsulation epoxy and copper substrate
20. High Performance Wiring Based on Nanowelding Technology for Printed Electronics
21. List of Contributors
22. Chemical bonding copper and epoxy through self-assembled layer
23. Ag die-attach paste modified by WC additive for high-temperature stability enhancement
24. Refinement of the Microstructure of Sn-Ag-Bi-In Solder, by Addition of SiC Nanoparticles, to Reduce Electromigration Damage Under High Electric Current
25. Development of Crack-Less and Deformation-Resistant Electroplated Ni/Electroless Ni/Pt/Ag Metallization Layers for Ag-Sintered Joint During a Harsh Thermal Shock
26. Chemical Bonding of Copper and Epoxy Through Thiol Based Self-Assembled Layer for Post 5g/6g Semiconductors
27. Enhanced reliability of Sn–Ag–Bi–In joint under electric current stress by adding Co/Ni elements
28. Effects of the crystallographic orientation of Sn on the electromigration of Cu/Sn-Ag-Cu/Cu ball joints
29. Effects of reflow atmosphere and flux on Sn whisker growth of Sn–Ag–Cu solders
30. A novel low-temperature solder based on intermetallic-compound phases: Alloy design, high-homologous temperature properties, and reliability
31. Numerical prediction of fraction of eutectic phase in Sn−Ag−Cu soldring using the phase-field method
32. Application 49 - High Performance Wiring Based on Nanowelding Technology for Printed Electronics
33. Self-catalyzed copper–silver complex inks for low-cost fabrication of highly oxidation-resistant and conductive copper–silver hybrid tracks at a low temperature below 100 °C
34. Study on Whisker Growth on Solder-Joints Part I: Study on Acceleration Test Methodd
35. Die-bonding performance and mechanism based on the sintering of micro Ag paste for high power devices
36. Effect of electromigration on mechanical shock behavior in solder joints of surface mounted chip components
37. Effects of additional Ni and Co on microstructural evolution in Sn-Ag-Bi-In solder under current stressing
38. A novel low-temperature solder based on intermetallic-compound phases with superior high-homologous temperature properties
39. Bi based alloy for high temperature leadfree die attach
40. Relationship between reliability and effect of solid solution hardening at solder joints at the high temperature
41. Study on Flux and Alloy of Lead Free Solder with Mitigation Effect and Consideration for Acceleration Test Method
42. Influence of crystallographic orientation of Sn–Ag–Cu on electromigration in flip-chip joint
43. Effects of crystallographic orientation of Sn on electromigration behavior
44. Sn-Ag-Cu Soldering Reliability Influenced by Process Atmosphere
45. Effects of additional Co atoms on microstructural evolution in Sn-Ag-Bi-In solder under current stressing.
46. Effects of the crystallographic orientation of Sn on the electromigration of Cu/Sn-Ag-Cu/Cu ball joints.
47. Sn--Ag--Cu Soldering Reliability as Influenced by Process Atmosphere.
48. A Novel Low-Temperature Solder Based on Intermetallic-Compound Phases: Alloy Design, High-Homologous Temperature Properties and Reliability.
49. Numerical Prediction of Fraction of Eutectic Phase in Sn-Ag-Cu Soldering Using the Phase-Field Method.
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