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5. On a more accurate assessment of scaled copper/low-k interconnects performance

8. 200 V enhancement-mode p-GaN HEMTs fabricated on 200 mm GaN-on-SOI with trench isolation for monolithic integration

12. The 2018 GaN power electronics roadmap

14. Evidence of Time-Dependent Vertical Breakdown in GaN-on-Si HEMTs

16. Degradation of GaN-HEMTs with p-GaN Gate: Dependence on temperature and on geometry

21. Gate Stability of GaN-Based HEMTs with P-Type Gate

22. Performance Optimization of Au-Free Lateral AlGaN/GaN Schottky Barrier Diode With Gated Edge Termination on 200-mm Silicon Substrate

23. MOCVD growth of DH‐HEMT buffers with low‐temperature AlN interlayer on 200 mm Si (111) substrate for breakdown voltage enhancement

27. Correlation of interface states/border traps and threshold voltage shift on AlGaN/GaN metal-insulator-semiconductor high-electron-mobility transistors

28. The impact of the gate dielectric quality in developing Au-free D-mode and E-mode recessed gate AlGaN/GaN transistors on a 200mm Si substrate

30. Direct comparison of GaN-based e-mode architectures (recessed MISHEMT and p-GaN HEMTs) processed on 200mm GaN-on-Si with Au-free technology

31. Combined plasma-enhanced-atomic-layer-deposition gate dielectric and in situ SiN cap layer for reduced threshold voltage shift and dynamic ON-resistance dispersion of AlGaN/GaN high electron mobility transistors on 200 mm Si substrates

34. Breakdown investigation in GaN-based MIS-HEMT devices

41. MOCVD growth of DH-HEMT buffers with low-temperature AlN interlayer on 200 mm Si (111) substrate for breakdown voltage enhancement.

45. (Invited) GaN-on-Si For High-Voltage Applications

46. A 96% Efficient High-Frequency DC–DC Converter Using E-Mode GaN DHFETs on Si

48. Record Breakdown Voltage (2200 V) of GaN DHFETs on Si With 2- $\mu\hbox{m}$ Buffer Thickness by Local Substrate Removal

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