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1. Wafer‐scale Ge epitaxial foils grown at high growth rates and released from porous substrates for triple‐junction solar cells.

2. Wafer‐scale Ge epitaxial foils grown at high growth rates and released from porous substrates for triple‐junction solar cells

4. Fabrication challenges in integrating self-assembled block copolymer process in semiconductor devices

5. (Invited) Challenges on Surface Conditioning in 3D Device Architectures: Triple-Gate FinFETs, Gate-All-Around Lateral and Vertical Nanowire FETs

7. (Invited) Vertical Nanowire FET Integration and Device Aspects

8. Thermal and plasma treatments for improved (sub-)1 nm equivalent oxide thickness planar and FinFET-based replacement metal gate high-k last devices and enabling a simplified scalable CMOS integration scheme

11. Implementing cubic-phase HfO2 with κ-value ∼ 30 in low-VT replacement gate pMOS devices for improved EOT-Scaling and reliability

12. (Invited) Challenges on Surface Conditioning in 3D Device Architectures: Triple-Gate FinFETs, Gate-All-Around Lateral and Vertical Nanowire FETs

14. A Low-Power HKMG CMOS Platform Compatible With Dram Node 2× and Beyond.

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