169 results on '"Vendier, O."'
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2. Silver oxalate-based solders: New materials for high thermal conductivity microjoining
3. Improved thermal management for GaN power electronics: Silver diamond composite packages
4. Compact Self-Biased Q-Band Circulators
5. Finite element modelling of flip chip gold-gold thermocompression bonding
6. Gamma radiation effects on RF MEMS capacitive switches
7. Failure predictive model of capacitive RF-MEMS
8. Circulateur planaire ultra-compact en bande Q
9. Smart MEMS concept for high secure RF and millimeterwave communications
10. Exploring the limits of Arrhenius-based life testing with heterojunction bipolar transistor technology
11. Determination of the thermal resistance and current exponent of heterojunction bipolar transistors for reliability evaluation
12. First potential of nanocomposites for space electronics applications
13. Nanogap MEMS micro-relay with 70 ns switching speed
14. High performance RF-MEMS SP4T switches in CPW technology for space applications
15. RF MEMS ohmic switches for matrix configurations
16. Micromachined filters for space applications
17. Spaceborne L Band High Efficiency 65W SSPA Demonstrator for Navigation and Radar Applications
18. An improved reliability switching network design based on DC contact MEMS switches dedicated to switching matrix applications
19. Optimised thermal and microwave packaging for wide-band gap transistors : diamond & flip chip
20. Main achievements to date toward the use of RF MEMS into space satellite payloads
21. H shape thick slot transition in 50GHz band
22. Flip-chip mounted, Ku band power amplifier compliant with space application
23. HBT technology and reliability for satellite applications, within the relatively new APOS project
24. Reliability Assessment of a New Power Electronics Packaging Material: Silver Diamond Composite
25. Microwave power limiters based on RF-MEMS
26. Silver oxalate: towards a new solder material for highly dissipative electronic assemblies
27. Development of an all-metal large contact force reliable RF-MEMS relay for space applications
28. Use of 3D Packaging Technology for Satellite Active Antennas Front-ends
29. New GaN Power-Electronics Packaging Solutions: A Thermal Analysis Using Raman Thermography
30. Silver diamond composite as a new packaging solution: A thermo-mechanical stability study
31. Sub-hundred nanosecond electrostatic actuated RF MEMS switched capacitors
32. Sub-hundred nanosecond reconfiguration capabilities of nanogap RF MEMS switched capacitor
33. Pattern reconfiguration of microstrip antenna using flip‐chip mounted packaged MEMS
34. New GaN Power-Electronics Packaging Solutions: A Thermal Analysis using Raman Thermography
35. Reliability of Dielectric Less Electrostatic Actuators in RF-MEMS Ohmic Switches
36. Which Architecture to Choose for Robust RF-MEMS Phase Shifters?
37. Investigation of Stiction Effect in Electrostatic Actuated RF MEMS Devices
38. Satellite antennas based on MEMS tunable reflectarrays
39. Use of RF MEMS and micromachined parts to realize highly integrated V band active feed for satellite antennas
40. Reliability modeling of capacitive RF MEMS
41. Multilayer antenna array in Q band for spatial communications
42. MEMS switching circuits for reconfigurable space communication systems
43. Thick-slot transition and antenna arrays in the Q band
44. Solder paste for highly dissipative power electronic assemblies.
45. A high efficiency 140W power amplifier based on a single GaN HEMT device for space applications in L-band.
46. Design, fabrication and measurements of reliable low voltage RF-MEMS switched varactors.
47. A high-power Ka-band RF-MEMS 2-bit phase shifter on Sapphire substrate.
48. A surface-mountable membrane supported filter
49. Narrow Band Micro-Machined Band Pass Filter and a Surface-Mountable Topology
50. Sub-hundred nanosecond reconfiguration capabilities of nanogap RF MEMS switched capacitor.
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