1. 24.7% Record Efficiency HIT Solar Cell on Thin Silicon Wafer
- Author
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Ayumu Yano, Satoshi Tohoda, Kenta Matsuyama, Eiji Maruyama, Yuya Nakamura, Fujita Kazunori, Mikio Taguchi, and Takeshi Nishiwaki
- Subjects
Materials science ,business.industry ,Hybrid silicon laser ,Nanocrystalline silicon ,Quantum dot solar cell ,Condensed Matter Physics ,Polymer solar cell ,Silicon Solar Cell Improvements ,Electronic, Optical and Magnetic Materials ,law.invention ,WAFER-BASED SILICON SOLAR CELLS AND MATERIALS TECHNOLOGY ,Monocrystalline silicon ,law ,Solar cell ,Optoelectronics ,Wafer ,Crystalline silicon ,Electrical and Electronic Engineering ,business - Abstract
28th European Photovoltaic Solar Energy Conference and Exhibition; 748-751, A superb conversion efficiency of 24.7% was achieved in the laboratory stage by using a HIT (heterojunction with intrinsic thin layer) structure with a silicon wafer of practical size (total area of 101.8 cm2) and a thickness of 98 μm. This conversion efficiency is the world’s highest for any crystalline silicon-based solar cell of practical size (100 cm2 and above). We have continued researching to further reduce recombination loss at the hetero interface between the amorphous silicon and crystalline silicon after we announced our former record of 23.7%. By using a new technology that enables the formation of an amorphous silicon layer of even higher quality while limiting the damage to the surface of the crystalline silicon substrate, the open circuit voltage has been improved from 0.745 V to 0.750 V. We also succeeded in cutting down resistive loss by optimizing the design of amorphous silicon layers and improving the electrode structure. As a result, the fill factor has been improved from 0.809 to 0.832. We have also maintained a high current density of 39.5 mA/cm2. The conversion efficiency was certified by the National Institute of Advanced Industrial Science and Technology.
- Published
- 2014
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