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Copper-based conductive ink has received attention to fabricate thin, flexible, and lightweight devices through printing techniques. In particular, the copper formate based conductive inks, called metal organic decomposition (MOD) inks, which are fabricated by using amine ligand coordinated copper formate have been well studied because of higher oxidative resistant against air than that of metallic copper before thermal annealing. The copper formate moiety of amine ligand coordinated copper formate complexes varies by changing the coordinated amine species, however, for the thermal decomposition temperature of such ink is not well understand. Here, we analyzed the influence of the amine ligand on the thermal decomposition temperature drop of copper formate moiety. Amine-copper formate complexes bearing several amine ligands containing primary amine, pyridine, and imidazole groups were fabricated. The relationship between the evaluated decomposition temperature and the differences between the wavenumbers of symmetric and antisymmetric vibration mode peaks in Fourier transform infrared (FTIR) spectra was found to be nearly linear. This finding demonstrates that the thermal decomposition temperature is governed by the structural modification of formate ions by the coordination of amine groups. Based on this finding, the order of thermal decomposition temperature of the copper moiety is predictable by using FTIR measurement. [ABSTRACT FROM AUTHOR]