281 results on '"Wang, Tongqing"'
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2. Publisher Correction to: Computational investigation of a novel metal thickness measurement system with coaxial triple‑coil sensor for chemical mechanical polishing
3. Synthesis of CeO2 Nanoparticles Derived by Urea Condensation for Chemical Mechanical Polishing
4. Polishing mechanisms of various surfactants in chemical mechanical polishing relevant to cobalt interconnects
5. BSAM: A BERT-Based Model with Statistical Information for Personality Prediction
6. Research on weakly alkaline bulk slurries relevant to chemical mechanical polishing for cobalt interconnects
7. The role of dipotassium ethylenediaminetetraacetic acid and potassium oleate on chemical mechanical planarization relevant to heterogeneous materials of cobalt interconnects
8. BSAM: A BERT-Based Model with Statistical Information for Personality Prediction
9. An integrated deep multiscale feature fusion network for aeroengine remaining useful life prediction with multisensor data
10. A reinforcement ensemble deep transfer learning network for rolling bearing fault diagnosis with Multi-source domains
11. Developing an Efficient Forward Design Method for Co Post-CMP Cleaning Formulations Based on Nanoparticle Removal Mechanisms
12. Endpoint Detection Based on Optical Method in Chemical Mechanical Polishing
13. Mechanical wear behavior between CeO2(100), CeO2(110), CeO2(111), and silicon studied through atomic force microscopy
14. Exploiting interaction of fine and coarse features and attribute co-occurrence for person attribute recognition
15. LINC00958 promotes bladder cancer carcinogenesis by targeting miR-490-3p and AURKA
16. Behavioral feature recognition of multi-task compressed sensing with fusion relevance in the Internet of Things environment
17. RE (La, Nd and Yb) doped CeO2 abrasive particles for chemical mechanical polishing of dielectric materials: Experimental and computational analysis
18. Fabrication of Flexible and Transparent Metal Mesh Electrodes Using Surface Energy‐Directed Assembly Process for Touch Screen Panels and Heaters
19. The effect of citric acid based cleaning solution on particle adhesion and removal during post-Cu CMP cleaning
20. Potassium persulfate as an oxidizer in chemical mechanical polishing slurries relevant for copper interconnects with cobalt barrier layers
21. A high capacity reversible data hiding scheme based on right-left shift
22. Synthesis of CeO2 Nanoparticles Derived by Urea Condensation for Chemical Mechanical Polishing.
23. Roles of Phthalic Acid and Oleic Acid on Chemical Mechanical Polishing in Alkaline Slurries for Cobalt Interconnects
24. Slurry System Establishment And Optimization For Advanced Cobalt Interconnect Metallization
25. The Role of Diethanolamine on Chemical Mechanical Polishing in Alkaline Glycine-Based Slurries for Cobalt Interconnects
26. Research on Polishing Mechanisms of Various Surfactants in Chemical Mechanical Polishing Relevant to Cobalt Interconnects
27. Metal Thickness Measurement System Based on a Double-Coil Eddy-Current Method With Characteristic Ratio Detection
28. Comparative study of the lubricating behavior between 12-in. copper disk and wafer during chemical mechanical polishing
29. Improvement of via dishing and non-uniformity in TSV chemical mechanical planarization
30. Effects of KIO4 concentration and pH values of the solution relevant for chemical mechanical polishing of ruthenium
31. Material removal mechanism of copper chemical mechanical polishing in a periodate-based slurry
32. Chemical effects on the tribological behavior during copper chemical mechanical planarization
33. Mechanism Analysis of Megasonic and Brush Cleaning Processes for Silicon Substrate after Chemical Mechanical Polishing
34. Extracting Discriminative Parts with Flexible Number from Low-Rank Features for Human Action Recognition
35. Corrosion Investigations of Ruthenium in Potassium Periodate Solutions Relevant for Chemical Mechanical Polishing
36. Synergetic effect of potassium molybdate and benzotriazole on the CMP of ruthenium and copper in KIO4-based slurry
37. Defect Law of Cu/Co Patterned Wafers After Using a Novel Bulk/Barrier Slurry and Cleaning Solution
38. Crack Image Enhancement of Track Beam Surface Based on Nonsubsampled Contourlet Transform
39. An Automatic Thresholding for Crack Segmentation Based on Convex Residual
40. Optimization of design of experiment for chemical mechanical polishing of a 12-inch wafer
41. Wafer bending/orientation characterization and their effects on fluid lubrication during chemical mechanical polishing
42. In-situ measurement of Cu film thickness during the CMP process by using eddy current method alone
43. Effect of zone pressure on wafer bending and fluid lubrication behavior during multi-zone CMP process
44. Augmenting bag-of-words: a robust contextual representation of spatiotemporal interest points for action recognition
45. Effect of a Cu seed layer on electroplated Cu film
46. Electrochemical investigation of copper passivation kinetics and its application to low-pressure CMP modeling
47. Anisotropic clustering on surfaces for crack extraction
48. Extracting Refined Low-Rank Features of Robust PCA for Human Action Recognition
49. Tribocorrosion Study of Copper During Chemical Mechanical Polishing in Potassium Periodate-Based Slurry
50. Mechanism Analyses of Megasonic and Brush on Post Si Cmp Cleaning Process
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