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Chip-on-Wafer-on-Substrate with Si interposer (CoWoS-S) is a TSV-based multi-chip integration technology that is widely used in high performance computing (HPC) and artificial intelligence (AI) accelerator area due to its flexibility to accommodate multiple chips of SoC, chiplet, and 3D stacks such as high bandwidth memory (HBM). The interposer size increases steadily over the past few years, from one full reticle size (∼830 mm2) to two reticle size (∼1700 mm2). The growth of interposer size offers more integration power to accommodate more active silicon in a package to satisfy the HPC/AI needs. In this paper, we report the new 5th generation CoWoS-S (CoWoS-S5) based on a Si interposer as large as three full reticle size (∼2500 mm2) by a novel 2-way lithography stitching approach. This will accommodate a multiple of logic chips at a total area of 1200 mm2 (with chiplets) together with eight HBM stacks. Besides the dimensional increase of the Si interposer, new features are incorporated to further enhance the electrical and thermal performances of CoWoS-S5 compared with the previous CoWoS-S portfolio. These include an integrated deep trench capacitor (iCap) for enhanced power integrity, 5 layers of sub-micron Cu interconnect with reduced sheet resistance to satisfy high speed die to die interconnect, new TSV structure interposer for both return and insertion loss reduction, and a higher thermal conductivity thermal interface material (TIM) to achieve a lower thermal resistance. Component level reliability with excellent electrical and physical results are also discussed.

One of the prominent challenges for widespread adoption of silicon photonics (SiPh) technology is the availability of an integration platform that can simultaneously meet a wide range of power, performance, and cost criteria in different applications. As a result, there is a diversity of SiPh integrated solutions proposed or demonstrated, but none is considered as a common solution. In this paper, we will first survey industry proposed photonic engine structures in monolithic and heterogeneous integration on their strengths and weaknesses. We will then propose a compact and universal PE structure - COUPE (COmpact Universal Photonic Engine) that could consolidate different requirements onto the same integration platform. COUPE has the electrical IC – photonic IC integration with the electrical interface designed to minimize the EIC-PIC coupling loss. Compared with industry proposed PE technology, COUPE can provide low insertion loss for both grating coupler (GC) and edge coupler (EC). For either GC or EC, the COUPE is a solid structure without cavities or mechanically weak parts, thus enabling low insertion loss without contamination or mechanical concerns. COUPE also has the flexibility to be integrated easily with host ASIC to form a co-package structure. The COUPE integration scheme can meet the most demanding system requirements and pave the way for SiPh-based wafer level system integration (WLSI) for high performance computing applications.

The electrical characterization of System on Integrated Chips (SoIC™), an innovative 3D heterogeneous integration technology manufactured in front-end of line with known-good-die is reported. Chiplets integration of devices including foundry leading edge 7nm FinFET technology with SoIC™ illustrates its advantages in high bandwidth density and high power efficiency, as compared with 2.5D and conventional 3D-IC with micro-bump/TSV.

Online travel Web sites have been the most frequently visited online information facilities by travelers. To evaluate the effectiveness of a travel Web site, the Web site manager should regularly check whether or not it is fulfilling the objectives that were established for it. This research uses a strategic Web site evaluation framework to introduce a five-stage process for examining the consistency of Web site’s presence and its intended strategies. Two leading online travel agencies with different business strategies are selected to demonstrate methods of implementing a strategic evaluation framework and to compare the evaluation results. A hierarchical evaluation structure is introduced to explicitly delineate the two Web sites’ different strategy intentions and related evaluation criteria. Results show that an individual Web site’s strategy-inconsistent criteria can be easily identified through a gap analysis and criteria performance matrix. A strategy-inconsistent dimension can be discovered through a radar chart analysis of the 4PsC (Product, Promotion, Price, Place, and Customer Relationship) dimensions and a transaction phases analysis.

Many studies have proposed new website evaluation frameworks and criteria. We have attempted to understand and improve website evaluation through the analysis of 83 articles by classifying them into IS, marketing, and combined-approaches. Our findings showed that most early studies adopted the IS-approach but that later ones (after the burst of the dot-com bubble) shifted to a combined-approach. Our study also revealed that most papers analyzed the evaluation factors via a ranking list. Our review showed that most studies conducted user-based surveys to examine a website, but that very few addressed strategic issues of website evaluation. We therefore proposed a strategic framework as an internal evaluation to ensure consistency between web strategy and actual website presence. The framework involved analysis of web strategy and a hybrid approach that included evaluation during three transaction phases; the framework was designed to be applied by a specific website vis-a-vis its goals and objectives through a five-stage evaluation process.

The nickel aluminide intermetallic matrix composites (IMC), Ni76Al24B0.1 with either 5 or 10 vol pct α-Al2O3, were synthesized through a multistage sintering approach from the elemental powders of Ni, Al, and oxide of α-Al2O3. An electroless nickel-boron (Ni-B) plating process was adopted to improve the contacted interface between the reinforced oxide ceramics and the metal matrix, as well as to supply the atomic scale boron in the metallic matrix of the IMCs. The entire process comprises steps involving preparing a powdery starting material, sealing it within a metal sheath or can, compacting or cold deforming it, preliminarily heating the compacted material at a relatively low temperature, executing a pore-eliminating (mechanical deforming) process to eliminate the pores resulting from the preceding heating step, and sintering the material at a relatively high temperature to develop a transient liquid phase to heal or to eliminate any microcracks, crazes, or collapsed pores from the previous steps. Most of all, it is important that contact with a heat absorbent material, such as a metal sheath, produces the Ni2Al3 phase during preliminary heating. This new phase is a brittle and crispy material with a low melting point (1135 °C). It has been found to play an important role in preventing any significant cracks during the pore-eliminating process and in developing a transient liquid phase in the following 1200 °C sintering step. This multistage sintering with a heat absorbent process is beneficial for producing a product that has large dimensions, a desirable shape, good density, and excellent mechanical properties. The resulting elongation of tensile tests in air reaches 14.6 and 8.9 pct for the present 5 and 10 vol pct powder metallurgy IMCs, respectively.

In this era of technological explosion, managers are faced with the challenge of how to maintain technological leadership and provide the best possible technology for the customer. This paper presents a practical approach to measuring the productivity of technology in product development. The approach takes advantage of quality function deployment and total productivity of Edosomwan (Integrating Productivity and Quality Management, Marcel Dekker, New York, 1987) to balance the market-pull and technology-push. The efficiency and effectiveness of technology development are measured. This information may support managers for the decision in the subsequent technology investments and divisional resource allocations.

To achieve ultra small form factor package solution, an ultra-thin (50µm) Si interposer utilizing through-silicon-via (TSV) technology has been developed. Challenges associated with handling thin wafer and maintaining package co-planarity have been overcome to stack thin dies (200 µm) on ultra-thin interposer. Improved electrical performance and the advantages of this innovative thin interposer are highlighted in this paper. Warpage behavior is investigated with simulation and experiments to ensure reliability and robustness of the Si stack. Reduction in package thickness is realized to achieve high functionality, small form factor, better electrical performance and robust reliability by stacking thin dies on ultra-thin interposer.

The major problem to synthesize Ni[sub 3]Al components with common PM facilities is the large shrinkage porosity generated from reacted Ni and Al powders after being sintered, which are also found in many self-propagating high-temperature synthesis (SHS). Cold working to collapse the sintered pores, then healing followed by annealing treatment is found difficult to conduct on porous Ni[sub 3]Al products due to the great strength of this material. A multi-stage sintering with preliminary heating to cause reactive sintering of Al and Ni powders followed by cold working to collapse and to eliminate primary pores, then sintering at high temperature to heal the collapsed pores and to transform the phase to final Ni[sub 3]Al appears ideal. However, the primary product NiAl phase from reactive sintering was found too brittle to deform, as they authors discuss subsequently. Here they propose a possible approach to almost fully densified Ni[sub 3]Al PM products with simple laboratory facilities with a technique to decrease the temperature of a specimen during the preliminary reactive sintering process of Ni and Al compacted powders.

Specimens of Ni3Al + B of high density (>99.3 Pct RD) and relatively large dimension have been synthesized from composite powders through processes of replacing plating and electroless Ni-B plating on Al powder, sintering, and thermal-mechanical treatment. The uniformly coated Ni layer over fine Al or Ni core particles constituting these coating/core composite powders has advantages such as better resistance to oxidation relative to pure Al powder, a greater green density as a compacted powder than prealloyed powder, the possibility of atomically added B to the material by careful choice of a suitable plating solution, and avoidance of the expensive powder metallurgy (PM) equipment such as a hot isostatic press (HIP), hot press (HP),etc. The final Ni3Al + B product is made from Ni-B-Al and Ni-B-Ni mixed composite powders by means of traditional PM processes such as compacting, sintering, rolling, and annealing, and therefore, the dimensions of the product are not constrained by the capacity of an HIP or HP. The properties of Ni3Al composite powder metallurgy (CPM) specimens tested at room temperature have been obtained, and comparison with previous reports is conducted. A tensile elongation of about 16 Pct at room temperature was attained.

An orthotropic stress field was observed in the vicinity of the Cu-filled TSV on nominal (100) silicon substrate from both μRaman measured data and validated FEM result. The orthotropic elastic behavior of silicon in the (100) plane is believed to be the reason. The FEM model was further validated by the comparison with the measured electrical data, and used to predict the device performance shift under the influence of the TSV-induced stress. The performance shift pattern also showed an orthotropic pattern. This finding has profound implication on 3D silicon stacking design rule and system integration.

In the past, most studies used Technology Acceptance Model (TAM) to test the degree of technology acceptance and usability test to measure the task performance respectively. However, the relationship between TAM and usability has not been addressed. In this paper, an E-learning task was tested and validated with PDA. The findings show that TAM seems more suitable for general purpose context and usability test seems more reasonable and consistency for task-based context.

University libraries are currently facing their greatest challenge. For more than a decade, university libraries have been under the pressure to change its way of operation and management due to the tight of budget and the appearance of online resources. These situations cause the libraries to value their development of resources and the application of business marketing to better service. How to retain and grow users through enhancement of service becomes the great concern by library managers. Customer relationship management (CRM) is not a tactical or functional approach but a key strategic process. A comprehensive CRM will highlight the preference and learning needs of readers individually for cost saving and enhance the retention and loyalty. We aim to propose an integrated conceptual framework implying with business marketing plan and CRM perspective through literature finding.

A three dimensional integrated circuit (3DIC) integration flow, process and electrical results are reported. Well-controlled high aspect ratio (AR=8:1 and AR=15:1) through silicon vias (TSVs) were successfully filled with both copper (Cu) and tungsten (W). Metal to metal diffusion bonding was demonstrated with good uniformity and resulted in good electrical performance. For the first time, a cost effective wafer thinning without decreasing effective area by a proprietary process is described. By wafer level electrical testing, yielding 20K through silicon vias with aspect ratio of 15:1 and resistance of through silicon via chain are demonstrated.

Mobile network creates an environment that is convenient with fast communication and no localisation restriction in which it is a perfect network environment for mobile commerce websites in developing business information applications and services. Consumers decide to leave or stay on the website not only depending on the quality of the services, but also consider the usability of the website which will be the crucial factor. This study focused on how website can offer better usability to consumer with higher efficiency, effectiveness, learnability and memorability. Experimental questionnaire has been used to evaluate the usability in different mobile websites. The results showed that there are significant differences between different websites in effectiveness and learnability. It also found that 'registration process' at Yahoo! Shopping Mall's cause confusion for many users during the shopping procedure. This study proposed several suggestions for mobile website to improve the usability after analysing the problems.

Our review shows that most studies conducted user-based surveys to examine a website, but very limited researches addressed web strategic issues on website evaluation. The authors proposed a strategic framework to ensure consistency between web strategy and actual website presence. To build up a strategic framework, we integrated web strategies and a hybrid marketing and information technology criteria into an online transactional process. The framework was designed for application towards a specific website in regards to its goals and objectives, not for an industry or the internet in general. This strategic framework implementation was illustrated by a travel website evaluation and results were discussed.

We aimed to propose a collaborative commerce capability assessment model and examined its implementation in Taiwan's companies. This model is based on the Six Sigma DMAIC process (define, measure, analyse, improve and control) which is an enhancement system for existing business processes falling below specification and looking for incremental improvement. 'Information Technology capability', 'data management capability', 'process management capability', 'organisation management capability', 'knowledge management capability' and 'collaborative commerce capability' are the measurement indicators which were concluded from literature studies. Data collected via a survey of executive managers in the Central Taiwan Science Park (CTSP) and an interview with over 10 years experienced experts. The results indicated that this model have a positive impact on the improvement of business performance. These conclusions should help managers to revisit their priorities in terms of the relative efforts in the application of these indicators and capability. Implication and future study have been provided.

This study provides an overview and guideline of website evaluation by selecting 139 articles from 21 leading journals to identify the development trend and analyse the proposed frameworks and criteria. The authors classified the selected studies into Information Systems (IS), marketing, and combination approaches and identify the number of citation for each criterion introduced in each study. The study shows that the dominant trend in website evaluation has shifted from an IS approach to a combination approach during the past 10 years. The most cited criteria in selected studies are identified. The study suggests a comprehensive evaluation framework need to be integrated with web strategy and using a hybrid structure to include IS and marketing criteria.

A successful E-book market needs several members to work together including authors, publishers, online book stores, book distributors, reading device manufactures and so on. Although various participants have actively involved in Taiwan digital publishing, the sales of E-book is still less than 1% of total publishers’ revenues in 2011. Compared with North America market share, Taiwan's E-book market share is not meaningful. As a matter of fact, Taiwan readers are facing a dilemma in which there is a lack of E-book title and no proper reading device available. This study examines the current status of Taiwan E-book market from the E-book supply chain members’ points of view. We adopted an exploratory approach to provide different perspectives of these members through semi-structured interviews. This study result shows that government regulations, quality content, E-book titles availability, E-book price and reading device price are considered as most challenging factors facing Taiwan E-book publishing industry.