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5 results on '"Xun-qing Shi"'

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1. Understanding of Delamination Mechanism of Anisotropic Conductive Film (ACF) Bonding in Thin Liquid Crystal Display (LCD) Module

2. Effects of bismuth on growth of intermetallic compounds in Sn-Ag-Cu Pb-free solder joints

3. Warpage reduction of package-on-package (PoP) module by material selection & process optimization

4. Failure modes in microelectronic packages

5. Reverse-multiplicate method of moire interferometry and application to measure deformation of a microelectronic package

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