1. Mask qualification of a shifted gate contact issue by physical e-beam inspection and high landing energy SEM review : DI: Defect Inspection and Reduction
- Author
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Jay Shah, Chih-Chung Huang, Victor Aristov, Hsiao-Chi Peng, Hoang Nguyen, Felix Levitov, Yashdeep Khopkar, A. Jain, and John G. Sheridan
- Subjects
010302 applied physics ,Materials science ,business.industry ,Design of experiments ,02 engineering and technology ,Overlay ,01 natural sciences ,Reduction (complexity) ,0103 physical sciences ,Trench ,0202 electrical engineering, electronic engineering, information engineering ,Electron beam processing ,Optoelectronics ,020201 artificial intelligence & image processing ,Wafer ,Photomask ,business ,Energy (signal processing) - Abstract
Photomask issues can result in shifted pattern defects printed on the wafer. In the case of sub-1x nm nodes, these pattern defects of interest (DOI) can be difficult for conventional optical inspections to detect. In this paper we present a case study of a new mask qualification for a MOL gate open (GO) contact mask layer. The new mask was introduced to compensate for a known open between trench silicide (TS) contact and GO. During qualification, a shift in the GO overlay was seen on one section of the wafer and suspected to be the cause of a TS-gate short. A Design of Experiments (DOE) was created to investigate if the issue was solely mask related or if it could be mitigated during processing (litho/etch). Physical mode e-beam inspection was used to monitor the DOE wafers, however the resolution of the e-beam inspection tool was not sufficient to conclusively classify the defects observed. A high resolution, high landing energy SEM defect review was introduced post e-beam inspection to better monitor the splits running as part of the DOE.
- Published
- 2019