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This paper describes the design and performance of a 64-channel equalization and blocking filter. It utilizes a free space lens and grating multiplexer with micromechanical tilt mirrors providing variable attenuation. The module achieves a 5-dB insertion loss with a 3-dB passband of 87 GHz for 100-GHz spaced channels. The attenuation range achieved is in excess of 35 dB, making it suitable for wavelength blocking in switching applications. The device has been demonstrated to be compatible with 10- and 40-Gb/s transmission.

Recently, optical MEMS devices have gained considerable attention in the telecommunications industry -- particularly in the optical networking and switching arenas. Since optical MEMS are micro-systems which rely on high precision optics, electronics and mechanics working in close concert, these emerging devices pose some unique packaging challenges yet to be addressed by the general packaging industry. Optical MEMS packages often are required to provide both optical and electrical access, hermeticity, mechanical strength, dimensional stability and long-term reliability. Hermetic optical access necessitates the use of metallized and anti- reflection coated windows, and ever-increasing electrical I/O count has prompted the use of higher density substrate/package technologies. Taking these requirements into consideration, we explore three ceramic packaging technologies, namely High Temperature Co-fired Ceramic (HTCC), Low Temperature Co-fired Ceramic (LTCC) and thin-film ceramic technologies. In this paper, we describe some optical MEMS packages designed using these three technologies and discuss their substrate designs, package materials, ease of integration and assembly.© (2001) COPYRIGHT SPIE--The International Society for Optical Engineering. Downloading of the abstract is permitted for personal use only.

We present a reconfigurable wavelength-selective switch that independently distributes 128 input WDM channels to four output ports. The switch is based on bulk optics and MEMS micro-mirrors, exhibits

As telecom networks increase in complexity there is a need for systems capable of manage numerous optical signals. Many of the channel-manipulation functions can be done more effectively in the optical domain. MEMS devices are especially well suited for this functions since they can offer large number of degrees of freedom in a limited space, thus providing high levels of optical integration. We have designed, fabricated and tested optical MEMS devices at the core of Optical Cross Connects, WDM spectrum equalizers and Optical Add-Drop multiplexors based on different fabrication technologies such as polySi surface micromachining, single crystal SOI and combination of both. We show specific examples of these devices, discussing design trade-offs, fabrication requirements and optical performance in each case.

A field-programmable multi-chip module containing one ORCA 3T/125 FPGA and 4 MByte DRAM was built using chip-on-chip technology. Module architecture and physical design issues are presented. A PCI board consisting of four chip-on-chip modules is also built as the test vehicle. The design environment for this multi-chip module, including visual or C++ design entry and bit-serial datapath synthesis system, is also discussed. Some ongoing approaches, like double-flip technology and area I/O are also addressed.

Micro-optoelectromechanical systems (MOEMS) having valuable performance, size, and cost attributes offer novel solutions to the design of lightwave network elements. We will discuss the new challenges that realizing these benefits presents to the field of photonic packaging.

Recently, optical MEMS devices have gained considerable attention in the telecommunications industry -- particularly in the optical networking and switching arenas. Since optical MEMS are micro-systems which rely on high precision optics, electronics and mechanics working in close concert, these emerging devices pose some unique packaging challenges yet to be addressed by the general packaging industry. Optical MEMS packages often are required to provide both optical and electrical access, hermeticity, mechanical strength, dimensional stability and long-term reliability. Hermetic optical access necessitates the use of metallized and anti- reflection coated windows, and ever-increasing electrical I/O count has prompted the use of higher density substrate/package technologies. Taking these requirements into consideration, we explore three ceramic packaging technologies, namely High Temperature Co-fired Ceramic (HTCC), Low Temperature Co-fired Ceramic (LTCC) and thin-film ceramic technologies. In this paper, we describe some optical MEMS packages designed using these three technologies and discuss their substrate designs, package materials, ease of integration and assembly.© (2001) COPYRIGHT SPIE--The International Society for Optical Engineering. Downloading of the abstract is permitted for personal use only.

Spatial light modulators (SLMs) designed to replace photomasks for optical lithography have been designed, fabricated, and tested. These microelectromechanical devices are fabricated with alternating polycrystalline Si and sacrificial SiO2 layers that are patterned by a 193nm wavelength scanner to dimensions as small as 150nm. Aerial image simulations were used to define the mechanical requirements of the devices. Piston motion of electrically actuated devices was measured with an optical profilometer. The measurements were fit to a simple equation to within 1nm precision, which is adequate for defining 50nm features lithographically. Transient response measurements show that one version of the SLM responds to actuation as quickly as 20μs, fast enough for current 193nm wavelength excimer laser sources.