24 results on '"Yin, Jingfei"'
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2. Machinability of submillimeter holes in ceramic matrix composites by high-frequency ultrasonic vibration-assisted drilling
3. Analysis of the spatiotemporal pattern of the gathering and dispersal of evacuated people in large and medium-sized cities after strong earthquakes
4. Feasibility of polarized laser scattering in detecting the grinding-induced subsurface damage in SiCf/SiC ceramic matrix composite
5. Sensitivity of polarized laser scattering detection to subsurface damage in ground silicon wafers
6. Influence of alumina abrasive tool wear on ground surface characteristics and corrosion properties of K444 nickel-based superalloy
7. Edge chipping characteristics in grinding SiCf/SiC composite
8. Comparative Study of Rapid Assessment Methods for Earthquake-Triggered Landslides Based on the Newmark Model—A Case Study of the 2022 Luding Ms6.8 Earthquake.
9. High-performance grinding of ceramic matrix composites.
10. Depolarization of surface scattering in polarized laser scattering detection for machined silicon wafers
11. Rapid determination of seismic influence field based on mobile communication big data—A case study of the Luding Ms 6.8 earthquake in Sichuan, China
12. Alumina abrasive wheel wear in ultrasonic vibration-assisted creep-feed grinding of Inconel 718 nickel-based superalloy
13. An analytical model to predict the depth of sub-surface damage for grinding of brittle materials
14. Effects of grinding speed on the material removal mechanism in single grain grinding of SiCf/SiC ceramic matrix composite
15. Grain wear evolution of cubic boron nitride abrasives during single grain grinding of powder metallurgy superalloy FGH96
16. Two-dimensional detection of subsurface damage in silicon wafers with polarized laser scattering
17. Flow field and cooling capacity in workpiece-tool contact zone during ultra-high speed grinding
18. Generation mechanism modeling of surface topography in tangential ultrasonic vibration-assisted grinding with green silicon carbide abrasive wheel
19. Generation mechanism modeling of surface topography in tangential ultrasonic vibration-assisted grinding with green silicon carbide abrasive wheel.
20. Quantitative analysis of collective earthquake evacuation behavior in large cities post-earthquake
21. The ‘skin effect’ of subsurface damage distribution in materials subjected to high-speed machining
22. Formation of subsurface cracks in silicon wafers by grinding
23. Performance of high-frequency ultrasonic vibration-assisted drilling of ceramic matrix composites
24. Influence of alumina abrasive tool wear on ground surface characteristics and corrosion properties of K444 nickel-based superalloy
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