209 results on '"Zhao, Dewen"'
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2. Mesoporous CoxWO4-sensing platform toward ethanol detection
3. Cutting speed dependence of material removal mechanism for monocrystal silicon
4. Prediction and measurement for grinding force in wafer self-rotational grinding
5. Ductile deformation and subsurface damage evolution mechanism of silicon wafer induced by ultra-precision grinding process
6. Effects of grinding-induced surface topography on the material removal mechanism of silicon chemical mechanical polishing
7. Influence of anisotropy on material removal and deformation mechanism based on nanoscratch tests of monocrystal silicon
8. Novel analytical heat source model for cold rolling based on an energy method and unified yield criterion
9. Atomic-scale study on particle movement mechanism during silicon substrate cleaning using ReaxFF MD
10. Optimization solution of vertical rolling force using unified yield criterion
11. Effects of wheel spindle vibration on surface formation in wafer self-rotational grinding process
12. Undeformed chip width non-uniformity modeling and surface roughness prediction in wafer self-rotational grinding process
13. The material removal and surface generation mechanism in ultra-precision grinding of silicon wafers
14. Fabrication of Flexible and Transparent Metal Mesh Electrodes Using Surface Energy‐Directed Assembly Process for Touch Screen Panels and Heaters
15. Cutting speed dependence of material removal mechanism for monocrystal silicon
16. Prediction of Pad Wear Profile and Simulation of Its Influence on Wafer Polishing
17. Flatness maintenance and roughness reduction of silicon mirror in chemical mechanical polishing process
18. Numerical investigation of wafer drying induced by the thermal Marangoni effect
19. Surface figure control in fine rotation grinding process of thick silicon mirror
20. Hydrodynamic Investigation of Ultraclean Wafer Drying Combining Marangoni Effect and Centrifugal Force
21. Kinetics Modelling of Isothermal Bainite Transformation in Low Carbon Multi-Microalloyed Steel
22. Analysis of Hot Rolling with Simplified Weighted Velocity Field and My Criterion
23. Comparative study of the lubricating behavior between 12-in. copper disk and wafer during chemical mechanical polishing
24. Microstructure, Composition, and Impact Toughness Across the Fusion Line of High-Strength Bainitic Steel Weldments
25. Mechanism Analysis of Megasonic and Brush Cleaning Processes for Silicon Substrate after Chemical Mechanical Polishing
26. Application of parabolic velocity field for the deformation analysis in hot tandem rolling
27. Analysis of edge rolling based on continuous symmetric parabola curves
28. The calculation of vertical rolling force by using angular bisector yield criterion and Pavlov principle
29. An Investigation on the Total Thickness Variation Control and Optimization in the Wafer Backside Grinding Process
30. A novel analytical heat source model for cold rolling based on the energy method and unified yield criterion
31. Analysis of plate rolling by MY criterion and global weighted velocity field
32. Limit analysis based on GM criterion for defect-free pipe elbow under internal pressure
33. Optimization of design of experiment for chemical mechanical polishing of a 12-inch wafer
34. Wafer bending/orientation characterization and their effects on fluid lubrication during chemical mechanical polishing
35. In-situ measurement of Cu film thickness during the CMP process by using eddy current method alone
36. Effect of zone pressure on wafer bending and fluid lubrication behavior during multi-zone CMP process
37. Mechanism Analyses of Megasonic and Brush on Post Si Cmp Cleaning Process
38. A kinematic model describing particle movement near a surface as effected by Brownian motion and electrostatic and Van der Waals forces
39. Optimization solution of vertical rolling force using unified yield criterion
40. Deduction of geometrical approximation yield criterion and its application
41. Chemical mechanical polishing: Theory and experiment
42. Contact stress non-uniformity of wafer surface for multi-zone chemical mechanical polishing process
43. Effect of slurry injection position on material removal in chemical mechanical planarization
44. Effect of direct quenching on microstructure and mechanical properties of a wear-resistant steel
45. Effect of Ti-enriched Carbonitride on Microstructure and Mechanical Properties of X80 Pipeline Steel
46. The Optimization Solution of the Vertical Rolling Force by Using Unified Yield Criterion
47. Marangoni Force Assisted Spreading and Printing of Nanometer‐Thick Polymer Films for Ubiquitous Optoelectronic Devices
48. Analysis of deformations of rolls in the six-high tandem mill on the basis of anti-symmetry rotation
49. Effect of reheat temperature on continuous cooling bainite transformation behavior in low carbon microalloyed steel
50. Microstructural evolution and toughness in the HAZ of submerged arc welded low welding crack susceptibility steel
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