101 results on '"Zhao, Shuaijie"'
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2. Passivation characteristics and corrosion behavior of S32202 duplex stainless steel in different temperatures polluted phosphoric acid
3. Safety assessment for autonomous vehicles: A reference driver model for highway merging scenarios
4. Flow regime discrimination and methodology for calculating discharge in trapezoidal sluice gates
5. Effects of high temperature and high humidity on the reliability of copper/epoxy bond
6. Research on the construction of weaponry indicator system and intelligent evaluation methods
7. Investigation of the influence of aluminum surficial water on aluminum-plastic hybrids through a combined experimental and simulation approach
8. Influence of interfacial interaction on the reliability of the bond between encapsulation epoxy and copper substrate
9. Large-scale bare Cu bonding by 10 μm-sized Cu–Ag composite paste in low temperature low pressure air conditions
10. Effect of thermal condition on isothermal-pressing joined strength of silanized Al alloy/carbon fiber-reinforced polyamide-6
11. Failure mechanisms of the bonded interface between mold epoxy and metal substrate exposed to high temperature
12. The Variation Characteristic of EMG Signal Under Varying Active Torque: A Preliminary Study
13. Chemical bonding of copper and epoxy through a thiol-based layer for post 5G/6G semiconductors
14. Research on mobile robot path planning in complex environment based on DRQN algorithm
15. Experimental investigation of the anchoring effect of aluminum/amorphous-plastics joints fabricated by injection molded direct joining
16. Variational Wavelet Ensemble Empirical (VWEE) Denoising Method for Electromagnetic Ultrasonic Signal in High-Temperature Environment with Low-Voltage Excitation
17. Improved electric-field-induced strain and strong photoluminescence properties in novel Er3+-modified 0.93Bi0.5Na0.5TiO3-0.07BaTiO3 multifunctional ceramics
18. Copper diffusion into epoxy under high temperature
19. Influence of fluidity improver on metal-polymer direct joining via injection molding
20. The Variation Characteristic of EMG Signal Under Varying Active Torque: A Preliminary Study
21. Chemical interaction at the interface of metal–plastic direct joints fabricated via injection molded direct joining
22. Experimental analysis on mechanical interlocking of metal–polymer direct joining
23. Influence of Interfacial Interaction Between Various Metal Substrates and Epoxies on Bonding Reliability Under High Temperture
24. Flow Regime Discrimination and Methodology for Calculating Discharge in Trapezoidal Sluice Gates
25. Manufacturing aluminum/polybutylene terephthalate direct joints by using hot water–treated aluminum via injection molding
26. A Review of Cockpit-driving Integration for Human-centric Autonomous Driving
27. Self-assembled layer as an effective way to block copper diffusion into epoxy
28. Improve the high-temperature reliability of epoxy encapsulation with copper substrates through a copper thiolate complex layer
29. Influence of interfacial interaction on the reliability of the bond between encapsulation epoxy and copper substrate
30. Statistical and Artificial Intelligence Analyses of Blast Treatment Condition Effects on Blast-Assisted Injection Molded Direct Joining
31. A New Denoising Method VSCE for High-Temperature Shear Wave Electromagnetic Ultrasonic Defect Detection at a Low Excitation Voltage
32. A new denoising method VSCE for high-temperature shear wave electromagnetic ultrasonic defect detection at a low excitation voltage
33. Flow Regime Discrimination and Methodology for Calculating Submerged Outflow Rates in Trapezoidal Sluice Gates
34. Multi-Scale Infrared Military Target Detection Based on 3X-FPN Feature Fusion Network
35. Application of Adaptive Filtering Based on Variational Mode Decomposition for High-Temperature Electromagnetic Acoustic Transducer Denoising
36. Interface-Mechanical and Thermal Characteristics of Ag Sinter Joining on Bare DBA Substrate During Aging, Thermal Shock and 1200 W/cm2 Power Cycling Tests
37. Chemical bonding copper and epoxy through self-assembled layer
38. Bearing-only passive formation control for UAVs cluster: a case study of a 10-UAV circular formation
39. Chemical Bonding of Copper and Epoxy Through Thiol Based Self-Assembled Layer for Post 5g/6g Semiconductors
40. Development of 10µm-Sized Cu-Ag Composite Paste for Large Area and Robust Bare Cu Bonding in Low Temperature Low Pressure Air Conditions
41. Dual‐band filter based on air‐filled SIW cavity for 5G application
42. Interface-Mechanical and Thermal Characteristics of Ag Sinter Joining on Bare DBA Substrate During Aging, Thermal Shock and 1200 W/cm 2 Power Cycling Tests.
43. 金属樹脂直接成形接合の接合メカニズムに関する研究
44. A New Image Encryption Algorithm Based on 2D-LSIMM Chaotic Map
45. WiFi location method based on TSNE-KNN
46. An Improved Method for Indoor Positioning of Wifi Based on Location Fingerprint
47. A Wifi Positioning Method Based on Stack Auto Encoder
48. WiFi location method based on TSNE-KNN
49. Dual‐band filter based on air‐filled SIW cavity for 5G application
50. Bearing-only passive formation control for UAVs cluster: a case study of a 10-UAV circular formation.
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