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1. Effect of interparticle electrostatic interactions on the dielectric response of 0–3 connectivity particle/polymer composites for high energy density storage.

2. Numerical Study of Negative Corona Discharge Characteristics at Different Electrode Gap Spacing.

3. Prediction on effective permittivity of 0–3 connectivity particle/polymer composites at low concentration with finite element method.

4. Effect of fiber alignment on dielectric response in the 1–3 connectivity fiber/polymer composites by quantitative evaluation.

5. Prediction of high-temperature polymer dielectrics using a Bayesian molecular design model.

6. A Bilayer High-Temperature Dielectric Film with Superior Breakdown Strength and Energy Storage Density.

7. Structural, electrical, and thermal features of polyimide composites filled with semiconductive MXene sheets.

8. All‐Organic Dielectrics with High Breakdown Strength and Energy Storage Density for High‐Power Capacitors.

9. Enhancement of breakdown strength of multilayer polymer film through electric field redistribution and defect modification.

10. Effect of high-thermal conductivity epoxy resin on heat dissipation performance of saturated reactor.

11. Long-term capacitance variation characteristics, law extraction, single and collaborative prediction of film capacitors at room temperature and humidity.

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