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The influence of Na2CO3 on RF4-type waste printed circuit board (PCB) thermal degradation process in air atmosphere was studied with thermogravimetric analysis, and the reaction kinetics was calculated based on the Coats – Redfern method. It is shown that the weight loss process of WPCB in air atmosphere includes three stages. Addition of Na2CO3 decreases the initial temperature of the first weight loss stage of WPCB, which indicates the enhancement effect on the decomposition of the flame retardant. Addition of Na2CO3 increases the initial temperature of the second and third weight loss stage of WPCB, which indicates the obstruction effect on oxidation reaction. From the different mechanism function, the optimal mechanism function is f (a)=2/3(1-a)[-ln (1-a) ]3 and the range of activation energy is 30~185 kJ /mol.

The influence of Na2CO3 on RF4-type waste printed circuit board (PCB) pyrolysis in carbon dioxide was studied with thermogravimetric analysis, and the reaction kinetics was calculated based on the Coats - Redfern method. It is shown that the weight loss process of waste PCB in carbon dioxide includes  two stages. The first stage of weight loss is between 280 ℃ and 450 ℃, at which the decomposition of epoxide resin leads to volatile materials release. The second stage of weight loss is the reaction between carbon residue and carbon dioxide between 600℃~960 ℃, and carbon monoxide is formed. Addition of Na2CO3 decreases the initial temperature of the second weight loss stage of waste PCB and increases the weight loss rate, which indicates the enhancement effect on gasification reaction between carbon residue and carbon dioxide. From the different mechanism function, the optimal mechanism function is f(a)=5(1-a)/4[-ln(1-a)]4 and the range of activation energy is 75～135 kJ/mol.

The syntheses, X‐ray structures of three novel low‐dimensional assemblies, the molecules [Cu2(dmpzpo)2][Ag(CN)2]2(1), [Cu2(dmpzpo)2][Ni(CN)4]·2CH3OH (2·2CH3OH) and [Cu2(dmpzpo)2][Ni(CN)4]·DMF·3H2O (2·DMF·3H2O), are presented. The temperature‐dependent susceptibility of 2·2CH3OH and 2·DMF·3H2O is determined. The structure of compound 1consists of one dicopper(II) moiety and two Ag(CN)2−units, each being coordinated to different copper atoms of the dicopper(II) moiety with transarrangement. Compound 1has an inversion center located the middle of the Cu2O2plane. The structures of 2·2CH3OH and 2·DMF·3H2O are isostructural, consisting of {Cu2Ni} repeating units connected through Cu‐NC‐Ni‐CN‐Cu linkages to form an one‐dimensional infinite chain. The magnetic studies on the compounds 2·2CH3OH and 2·DMF·3H2O showed that both compounds exhibit an overall antiferromagnetic behavior.