24 results on '"Zimmermann, Severin"'
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2. A high-efficiency hybrid high-concentration photovoltaic system
3. Energy efficient hotspot-targeted embedded liquid cooling of electronics
4. Hot water cooled electronics: Exergy analysis and waste heat reuse feasibility
5. Aquasar: A hot water cooled data center with direct energy reuse
6. Optimal thermal operation of liquid-cooled electronic chips
7. The Consequences of Hosting Asylum Seekers for Citizens' Policy Preferences
8. Thermally Conductive Composite Material With Percolating Microparticles Applied as Underfill
9. Erratum: “Review on Percolating and Neck-Based Underfills for Three-Dimensional Chip Stacks” [ASME J. Electron. Packag., 2016, 138(4), p. 041009; DOI: 10.1115/1.4034927]
10. Enhanced Percolating Thermal Underfills Achieved by Means of Nanoparticle Bridging Necks
11. Review on Percolating and Neck-Based Underfills for Three-Dimensional Chip Stacks
12. Integrated liquid cooling with heat reuse: A new generation of energy efficient computers and photovoltaics
13. Significant thermal conductivity reduction of silicon nanowire forests through discrete surface doping of germanium
14. In Situ Assembly in Confined Spaces of Coated Particle Scaffolds as Thermal Underfills with Extraordinary Thermal Conductivity
15. Characterization of particle beds in percolating thermal underfills based on centrifugation
16. Review of percolating and neck-based underfills with thermal conductivities up to 3 W/m-K.
17. Thermo-mechanical properties of underfills at partial and full filler percolation - sub-layering the underfill
18. Enhanced thermal underfills by bridging nanoparticle assemblies in percolating microparticle beds.
19. Hot Water Cooled Electronics for High Exergetic Utility
20. Waste heat recovery in supercomputers and 3D integrated liquid cooled electronics
21. Thermal management and overall performance of a high concentration PV
22. HOT WATER COOLED HEAT SINKS FOR EFFICIENT DATA CENTER COOLING: TOWARDS ELECTRONIC COOLING WITH HIGH EXERGETIC UTILITY
23. Significant thermal conductivity reduction of silicon nanowire forests through discrete surface doping of germanium.
24. In Situ Assembly in Confined Spaces of Coated Particle Scaffolds as Thermal Underfills with Extraordinary Thermal Conductivity
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