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Your search keyword '"Zimmermann, Severin"' showing total 24 results
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24 results on '"Zimmermann, Severin"'

9. Erratum: “Review on Percolating and Neck-Based Underfills for Three-Dimensional Chip Stacks” [ASME J. Electron. Packag., 2016, 138(4), p. 041009; DOI: 10.1115/1.4034927]

Author

Brunschwiler, Thomas, primary, Zürcher, Jonas, additional, Del Carro, Luca, additional, Schlottig, Gerd, additional, Burg, Brian, additional, Zimmermann, Severin, additional, Zschenderlein, Uwe, additional, Wunderle, Bernhard, additional, Schindler-Saefkow, Florian, additional, and Stässle, Rahel, additional

Published
2017
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12. Integrated liquid cooling with heat reuse: A new generation of energy efficient computers and photovoltaics

Author

Zimmermann, Severin, Michel, Bruno, and Poulikakos, Dimosthenis

Subjects
PHOTOVOLTAIC SYSTEMS (ELECTRICAL POWER GENERATION), PHOTOVOLTAIKANLAGEN (STROMERZEUGUNG), HARDWARE (COMPUTER SCIENCE), HARDWARE (INFORMATIK), Natural resources, energy and environment, ENERGIEFORMEN + ENTHALPIE + EXERGIE (THERMODYNAMIK), ENERGY FORMS + ENTHALPY + EXERGY (THERMODYNAMICS), WATER COOLING (MECHANICAL ENGINEERING), WASSERKÜHLUNG (MASCHINENBAU), Data processing, computer science, ddc:333.7, ddc:004
Published
2013
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23. Significant thermal conductivity reduction of silicon nanowire forests through discrete surface doping of germanium.

Author

Ying Pan, Guo Hong, Raja, Shyamprasad N., Zimmermann, Severin, Tiwari, Manish K., and Poulikakos, Dimos

Subjects
SILICON nanowires, THERMAL conductivity, SEMICONDUCTOR doping, GERMANIUM, MOLECULAR dynamics
Abstract

Silicon nanowires (SiNWs) are promising materials for the realization of highly-efficient and cost effective thermoelectric devices. Reduction of the thermal conductivity of such materials is a necessary and viable pathway to achieve sufficiently high thermoelectric efficiencies, which are inversely proportional to the thermal conductivity. In this article, vertically aligned forests of SiNW and germanium (Ge)-doped SiNW with diameters around 100 nm have been fabricated, and their thermal conductivity has been measured. The results show that discrete surface doping of Ge on SiNW arrays can lead to 23% reduction in thermal conductivity at room temperature compared to uncoated SiNWs. Such reduction can be further enhanced to 44% following a thermal annealing step. By analyzing the binding energy changes of Ge-3d and Si-2p using X-ray photoelectron spectroscopy, we demonstrate that surface doped Ge interacts strongly with Si, enhancing phonon scattering at the Si-Ge interface as has also been shown in non-equilibrium molecular dynamics studies of single nanowires. Overall, our results suggest a viable pathway to improve the energy conversion efficiency of nanowire-forest thermoelectric nanomaterials. [ABSTRACT FROM AUTHOR]

Published
2015
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24. In Situ Assembly in Confined Spaces of Coated Particle Scaffolds as Thermal Underfills with Extraordinary Thermal Conductivity

Author

Hong, Guo, Schutzius, Thomas M., Zimmermann, Severin, Burg, Brian R., Zürcher, Jonas, Brunschwiler, Thomas, Tagliabue, Giulia, Michel, Bruno, and Poulikakos, Dimos

Abstract

In situ assembly of high thermal conductivity materials in severely confined spaces is an important problem bringing with it scientific challenges but also significant application relevance. Here we present a simple, affordable, and reproducible methodology for synthesizing such materials, composed of hierarchical diamond micro/nanoparticle scaffolds and an ethylenediamine coating. An important feature of the assembly process is the utilization of ethylenediamine as an immobilizing agent to secure the integrity of the microparticle scaffolds during and after each processing step. After other liquid components employed in the scaffolds assembly dry out, the immobilization agent solidifies forming a stable coated particle scaffold structure. Nanoparticles tend to concentrate in the shell and neck regions between adjacent microparticles. The interface between core and shell, along with the concentrated neck regions of nanoparticles, significantly enhance the thermal conductivity, making such materials an excellent candidate as thermal underfills in the electronics industry, where efficient heat removal is a major stumbling block toward increasing packing density. We show that the presented structures exhibit nearly 1 order of magnitude improvement in thermal conductivity, enhanced temperature uniformity, and reduced processing time compared to commercially available products for electronics cooling, which underpins their potential utility.

Published
2015
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