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Abstract: In concurrent work, we introduced a novel robotic package delivery system latching intelligent modular mobility system (LIMMS). Each LIMMS end effector requires a small, lightweight latching mechanism for pre-manufactured containers, such as cardboard boxes. In order to effectively process a high volume of packages, aligning the latching mechanism quickly and reliably is critical. Instead of depending on highly accurate controllers for alignment, we propose a novel self-aligning rotational mechanism to increase the system’s tolerance to misalignment. The radial latching design consists of evenly spaced blades that rotate into slots cut into the box. When misaligned, the blades contact the edges of the engagement slots, generating a self-correcting force that passively centers the blades with the slot pattern. This paper introduces a mathematical framework with closed form expressions to quantify error tolerance for these mechanisms. Through our mathematical and optimization analyses, it is shown that a two-blade design can tolerate a maximum misalignment of three times the radius to the blade tips, much larger than commonly used designs with three or more blade-like contacts. Our approach can be generalized for a class of rotational latching mechanisms with any number of blades. Utilizing this theory, a design process is laid out for developing an optimal self-aligning rotational latching mechanism given desired parameters and task constraints. With this methodology, we designed, manufactured, and verified the effectiveness of both two-blade and three-blade self-aligning in practical experiments.

Chiplet-based design, which breaks a system into multiple smaller dice (or "chiplets") and reassembles them into a new system chip through advanced packaging, has received extensive attention in the post Moore's law era due to its advantages in terms of cost, performance, and agility. However, significant challenges arise in this implementation approach, including the mapping of functional components onto chiplets, co-optimization of package and architecture, handling the increased latency of communication across functions in different dies, the uncertainty problems of fragment communication subsystems, such as maintaining deadlock-free when independently designed chiplets are combined. Despite various design approaches that attempt to address these challenges, surveying these approaches one-after-another is not the most helpful way to offer a comparative viewpoint. Accordingly, in this paper, we present a more comprehensive and systematic strategy to survey the various approaches. First, we divide them into chiplet-based system architecture design and interconnection design, and further classify them based on different architectures and building blocks of interconnection. Then, we analyze and cross-compare each classification separately, and in addition, we present a topical discussion on the evolution of memory architectures, design automation, and other relevant topics in chiplet-based designs. Finally, some discussions on important topics are presented, emphasizing future needs and challenges in this rapidly evolving field. [ABSTRACT FROM AUTHOR]

In the realm of food waste recycling, industrial suberoligneous by‐products like cork and peels, pose a challenge for value‐added conversion, primarily due to their intricate structures. This study introduces an innovative approach by utilizing recycled cork as a prime example of repurposing food waste to create a reusable and durable packaging paper. Notably, the manufacturing process of this cork‐based paper avoids the generation of waste liquids from lignin removal, effectively alleviating concerns related to liquid waste pollution. The resulting packaging paper demonstrates remarkable printability, readability, and erasability while offering reusability. Its performance can be fine‐tuned through pH value adjustments. Moreover, this packaging paper exhibits outstanding antioxidative properties and barrier properties, seamlessly integrating superb UV‐blocking proficiency and heightened visible transparency, rendering it highly appealing for sustainable food packaging applications. [ABSTRACT FROM AUTHOR]

Copyright of Piezoelectrics & Acoustooptics is the property of Piezoelectric & Acoustooptic and its content may not be copied or emailed to multiple sites or posted to a listserv without the copyright holder's express written permission. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract. (Copyright applies to all Abstracts.)

Copyright of Micronanoelectronic Technology is the property of Micronanoelectronic Technology Editorial Office and its content may not be copied or emailed to multiple sites or posted to a listserv without the copyright holder's express written permission. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract. (Copyright applies to all Abstracts.)

Copyright of Food Research & Development is the property of Food Research & Development Editorial Department and its content may not be copied or emailed to multiple sites or posted to a listserv without the copyright holder's express written permission. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract. (Copyright applies to all Abstracts.)

The key technologies for the ultrathin small outline package (TSOP) of large-sized high-speed chips have been designed and developed in this paper. The designing techniques, such as a 25 µm precise positioning dice attaching technique, a lead frame unit structure without a base island, and a lead co-plane layout inside the frame, were developed. The TSO package outline with a large number of leads, a frame unit arrangement, and a frame distribution with a base island and without one were improved. The technological problems, including the reduction in thickness, wafer cutting, chip sticking bonding, and plastic sealing, were successfully solved. The designed large-sized package products have many advantages, such as high availability, low cost, high reliability, and a short production cycle. This package technique can be widely used in various intellectual application regions. [ABSTRACT FROM AUTHOR]

The cactus pear fruits were under the two conditions of normal and low temperature treatment, logistics packaging by foam mesh bag, foam filler, laminated isolation plate, plastic wrap, a total of 8 kinds of treatments. The influence of different logistics packaging on the quality of cactus pear fruit was studied, by measuring fruit firmness, soluble solid, titratable acid, weight loss rate, juice yield, rate of intact fruit, ethyl alcohol, glucose, vitamin C content before and after logistics transportation, in order to select suitable logistics packaging methods for cactus pear fruits. The results showed that low temperature significantly reduced the quality reduction of cactus pear fruit during logistics transportation. Compared with foam filler, foam mesh bag, laminated isolation plate, logistics packaging by plastic wrap can maintain the firmness of fruit, decrease the content of vitamin C, soluble solid, glucose, juice yield, rate of intact fruit, and reduce the increase of ethanol and weight loss rate. There was no significant effect on titratable acid content of cactus pear fruit by different packing treatments. In summary, low temperature and the use of plastic wrap packaging can improve the quality of cactus pear fruit in logistics transportation. [ABSTRACT FROM AUTHOR]

Materials that make light-emitting diodes brighter and less power hungry open exciting new applications for semiconductor lamps. The emergence of high brightness emitters – with a number of advantages over conventional incandescent bulbs and halogen lamps – opened new markets to visible LEDs. White LEDs (WLEDs) are penetrating the portable and low wattage lighting market where ruggedness and compact source size are valued. Even though WLEDs may have a very long life, poorly designed WLED lighting systems can experience a short life. No industry standard exists for brightness levels. [ABSTRACT FROM AUTHOR]

Copyright of Akademik Sanat is the property of Ankara Haci Bayram Veli University and its content may not be copied or emailed to multiple sites or posted to a listserv without the copyright holder's express written permission. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract. (Copyright applies to all Abstracts.)

Tea is a typical beverage that has been consumed worldwide. A large number of brands of this beverage are available in the market. This study looked into the consumer preference for the attributes of selected, packed tea products available in the market. The study focused on attributes such as brand, price, strength and tea package. Conjoint analysis with an orthogonal design assessed consumer preference for different tea brands. The results showed that packaging was the attribute most preferred by the consumers (importance score of 36.083), followed by the brand of the Tea (31.084) and the strength of the Tea (21.518). The least preferred attribute was the price of the branded Tea. Further, the findings also revealed optimum attribute combination among the existing tea products in the market. The results of this study will be helpful to tea growers and will significantly advance research on beverages. [ABSTRACT FROM AUTHOR]

To explore the metabolites differences of grilled fish in different packages, liquid chromatography-tandem mass spectrometry was used to analyze and compare the metabolite profile of prefabricated grilled fish in tray packaging, vacuum packaging and modified atmosphere packaging through non-targeted metabolomics. The results showed that 318 metabolites were identified under secondary mass spectrometry information in the prefabricated grilled fish with different packaging. In this study, 47 differential metabolites were identified, including 10 fatty acids, 10 nucleotides, 9 amino acids, 7 organic acids and derivatives, 3 benzene and derivatives, 2 alcohol amines, and 6 unconfirmed metabolites, based on the variable importance projection value (VIP, VIP>1) and P

Silicon carbide (SiC) power modules play an essential role in the electric vehicle drive system. To improve their performance, reduce their size, and increase production efficiency, this paper proposes a multiple staked direct bonded copper (DBC) unit based power module packaging method to parallel more chips. This method utilizes mutual inductance cancellation effect to reduce parasitic inductance. Because the conduction area in the new package is doubled, the overall area of power module can be reduced. Entire power module is divided into smaller units to enhance manufacture yield, and improve design freedom. This paper provides a detailed design, analysis and fabrication procedure for the proposed package structure. Additionally, this paper offers several feasible solutions for the connection between power terminals and DBC untis. With the structure, 18 dies were paralleled for each phase-leg in a econodual size power module. Both simulation and double pulse test results demonstrate that, compared to conventional layouts, the proposed package method has 74.8% smaller parasitic inductance and 34.9% lower footprint.

Copyright of Science & Technology of Food Industry is the property of Science & Technology of Food Industry Editorial Office and its content may not be copied or emailed to multiple sites or posted to a listserv without the copyright holder's express written permission. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract. (Copyright applies to all Abstracts.)

Tiled display has gradually become the development direction of super large screen display. A high transmittance greater than 80% and visual consistency with ΔE>0.5 in off state and Δu′v′>0.004 between multiple modules in display state MiniLED tiled display packaging scheme was proposed in this paper. The LED on the display substrate was wrapped by the barrier and diffusion particles. In addition, the glass cover plate with stable OD BM pattern is pasted above the display substrate to achieve consistency of blackness between multiple modules, with diamond black effect. This scheme is of great significance to the development of tiled display technology. [ABSTRACT FROM AUTHOR]

Background: Children with cerebral palsy require interdisciplinary treatment due to their multifunctional deficits. Consequently, high levels of stress, worry, and dread of the unknown are common among caregivers. Therefore, understanding cerebral palsy is crucial for caregiver adjustment and role preparation. But there is a dearth of scientific data on the most effective way to teach caregivers. The aim of this trial was to evaluate the effects of caregivers-centered package on functional balance and activities of daily living in children with cerebral palsy. Design: A randomized controlled trial was implemented in out-patient clinic affiliated with Mansoura University Children's Hospital. A total sample size of 80 caregivers and their children was recruited using a randomization technique. Data collection tools were four: a structured interview questionnaire sheet for caregivers' knowledge regarding CP; caregivers' care reporting sheet; cerebral palsy quality of life scale for children; and pediatric balance scale. Results: It was evident that the study group who received educational package demonstrated highly statistical improvements regarding cerebral palsy knowledge and practice (P=0.001), compared to the control group results, which showed insignificant differences (P=0. 246and P=0.06, respectively) at the three study phases. Conclusion: The educational package for caregivers had an improving effect on their knowledge and practice regarding cerebral palsy, in addition to its positive effect on their children's quality of life and functional balance. Recommendation: Developing and implementing an educational initiative for mothers regarding care of their children with CP continuously. [ABSTRACT FROM AUTHOR]

The key technologies for the ultrathin small outline package (TSOP) of large-sized high-speed chips have been designed and developed in this paper. The designing techniques, such as a 25 µm precise positioning dice attaching technique, a lead frame unit structure without a base island, and a lead co-plane layout inside the frame, were developed. The TSO package outline with a large number of leads, a frame unit arrangement, and a frame distribution with a base island and without one were improved. The technological problems, including the reduction in thickness, wafer cutting, chip sticking bonding, and plastic sealing, were successfully solved. The designed large-sized package products have many advantages, such as high availability, low cost, high reliability, and a short production cycle. This package technique can be widely used in various intellectual application regions.

Copyright of Electronic Components & Materials is the property of Electronic Components & Materials and its content may not be copied or emailed to multiple sites or posted to a listserv without the copyright holder's express written permission. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract. (Copyright applies to all Abstracts.)

Reproductive-aged breast cancer (BC) survivors are concerned about their fertility potential after BC treatment. No specific and comprehensive educational and clinical package examines pregnancy health in BC survivors. This study aimed to develop and validate a pregnancy health educational package for BC survivors who intend to experience pregnancy after completing cancer treatment. The present study is a mixed methods study conducted in three phases. The researchers, in phase 1, performed a qualitative content analysis study to explore the perceived needs and experiences of pregnancy among Iranian BC survivors. Then in the second phase, the authors conducted a systematic literature review to search all available packages, guidelines, documents, and published papers on pregnancy or fertility status among BC survivors worldwide. In the third phase, the intervention type was selected according to the opinions of the expert's team during two sessions of online meetings using the Delphi technique. The package quality was assessed by an expert team using the Appraisal of Guidelines for Research and Evaluation Instrument II (AGREE II) tool. The pregnancy health package for BC survivors was developed in seven separate chapters based on the qualitative study and literature review findings. The results of the validity or quality assessment of the package according to the six domains of the AGREE II tool were reported as follows: the score for the scope and purpose domain was 95.55%, the stakeholder involvement domain was 89.16%, the score for the rigor of development domain was 92.97%, clarity of presentation domain was 94.44%, the score of applicability domain was 87.06%, and the score of editorial independence domain was calculated 93.75%. The pregnancy health package was designed with high quality and validity and, as an excellent cost-effective resource, is proposed to BC survivors to increase their awareness regarding their fertility issues before attempting to conceive. [ABSTRACT FROM AUTHOR]

Contact electrification (CE), a common physical phenomenon, is worth discussing. However, there are few reports on the influence of atmosphere on CE, or on the performance of triboelectric nanogenerators (TENG), based on CE by encapsulating gas inside. Here, we propose physical processes of electron transfer to interpret the impact of the gaseous atmosphere on CE. An atmosphere-filled triboelectric nanogenerator (AF-TENG) encapsulated five different gas-components of air based on the vertical contact separation mode was prepared. The sensitivity (1.02 V·N−1) and the power density (9.63 μW·m−2) of the oxygen-atmosphere-filled AF-TENG were 229.03% and 157.81% higher than these (0.31 V·N−1 and 3.84 μW·m−2) of the nitrogen-atmosphere-filled AF-TENG. As the oxygen atom possesses more atomic energy levels than other atoms, this could act as a "bridge" for more electrons to directly transfer between the two materials. The device package under different atmospheres could not only strengthen understanding of CE and improve the performance of TENG, but also be potentially applicable to prevent and control unnecessary damage caused by static electricity. [ABSTRACT FROM AUTHOR]

This research paper provides the design and development of an "Expenses Tracker Application" with the Flutter framework. As modern life becomes more and more busier, effective financial management solutions are more important, and mobile applications are becoming an essential tool for such purposes. This research focuses on creating a user-friendly, cross-platform application that helps users manage and track their spending efficiently. The research outlines the architectural choices, development methodology, key features, and design considerations of the Expenses Tracker App. The application uses Flutter's capabilities to offer an easy and intuitive experience to the user. It comprises categorization, expense entry, monthly budget setting, usercentric design principles, and data visualization. The significance of this research lies in creating a practical and user-oriented tool for financial management, utilizing the capabilities of Flutter's cross-platform nature. The concluding observations reflect on the contribution, achievements, and future advancements of the Expenses Tracker App to ease expense management. The research upholds Flutter as a practical solution for developing applications that cater to real-world requirements in a usercentric and modern method. [ABSTRACT FROM AUTHOR]

Copyright of Journal of Guangdong University of Technology is the property of Journal of Guangdong University of Technology and its content may not be copied or emailed to multiple sites or posted to a listserv without the copyright holder's express written permission. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract. (Copyright applies to all Abstracts.)

As the power supply of IC chips tends to be low-voltage and high-current, the design of the Power Delivery Network(PDN) of the micro-system module is becoming more and more important, based on 2.5D Through-Silicon-Via(TSV), inverted solder, High Temperature Co-fired Ceramics(HTCC),3D stacking, etc. Chip currents generate output noise through PDN interconnects, which must provide a better signal return path with low-impedance to keep the supply voltage between chip pads constant within a small tolerance range, usually 5% or less. Based on Chip Package System(CPS), the paper proposes a design and optimization method for the micro-system module PDN based on the three-level synergy of TSV silicon substrate, HTCC cases and PCB. This paper expounds the DC design and AC impedance design respectively, and using the Chip Power Model(CPM) combined with the time domain analysis, realizes the low impedance design of the power ripple on PDN.

ABSTRACT: Few studies have addressed the effects of package material in the absence of light on contributions to fluid milk flavor. The objective of this study was to compare the sensory and chemical properties of fluid milk packaged in paperboard cartons, low-density polyethylene, high-density polyethylene (HDPE), polyethylene terephthalate (PET), linear low-density polyethylene (LLDPE), and glass. Pasteurized (high temperature short time, 77°C for 25 s) skim and whole milk were filled (280 mL ± 10 mL) into paperboard cartons, low-density polyethylene, HDPE, PET, LLDPE, and glass (control). Milks were stored at 4°C in the dark and sampled at d 0, 5, 10, and 15. Descriptive analysis was applied to document sensory profiles at each time point, and volatile compounds were extracted and identified by solid-phase microextraction with gas chromatography mass spectrometry and gas chromatography-olfactometry. Tetrad tests with consumers were conducted at d 10. Both skim and whole milks packaged in cartons had noticeable paperboard flavor by d 5 and higher levels of hexanal than skim and whole milks in other package types at d 5. Skim milks packaged in paperboard cartons and LLDPE had distinct refrigerator/stale flavor compared with milks in the other package types, concurrent with increased levels of refrigerator/package-related compounds including styrene, acetophenone and 2-ethyl-1-hexanol. Milks packaged in glass, PET and HDPE were not distinguished by consumers at d 10 post-processing. Package type influences fluid milk flavor, and these effects are greater in skim milk compared with whole milk. Paperboard cartons do not preserve milk freshness, as well as PET, HDPE, or glass, due to flavor migration and scalping. Glass remains an ideal barrier to preserve fluid milk flavor, but in the absence of light, HDPE and PET provide additional benefits while also maintaining fluid milk flavor.

Objective. The objective of the study is to increase the reliability of the contact of the semiconductor transistor crystal to the body and the reproducibility of the technological process.Method. A method for obtaining multilayer metallization of the reverse side of the crystal has been developed and the most optimal technological modes of its formation have been selected. The parameters of the reliability of the connection of the crystal to the body of the transistor were checked.Results. Layer-by-layer metallization has been obtained, which provides a strong contact to the collector region of the transistor and a reliable fit of the crystal to the base of the case.The control of technological operations showed 100% distribution of solder over the surface of the crystal, the absence of pores in the solder, the improvement in the output characteristics of the device and the increase in the percentage of output usable transistors.Conclusion. An analysis of the experimental results showed that in order to create a reliable contact and remove heat from the collector junction of power semiconductor transistors on the reverse side of the plates, it is necessary to form a metallization in one technological cycle, consisting of four layers of metals (Cr-Ni-Sn-Ag). The technical result of the research is to improve the quality of fit by obtaining a uniform distribution of the layer of Cr-Ni-Sn-Ag metals in a single technological cycle.

A double catalytic layer scheme is proposed and investigated for the low temperature growth of carbon nanotubes (CNTs) over Co (Cobalt), Al (Aluminum), and Ti (Titanium) catalysts on a silicon substrate. In this work, we demonstrate the growth of CNTs by a thermal chemical vapor deposition (TCVD) process at both 350 °C and 400 °C. Based on scanning electron microscopy (SEM) and Raman spectroscopy analyses, the good quality of the CNTs is demonstrated. This study contributes to the on-going research on integrating semiconductors into packaging and power-related applications, as demonstrated with the low resistance (~128 Ω) and high thermal conductivity (~29.8 Wm−1 K−1) of our developed CNTs. [ABSTRACT FROM AUTHOR]

Copyright of Piezoelectrics & Acoustooptics is the property of Piezoelectric & Acoustooptic and its content may not be copied or emailed to multiple sites or posted to a listserv without the copyright holder's express written permission. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract. (Copyright applies to all Abstracts.)

The demand for packed aseptic cooked rice is gradually increasing because it can be cooked using simple methods and preserved at room temperature. To extend the expiration date of packed aseptic cooked rice, we packed samples of the cooked rice in different types of packaging and preserved them for 15 months at 25 °C or 30 °C, then identified an indicator to estimate the deterioration of the cooked rice. Using the monolithic material sorptive extraction method and GC/MS analysis, n-hexanal was prominently detected in packed aseptic cooked rice, and its concentration increased with increase in storage duration and storage temperature. Although the oxygen concentration had been maintained at low values with a deoxidant for 15 months, the n-hexanal levels increased when highly oxygen permeable packaging was used. Thus, we assumed that diffused oxygen quickly reacted with both the deoxidant and cooked rice. We showed that plastic packaging with low oxygen permeability was effective in extending the expiration date of packed aseptic cooked rice. There was a negative correlation between the concentration of n-hexanal and sensory evaluation (odors: r = -0.73, comprehensive evaluation: r = -.79) of the packed aseptic cooked rice. We considered n-hexanal as a promising indicator for the expiration date of packed aseptic cooked rice. [ABSTRACT FROM AUTHOR]

Ethiopia has an enormous production potential for malted barley due to its ideal agroecology, notably in the central and Bale highlands. However, local production cannot meet the demand for both new and old malt and brewing plants. Millions of dollars have been invested to import malt at the national level. The objective of this study was to investigate the factors that influence smallholder farmers' adoption and level of use of the malt barley technology package. A multistage sampling procedure was employed to choose representative kebeles and households. The study relied on actual data collected from 201 randomly selected barley-producing households. Descriptive statistics and Double Hurdle economic models were used to analyze the data. The descriptive findings show that malt barley varieties and the malt barley technology package were adopted at rates of 0.3 and 0.9, respectively. The Double Hurdle model results reveal that factors such as the household head's age, the total area under cultivation, the availability of information on malt barley production, distance from the main road, participation in the field day program, and membership in the agricultural cooperative all had an effect on smallholder farmers' decisions to adopt and use the malt barley technology package. The recommendation made by this research was to boost farmers' knowledge of malt barley production through training and field trip programs. Organizing smallholder farmers in nearby agricultural cooperatives, as well as ensuring access to roads and public transit for easy access to agricultural inputs and output markets.

Solder fatigue failure is one of the primary wear-out failure mechanisms limiting reliability in microelectronics flip chip packaging. Solder fatigue failure occurs when a crack initiates and subsequently propagates through the entirety of the solder joint causing an electrical open. Crack initiation and propagation within a solder joint is caused by a cyclic application of stress, typically induced by exposure to temperature cycle excursions. Understanding the relationship between thermal cycling during product use and the accelerated thermal cycles used for testing is critical for predicting device reliability. MIL-PRF-38535 is the guiding aerospace and high-reliability General Specification for Integrated Circuits (Microcircuits) Manufacturing that defines manufacturing, qualification, and certification requirements for products to be listed on the Defense Logistic Agency’s (DLA) Qualified Manufacturer Listing (QML). Revision M of this standard, released in November 2022, for the first time includes the use of lead-free solder alloys and organic substrates in the manufacturing of QML flip chip products. Hence, there is a strong need to understand the physics-of-failure (PoF) concerning solder fatigue of lead-free flip chip assemblies. This article demonstrates how finite element modeling can be used to predict solder fatigue for flip chip package assemblies. The authors have leveraged fatigue lives measured for different flip chip daisy chain package configurations, as well as fatigue lives defined and available in published papers. The authors then use the resulting leadfree solder fatigue model to perform parametric studies looking at the impact of different die sizes, underfill material properties, and package substrate materials. Comparisons are also made between eutectic Sn/Pb and lead-free fatigue life predictions. In addition, the authors demonstrate how solder fatigue predictions can be de-rated to use conditions in order to make reliability assessments for flip chip package assemblies. This ultimately leads to a better understanding of the impact of solder alloy and material selection on the mission life of aerospace and high reliability products that fall under the changes introduced in MIL-PRF-38535 Revision M. [ABSTRACT FROM AUTHOR]

Few studies have addressed the effects of package material in the absence of light on contributions to fluid milk flavor. The objective of this study was to compare the sensory and chemical properties of fluid milk packaged in paperboard cartons, low-density polyethylene, high-density polyethylene (HDPE), polyethylene terephthalate (PET), linear low-density polyethylene (LLDPE), and glass. Pasteurized (high temperature short time, 77°C for 25 s) skim and whole milk were filled (280 mL ± 10 mL) into paperboard cartons, low-density polyethylene, HDPE, PET, LLDPE, and glass (control). Milks were stored at 4°C in the dark and sampled at d 0, 5, 10, and 15. Descriptive analysis was applied to document sensory profiles at each time point, and volatile compounds were extracted and identified by solid-phase microextraction with gas chromatography mass spectrometry and gas chromatography-olfactometry. Tetrad tests with consumers were conducted at d 10. Both skim and whole milks packaged in cartons had noticeable paperboard flavor by d 5 and higher levels of hexanal than skim and whole milks in other package types at d 5. Skim milks packaged in paperboard cartons and LLDPE had distinct refrigerator/stale flavor compared with milks in the other package types, concurrent with increased levels of refrigerator/package-related compounds including styrene, acetophenone and 2-ethyl-1-hexanol. Milks packaged in glass, PET and HDPE were not distinguished by consumers at d 10 post-processing. Package type influences fluid milk flavor, and these effects are greater in skim milk compared with whole milk. Paperboard cartons do not preserve milk freshness, as well as PET, HDPE, or glass, due to flavor migration and scalping. Glass remains an ideal barrier to preserve fluid milk flavor, but in the absence of light, HDPE and PET provide additional benefits while also maintaining fluid milk flavor. [ABSTRACT FROM AUTHOR]

Background. Development of methods and means of the adaptive management control of the bandwidth radio networks with competitive access to the radio channel. Objective. Determination of the effect of packets length on the effective transmission speed of radio networks taking into account the parameters, formats and procedures of the physical and channel levels when using six possible strategies of the adaptive CSMA protocol with a rigid strategy of competitive access to the radio channel. Methods. The goal is achieved by creating and analyzing a mathematical model of effective transmission speed in radio network. The model is described by the equation of the effective transmission rate, which is a function of the probability of conflict-free transmission of the adaptive CSMA protocol for rigid strategy and the deviation coefficient of the size of data packets from the optimal LLC protocol, taking into account the probability of packet damage due to interference in the radio channel. Results. With the help of this mathematical model, it is proved that of the six packet length management strategies for adaptive CSMA protocols with a rigid strategy, only the first, third and sixth strategies have practical significance from the point of view of increasing the effective transmission speed, provided that the influence of the parameters of the physical and LLC levels is taken into account. For these strategies can be calculated according to this model the optimal size of the length of data packets for each set of system parameters, such as the transmission speed, the probability of damaging one bit of information due to interference in the radio channel, and the structure of the packet of the LLC protocol. Conclusions. The proposed mathematical model is a tool for calculating the bandwidth of radio networks and the optimal size of data packets during adaptive management of competitive access to a radio channel with a hard strategy in conditions of significant fluctuations in traffic intensity and changes in the intensity of interference in the radio channel. [ABSTRACT FROM AUTHOR]

In this work, we proposed a whispering gallery mode (WGM) resonator filled with Terfenol-D (WGMRFT), which could be applied to magnetic field sensing and tuning. We used a hollow quartz rod to fabricate the resonator, and then filled it with Terfenol-D to create a magnetic field-sensitive device. The WGM of the resonator were excited using a tapered fiber evanescent field. As the external magnetic field increased, the WGM resonant spectrum of the resonator shifted toward the short wavelength direction. The sensitivity of the resonator is −3.05 pm/mT. The structure has many advantages, such as simple structure, low cost and easy operation. In addition, we have demonstrated a resonator coupling and packaging device, using this device to adjust the coupling state of the resonator within a certain range. The package demonstrated good repeatability and reversibility in magnetic field measurement experiments. This lays the foundation for the application of millimeter-scale large WGM resonators. [Display omitted] • We propose a hollow quartz rod WGM resonator filled with Terfenol-D for the first time. • The device can be applied to magnetic field sensing and tuning. • The structure has many advantages, such as simple structure, low cost and easy operation. • We also demonstrate a WGM resonator package with good portability and flexibility. • The package is not only suitable for the WGMRTF in this article, but also lays the foundation for the application of other types of millimeter-scale large WGM resonators. [ABSTRACT FROM AUTHOR]