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The demand for high-speed and low-cost short-distance data links, eventually for chip-level optical communication, has led to large efforts to develop high density photonics integrated circuits (PICs) to decrease the power consumption and unit price. Particularly, silicon based photonic integration promise future high-speed and cost-effective optical interconnects to enable exascale performance computers and datacenters. High-level integration of all photonics components on chip, including high speed modulators and photodetectors, and especially lasers, is required for scalable and energy efficient system topology designs. This is enabled by silicon-based heterogeneous integration approach, which transfers different material systems to the silicon substrate with a complementary metal–oxide–semiconductor (CMOS) compatible process. In this thesis, our work focuses on the development of silicon photonic integrated circuit in the applications of high speed chip level optical interconnects. A full library of functional devices is demonstrated on silicon, including low threshold distributed feedback (DFB) lasers as a low power laser source; high extinction ratio and high speed electroabsorption modulators (EAM) and ultra-linear Mach-Zehnder interferometer (MZI) modulators for signal modulation in the data transmitter; high speed photodetectors for the data receiver; and low loss silicon components, such as arrayed waveguide grating (AWG) routers and broadband MZI based switches. The design and characterization of those devices are discussed in this thesis. A highly integrated photonic circuit can be achieved with co-design and co-process of all types of functional photonic devices. Selective die bonding method is performed to integrate multiple III-V dies with different band-gap onto a single photonic die. A reconfigurable network-on-chip circuit was proposed and demonstrated, with state-of-the-art high-speed silicon transceiver chip. With over 400 active and passive components heterogeneously integrated on silicon, photonic circuit with multiple- wavelength-division multiplexing (WDM) transceiver nodes achieved a total capacity up to 8×8×40 Gbps. This high capacity and dense integrated heterogenous circuit shows its potential as a solution for future ultra-high speed inter- and intra-chip interconnects.

Miniaturized medical devices are becoming increasingly adopted by doctors and patients because they enable new treatment and monitoring capabilities, minimally invasive surgery, improved portability and ease of use. Recent examples include micro pacemakers, micro cochlear implants and ex-situ micro glucose sensors. However, implantable micro devices employing packaging technologies other than metallic enclosures are yet to be seen. Physiological monitors such as in-situ pressure sensors and BioMEMS could profit significantly from advances in thin barrier films for corrosion protection of silicon micro devices. Coating films that stop the diffusion and permeation of harmful substances are necessary to protect both the patient and the micro device. Ceramic films deposited by chemical vapor deposition techniques are good candidates for this task due to their low permeability to gases, low chemical reactivity and high conformality. However, few studies are available about the corrosion protection offered by biocompatible coatings to microelectronic devices in representative biological environments.Ten materials were selected in this thesis after a bibliographic study: Al2O3, BN, DLC, HfO2, SiC, SiN, SiO2, SiOC, TiO2 and ZnO. Ultra-thin films of these materials (5-100 nm) were deposited by plasma enhanced chemical vapor deposition (PECVD) or atomic layer deposition (ALD) on substrates commonly found in electronic micro devices: crystalline silicon, copper, tungsten nitride and polyimide. In vitro cytotoxicity tests and degradation tests were performed for several weeks at different temperatures in Phosphate Buffer Saline (PBS) and NaCl supplemented with 10% Fetal Bovine Serum (NaCl/FBS). Changes in thickness and chemical composition were monitored by VASE, XPS and time-of-flight secondary ion mass spectroscopy (TOF-SIMS). It was found that SiO2 and SiN films (generally used for protection in the microelectronics industry) are not stable in PBS and NaCl/FBS at 37°C, even though they act as good hermetic barriers. Al2O3 showed very good stability in saline solution and excellent behavior as gas barrier, but it was rapidly dissolved in NaCl/FBS.In contrast, films of DLC, SiOC and TiO2 showed very low chemical reactivity in both mediums. Finally, it was shown that multilayers of TiO2 on Al2O3 offer the best performance as hermetic and diffusion barriers for corrosion protection of silicon micro systems in saline environments., Les dispositifs médicaux miniaturisés sont de plus en plus répandus dans le monde médical, car ils offrent de nouvelles opportunités de traitement et de surveillance. La miniaturisation des systèmes permet notamment une chirurgie minimalement invasive, une portabilité améliorée et une facilité d'utilisation. Parmi les exemples on peut mentionner les micro-stimulateurs cardiaques, les micro-implants cochléaires et les micro-capteurs ex-situ de glucose. Cependant, les micro-dispositifs implantables qui utilisent des technologies d'assemblage autres que les boîtiers métalliques sont encore à découvrir. La surveillance de paramètres physiologiques à l'aide de capteurs in-situ de pression et BioMEMS pourraient bénéficier des progrès faits sur les études d'encapsulation en couche mince destinées à protéger les micro-dispositifs de silicium contre la corrosion. En effet, une barrière qui empêche la diffusion et la pénétration des substances nocives est indispensable pour protéger à la fois le patient et le micro-dispositif. Les couches minces céramiques déposées par des procédés chimiques en phase vapeur sont de bons candidats grâce à leurs faibles perméabilités aux gazes, faibles réactivités chimique et conformités de dépôt élevées. Cependant, dans des milieux biologiques représentatifs du corps humain, peu d'études ont été réalisées dans le domaine de la protection des dispositifs microélectroniques contre la corrosion.Au cours de cette thèse, dix matériaux, choisis à l'issue d'une étude bibliographique, ont été étudiés: Al2O3, BN, DLC, HfO2, SiC, SiN, SiO2, SiOC, TiO2 et ZnO. Des couches ultrafines de ces matériaux (de 5 à 100 nm) ont été déposées par voie chimique en phase vapeur assisté par plasma (PECVD) ou par couches atomiques (ALD) sur des substrats silicium recouverts de matériaux généralement présents dans des dispositifs microélectroniques tels que le silicium cristallin, le cuivre, le tungstène nitrure et le poly-imide. Des mesures de cytotoxicité ont été réalisées et des tests de vieillissement ont été effectués pendant plusieurs semaines à des températures différentes dans une solution saline phosphatée (PBS) mais aussi dans une solution à base de sérum de veau fœtale (NaCl/SVF). Les changements dans la composition chimique et l'épaisseur ont été suivies par VASE, XPS et spectroscopie de masse d'ions secondaires à temps de vol (TOF-SIMS). Il a été montré que les couches de SiO2 et de SiN (généralement utilisées pour la protection dans l'industrie de la microélectronique) n'étaient pas stables dans le PBS et le NaCl/SVF à 37°C, même si en revanche elles offraient une bonne barrière aux gazes. L'Al2O3 a lui montré une très bonne tenu en milieu salin et une remarquable herméticité mais en revanche, il s'est corrodé rapidement dans le NaCl/SVF. Les couches de DLC, SiOC et TiO2 ont donné les meilleurs résultats de stabilité dans le PBS et le sérum de veau. Enfin, il a aussi été montré dans cette thèse que l'empilement TiO2 sur Al2O3 offrait la meilleure efficacité comme barrière hermétique et diffusive pour la protection des microsystèmes de silicium contre la corrosion dans les milieux salins.

International audience; Alpha particles detection in liquid media remains challenging since alpha particles are self-absorbed by a few micrometers of liquid. Conventional techniques consist of electrodepositing alpha emitter species on a surface and counting alpha particles using e.g. a silicon device. We have presented a novel approach associating a boron doped nanocrystalline diamond film to a silicon PIN diode alpha sensor. In our devices, actinides collection is performed using a novel method based on electroprecipitation that can be carried out in the solution itself via the use of a doped diamond electrode. The device enables to directly probe both alpha activity as well as energy in liquid solutions. This work demonstrated that the detection of alpha particles is made feasible directly in liquid media. Here we present recent progress addressing the optimization of the actinides electroprecipitation step on the diamond/silicon sensor. The approach is based on the fine tuning of the pH of the electrolyte, the nature of the supporting electrolytes Na2SO4 and NaNO3, the geome1try of the electrochemical cell, the current density value, the precipitation duration and the sensor area. The efficiency of the deposition was significantly improved with efficiency values reaching for example up to 81.5 % for the electroprecipitation of 5.96 Bq of 241Am on the diamond/silicon sensor. The diamond/silicon sensor can be reused after measurement using fast decontamination at high yields ≥ 99 %: e.g. the deposited 241Am electroprecipitated layer can be rapidly removed by applying an anodic current (+ 2 mA/cm2 for 10 minutes) to the electrode in aqueous solution. The diamond/silicon sensor shows also very high spectroscopic stability after 30 cycles of sensing with precipitation/decontamination loops. This study demonstrated that alpha particles spectroscopy measurements could be practically performed, for the first time, in media composed of aqueous solutions after electrochemical deposition process, with detections limits reaching 0.24 Bq/L. We believe this can be of very high interest for alpha spectroscopy in liquids for trace detection.

An electronic circuit for making accurate open-circuit voltage decay measurements is presented. The circuit overcomes the main limitations that occur in the standard method when used for carrier lifetime characterization because it realizes the ldquoopen-circuit conditionsrdquo of the device under test with an impedance higher than 100 MOmega and reduces the noise that is inherent in the differential operation of the method.

Targeting functional proteins to specific sites on a silicon device is essential for the development of new biosensors and supramolecular assemblies. Using intracellular lysates of several bacterial strains, we found that ribosomal protein L2 binds tightly to silicon particles, which have surfaces that are oxidized to silica. A fusion of E. coli L2 and green fluorescence protein adsorbed to the silica particles with a Kd of 0.7 nM at pH 7.5 and also adsorbed to glass slides. This fusion protein was retained on the glass slide even after washing for 24 h with a buffer containing 1 M NaCl. We mapped the silica-binding domains of E. coli L2 to amino acids 1–60 and 203–273. These two regions seemed to cooperatively mediate the strong silica-binding characteristics of L2. A fusion of L2 and firefly luciferase also adsorbed on the glass slide. This L2 silica-binding tag, which we call the “Si-tag,” can be used for one-step targeting of functional proteins on silica surfaces. Biotechnol. Bioeng. 2007;96:1023–1029. © 2006 Wiley Periodicals, Inc.

The mechanical stress induced by Shallow Trench Isolation (STI) has been characterized by using complementary techniques: 1) TCAD simulation compared with UV-μRaman data to determine the lattice misfit strain; 2) full band Monte Carlo simulation and electrical measurements to study the impact on the transport properties. For the first time, an iterative methodology emphasising the synergy among these techniques is presented. The excellent agreement with our electrical data demonstrated that our methodology is a powerful and useful tool to predict the performance of devices with a controlled stress. © 2005 IEEE.