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2. Integration of SrBi2Ta2O9 thin films for high density ferroelectric random access memory

3. Integration of ferroelectric SrBi2Ta2O9-based capacitors in 0.35μm CMOS technology

4. Spacers Alternatives for INTEGRATION OF (3D) STACKED SBT FeCAP s

5. Impact of material/process interactions on the properties of a porous CVD-O3 low-k dielectric film

8. Integration of MOCVD SBT Stacked Ferroelectric Capacitors in a 0.35 μm CMOS Technology.

11. Impact of material/process interactions on the properties of a porous CVD-O3 low-k dielectric film

12. [In vitro study of the influence of donor age, nature of mitogen and exposure to X-rays on the proliferation rate of human lymphocytes].

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