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The Photodetector Array Camera and Spectrometer (PACS) is one of the three science instruments on ESA's far infrared and submillimetre observatory. It employs two Ge:Ga photoconductor arrays (stressed and unstressed) with 16x25 pixels, each, and two filled silicon bolometer arrays with 16x32 and 32x64 pixels, respectively, to perform integral-field spectroscopy and imaging photometry in the 60-210\mu\ m wavelength regime. In photometry mode, it simultaneously images two bands, 60-85\mu\ m or 85-125\mu\m and 125-210\mu\ m, over a field of view of ~1.75'x3.5', with close to Nyquist beam sampling in each band. In spectroscopy mode, it images a field of 47"x47", resolved into 5x5 pixels, with an instantaneous spectral coverage of ~1500km/s and a spectral resolution of ~175km/s. We summarise the design of the instrument, describe observing modes, calibration, and data analysis methods, and present our current assessment of the in-orbit performance of the instrument based on the Performance Verification tests. PACS is fully operational, and the achieved performance is close to or better than the pre-launch predictions.

This paper presents a polycrystalline silicon germanium (poly-SiGe) thermopile specially designed for thermoelectric generators used on human body. Both the design of the single thermocouple and the arrangement of the thermocouple array have been described. A rim structure has been introduced in order to increase the temperature difference across the thermocouple junctions. The modeling of the thermocouple and the thermopile has been performed analytically and numerically. An output power of about 1 $\mu$W at an output voltage of more than 1 V is expected from the current design of thermopiles in a watch-size generator. The key material properties of the poly-SiGe have been measured. The thermopile has been fabricated and tested. Experimental results clearly demonstrate the advantage of the rim structure in increasing output voltage. In presence of forced convection, the output voltage of a non-released thermopile can increase from about 53 mV/K/cm2 to about 130 mV/K/cm2 after the rim structure is formed. A larger output voltage from the thermopile is expected upon process completion., Comment: Submitted on behalf of EDA Publishing Association (http://irevues.inist.fr/EDA-Publishing)

This paper presents the different processing steps of a new generic surface micromachining module for MEMS hermetic packaging at temperatures around 180 degrees C based on nickel plating and photoresist sacrificial layers. The advantages of thin film caps are the reduced thickness and area consumption and the promise of being a low-cost batch process. Moreover, sealing happens by a reflow technique, giving the freedom of choosing the pressure and atmosphere inside the cavity. Sacrificial etch holes are situated above the device allowing shorter release times compared to the state-of-the-art. With the so-called over-plating process, small etch holes can be created in the membrane without the need of expensive lithography tools. The etch holes in the membrane have been shown to be sufficiently small to block the sealing material to pass through, but still large enough to enable an efficient release., Comment: Submitted on behalf of TIMA Editions (http://irevues.inist.fr/tima-editions)