Cite
How to Respond to Process Module Failure in Residency Time-Constrained Single-Arm Cluster Tools.
MLA
Qiao, Yan, et al. “How to Respond to Process Module Failure in Residency Time-Constrained Single-Arm Cluster Tools.” IEEE Transactions on Semiconductor Manufacturing, vol. 27, no. 4, Nov. 2014, pp. 462–74. EBSCOhost, https://doi.org/10.1109/TSM.2014.2340858.
APA
Qiao, Y., Wu, N., Pan, C., & Zhou, M. (2014). How to Respond to Process Module Failure in Residency Time-Constrained Single-Arm Cluster Tools. IEEE Transactions on Semiconductor Manufacturing, 27(4), 462–474. https://doi.org/10.1109/TSM.2014.2340858
Chicago
Qiao, Yan, NaiQi Wu, ChunRong Pan, and MengChu Zhou. 2014. “How to Respond to Process Module Failure in Residency Time-Constrained Single-Arm Cluster Tools.” IEEE Transactions on Semiconductor Manufacturing 27 (4): 462–74. doi:10.1109/TSM.2014.2340858.