Cite
Corrigendum to “Junction temperature management of IGBT module in power electronic converters” [Microelectron. Reliab. 54 (2014) 2788–2795].
MLA
Zhou, Luowei, et al. “Corrigendum to ‘Junction Temperature Management of IGBT Module in Power Electronic Converters’ [Microelectron. Reliab. 54 (2014) 2788–2795].” Microelectronics Reliability, vol. 55, no. 1, Jan. 2015, p. 291. EBSCOhost, https://doi.org/10.1016/j.microrel.2014.12.003.
APA
Zhou, L., Wu, J., Sun, P., & Du, X. (2015). Corrigendum to “Junction temperature management of IGBT module in power electronic converters” [Microelectron. Reliab. 54 (2014) 2788–2795]. Microelectronics Reliability, 55(1), 291. https://doi.org/10.1016/j.microrel.2014.12.003
Chicago
Zhou, Luowei, Junke Wu, Pengju Sun, and Xiong Du. 2015. “Corrigendum to ‘Junction Temperature Management of IGBT Module in Power Electronic Converters’ [Microelectron. Reliab. 54 (2014) 2788–2795].” Microelectronics Reliability 55 (1): 291. doi:10.1016/j.microrel.2014.12.003.