Guest editorial: characterisation of crack tip fields.

Authors :: James, M. N.
Susmel, L.
Iacoviello, F.
Hong, Y.
Patterson, E. A.
Lopez‐Crespo, P.
Source :: Fatigue & Fracture of Engineering Materials & Structures. Feb2015, Vol. 38 Issue 2, p139-139. 1p.
Publication Year :: 2015
Abstract: The article focuses on the 2nd International Conference on Characterisation of Crack Tip Stress Fields held in Malaga, Spain from April 15-17, 2013. It states that fracture mechanics is used to deal with crack growth phenomena in engineering materials and discusses several modern techniques for measuring displacement, strain and stress in materials including digital image correlation, electronic speckle pattern interferometry and thermography.