Cite
Planar Power Module With Low Thermal Impedance and Low Thermomechanical Stress.
MLA
Xiao Cao, et al. “Planar Power Module With Low Thermal Impedance and Low Thermomechanical Stress.” IEEE Transactions on Components, Packaging & Manufacturing Technology, vol. 2, no. 8, Aug. 2012, pp. 1247–59. EBSCOhost, https://doi.org/10.1109/TCPMT.2012.2196799.
APA
Xiao Cao, Guo-Quan Lu, & Ngo, K. D. T. (2012). Planar Power Module With Low Thermal Impedance and Low Thermomechanical Stress. IEEE Transactions on Components, Packaging & Manufacturing Technology, 2(8), 1247–1259. https://doi.org/10.1109/TCPMT.2012.2196799
Chicago
Xiao Cao, Guo-Quan Lu, and Khai D. T. Ngo. 2012. “Planar Power Module With Low Thermal Impedance and Low Thermomechanical Stress.” IEEE Transactions on Components, Packaging & Manufacturing Technology 2 (8): 1247–59. doi:10.1109/TCPMT.2012.2196799.