Cite
Characterization of Heat Dissipation From a Microprocessor Chip Using Digital Interferometry.
MLA
Sajith, V., and C. B. P. Sobhan. “Characterization of Heat Dissipation From a Microprocessor Chip Using Digital Interferometry.” IEEE Transactions on Components, Packaging & Manufacturing Technology, vol. 2, no. 8, Aug. 2012, pp. 1298–306. EBSCOhost, https://doi.org/10.1109/TCPMT.2012.2199756.
APA
Sajith, V., & Sobhan, C. B. P. (2012). Characterization of Heat Dissipation From a Microprocessor Chip Using Digital Interferometry. IEEE Transactions on Components, Packaging & Manufacturing Technology, 2(8), 1298–1306. https://doi.org/10.1109/TCPMT.2012.2199756
Chicago
Sajith, V., and C. B. P. Sobhan. 2012. “Characterization of Heat Dissipation From a Microprocessor Chip Using Digital Interferometry.” IEEE Transactions on Components, Packaging & Manufacturing Technology 2 (8): 1298–1306. doi:10.1109/TCPMT.2012.2199756.