Cite
High-Performance and High-Data-Rate Quasi-Coaxial LTCC Vertical Interconnect Transitions for Multichip Modules and System-on-Package Applications.
MLA
Decrossas, Emmanuel, et al. “High-Performance and High-Data-Rate Quasi-Coaxial LTCC Vertical Interconnect Transitions for Multichip Modules and System-on-Package Applications.” IEEE Transactions on Components, Packaging & Manufacturing Technology, vol. 5, no. 3, Mar. 2015, pp. 307–13. EBSCOhost, https://doi.org/10.1109/TCPMT.2015.2394234.
APA
Decrossas, E., Glover, M. D., Porter, K., Cannon, T., Stegeman, T., Allen-McCormack, N., Hamilton, M. C., & Mantooth, H. A. (2015). High-Performance and High-Data-Rate Quasi-Coaxial LTCC Vertical Interconnect Transitions for Multichip Modules and System-on-Package Applications. IEEE Transactions on Components, Packaging & Manufacturing Technology, 5(3), 307–313. https://doi.org/10.1109/TCPMT.2015.2394234
Chicago
Decrossas, Emmanuel, Michael D. Glover, Kaoru Porter, Tom Cannon, Thomas Stegeman, Nicholas Allen-McCormack, Michael C. Hamilton, and H. Alan Mantooth. 2015. “High-Performance and High-Data-Rate Quasi-Coaxial LTCC Vertical Interconnect Transitions for Multichip Modules and System-on-Package Applications.” IEEE Transactions on Components, Packaging & Manufacturing Technology 5 (3): 307–13. doi:10.1109/TCPMT.2015.2394234.