Back to Search
Start Over
Improved electro-mechanical performance of gold films on polyimide without adhesion layers.
- Source :
-
Scripta Materialia . Jun2015, Vol. 102, p23-26. 4p. - Publication Year :
- 2015
-
Abstract
- Thin metal films on polymer substrates are of interest for flexible electronic applications and often utilize a thin interlayer to improve adhesion of metal films on flexible substrates. This work investigates the effect of a 10 nm Cr interlayer on the electro-mechanical properties of 50 nm Au films on polyimide substrates. Ex situ and in situ fragmentation experiments reveal the Cr interlayer causes brittle electro-mechanical behaviour, and thin Au films without an interlayer can support strains up to 15% without significantly degrading electrical conductivity. [ABSTRACT FROM AUTHOR]
- Subjects :
- *THIN films
*METALLIC films
*GOLD films
*POLYIMIDES
*ELECTRIC conductivity
*ADHESION
Subjects
Details
- Language :
- English
- ISSN :
- 13596462
- Volume :
- 102
- Database :
- Academic Search Index
- Journal :
- Scripta Materialia
- Publication Type :
- Academic Journal
- Accession number :
- 101917439
- Full Text :
- https://doi.org/10.1016/j.scriptamat.2015.02.005