Cite
Predictions and measurements of interfacial adhesion among encapsulated thin films of flexible devices.
MLA
Lee, Chang-Chun, et al. “Predictions and Measurements of Interfacial Adhesion among Encapsulated Thin Films of Flexible Devices.” Thin Solid Films, vol. 584, June 2015, pp. 154–60. EBSCOhost, https://doi.org/10.1016/j.tsf.2015.01.020.
APA
Lee, C.-C., Wei, P.-J., Chian, B.-T., Tsai, C.-H., & Dzeng, Y.-H. (2015). Predictions and measurements of interfacial adhesion among encapsulated thin films of flexible devices. Thin Solid Films, 584, 154–160. https://doi.org/10.1016/j.tsf.2015.01.020
Chicago
Lee, Chang-Chun, Pal-Jen Wei, Bow-Tsin Chian, Chia-Hao Tsai, and Yu-Hua Dzeng. 2015. “Predictions and Measurements of Interfacial Adhesion among Encapsulated Thin Films of Flexible Devices.” Thin Solid Films 584 (June): 154–60. doi:10.1016/j.tsf.2015.01.020.