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Unitive 300mm Bump Fab in Operation.
- Source :
-
Electronic News . 7/7/2003, Vol. 49 Issue 27, pN.PAG. 0p. - Publication Year :
- 2003
-
Abstract
- Announces the launch of the 300 millimeter electroplating wafer bumping line at the packaging foundry of Unitive Inc. in Taiwan. Expected monthly production of electroplated wafers; Advantages of conversion to 300 millimeter wafer production; Background of the company.
- Subjects :
- *SEMICONDUCTOR wafers
*ELECTROPLATING
*FOUNDRIES
Subjects
Details
- Language :
- English
- ISSN :
- 10616624
- Volume :
- 49
- Issue :
- 27
- Database :
- Academic Search Index
- Journal :
- Electronic News
- Publication Type :
- Periodical
- Accession number :
- 10457148