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A Submillimeter Package for Microsystems in High-Pressure and High-Salinity Downhole Environments.
- Source :
-
Journal of Microelectromechanical Systems . Aug2015, Vol. 24 Issue 4, p861-869. 9p. - Publication Year :
- 2015
-
Abstract
- This paper describes a submillimeter-scale package intended for microsystem components in high-pressure and high-salinity environments, such as downhole environments in oil wells. The outer dimensions of the package are 0.8 \times 0.8 \times 0.8 \mathrm{mm}^{3} , whereas the interior cavity is 0.4 \times 0.4 \times 0.45~\mathrm{mm}^{3}$ . The package consists of a stainless steel 17–4 PH metal can and a borosilicate glass lid, and is hermetically sealed by an Au–In bond. The measured bond strength is $\approx 13$ MPa. A component integration strategy is demonstrated: test silicon chips are assembled into a stack using a folded flexible polyimide cable that provides electrical interconnections among the chips. The packages coated with thin-film alumina by atomic layer deposition and Parylene-C survive >48 h in the American Petroleum Institute standard brine (with 8 wt% NaCl and 2 wt% CaCl2 in deionized water) at 80 °C, and subsequently, in 50-MPa ( $\approx 7250$ psi) hydraulic pressure. [2014-0108] [ABSTRACT FROM AUTHOR]
Details
- Language :
- English
- ISSN :
- 10577157
- Volume :
- 24
- Issue :
- 4
- Database :
- Academic Search Index
- Journal :
- Journal of Microelectromechanical Systems
- Publication Type :
- Academic Journal
- Accession number :
- 108714583
- Full Text :
- https://doi.org/10.1109/JMEMS.2014.2355191