Finite element modeling of a Ti based compact RF MEMS series switch design for harsh environment.

Regardless of the excellent RF characteristics that microelectromechanical switches possess in variety of high frequency applications, some of these application areas require switches that could possibly withstand harsher environments like high temperature or high thermal stresses. This paper presents the finite element modeling of a compact RF MEMS DC contact switch design based on titanium material to withstand in such conditions. The switch is designed with meanders on all sides to increase the elastic recovery forces. The proposed switch dimensions are very compact with the total surface area of 0.1 mm $$^2$$ . The modelled switch is optimized for L-band that results in high isolation of 52 dB and very low insertion loss of 0.007 dB at 2 GHz with low actuation voltage of 18.5 V. [ABSTRACT FROM AUTHOR]